XCV300E-7BG432I

The XCV300E-7BG432I is an industrial-grade Virtex®-E field programmable gate array (FPGA) in a 432-LBGA exposed-pad metal package. It delivers a mid-range integration point with 6,912 logic elements, on-chip memory, and a broad set of I/O and clock-management features intended for high-performance system logic and interface tasks.

Designed around the 1.8 V Virtex-E architecture, this device targets applications requiring high-density logic, flexible I/O standards, and robust temperature and power envelopes for industrial environments.

Key Features

• Logic Capacity — 6,912 logic elements and approximately 411,955 equivalent gates provide substantial programmable logic for complex glue logic, protocol conversion, and custom processing pipelines.
• Embedded Memory — Approximately 0.13 Mbits (131,072 bits) of on-chip RAM to support buffering, FIFOs, and small embedded data stores.
• I/O and Signaling — 316 I/O pins with Virtex-E SelectI/O+ family capabilities including support for differential signaling standards referenced in the Virtex-E family documentation.
• Clock Management — Family-level clock features include multiple digitally controlled DLLs for low-jitter clocking and DDR-friendly timing options as described for Virtex-E devices.
• Performance Characteristics — 1.8 V internal core architecture (VCCINT nominal) with family-designated internal performance characteristics.
• Package and Mounting — 432-LBGA exposed pad, metal package; supplier device package listed as 432-MBGA (40×40). Surface-mount mounting type for standard PCB assembly processes.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial applications requiring extended ambient capability.
• Power Supply — Internal supply operating range specified at 1.71 V to 1.89 V.
• Standards and Tools Support — Virtex-E family documentation references support from the Xilinx Foundation and Alliance Series development systems for design and implementation workflows.
• Compliance — RoHS compliant.

Typical Applications

• High-speed memory interface controllers: Use for interfacing to high-performance external memories and implementing memory controllers, leveraging the Virtex-E family’s support for ZBT SRAMs and DDR SDRAM interfaces.
• PCI and bus logic: Implement 3.3 V PCI-compliant system logic and bus bridges as indicated by family-level PCI support in Virtex-E documentation.
• Industrial control and automation: Deploy in industrial systems that benefit from 6,912 logic elements, on-chip RAM, and an extended −40 °C to 100 °C operating range for robust field operation.
• High-speed differential I/O systems: Implement differential signaling interfaces and clocking schemes supported by the Virtex-E family for LVDS/LVPECL-style architectures while using the device’s 316 I/Os.

Unique Advantages

• Balanced integration and capacity: 6,912 logic elements plus on-chip memory provide a practical balance of logic resources and embedded RAM for mid-density designs without external logic proliferation.
• Flexible I/O support: The Virtex-E family’s SelectI/O+ capabilities and differential signaling support enable a wide range of interface standards and clocking topologies.
• Industrial robustness: Industrial-grade temperature rating (−40 °C to 100 °C) and a metal exposed-pad package support reliable operation in harsher environments.
• Toolchain compatibility: Family-level support from established Xilinx development systems streamlines design entry, synthesis, and implementation.
• Compact, surface-mount package: 432-LBGA metal package provides a high-pin-count solution in a compact 40×40 supplier package footprint for space-constrained boards.
• Regulatory and environmental compliance: RoHS compliance helps meet regulatory requirements for lead-free manufacturing.

Why Choose XCV300E-7BG432I?

The XCV300E-7BG432I positions itself as a practical Virtex®-E FPGA option for designers needing mid-range programmable logic capacity, flexible high-speed I/O, and industrial operating margins. Its combination of 6,912 logic elements, embedded RAM, and family-proven clock and I/O technologies supports a wide variety of interface and system-control tasks while remaining compatible with established development toolchains.

This device is well suited to engineering teams building industrial controllers, memory interface IP, PCI-based logic, or differential I/O systems that require a balance of integration, temperature resilience, and established FPGA tool support.

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