XCV300E-7FG456C

IC FPGA 312 I/O 456FBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 312 131072 6912 456-BBGA

Quantity 264 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package456-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case456-BBGANumber of I/O312Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1536Number of Logic Elements/Cells6912
Number of Gates411955ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits131072

Overview of XCV300E-7FG456C – Virtex®-E 1.8 V FPGA, 6912 logic elements, 131,072-bit RAM, 312 I/O, 456‑BBGA

The XCV300E-7FG456C is an SRAM-based Virtex®-E family Field Programmable Gate Array (FPGA) offered in a 456-ball BGA package. It provides a balance of on-chip logic, embedded memory, and high pin-count I/O for applications that require flexible, reprogrammable digital logic.

Designed for commercial-grade systems, this device combines 6912 logic elements, roughly 131,072 bits of embedded memory, and 312 I/O pins with family-level features such as high-performance SelectI/O+™ technology, multiple clock-management DLLs, and PCI-compliant interface support to enable high-throughput designs.

Key Features

  • Core Logic 6912 logic elements and approximately 411,955 gates provide substantial programmable fabric for control, datapath, and glue-logic functions.
  • Embedded Memory 131,072 total RAM bits (approximately 0.125 Mbits) of on-chip memory for FIFOs, buffers, and small data stores.
  • I/O and Interface Flexibility 312 user I/Os and Virtex‑E family SelectI/O+™ technology supporting numerous high-performance interface standards, including differential signalling (LVDS, BLVDS, LVPECL).
  • Clock Management Family-level support for eight fully digital Delay-Locked Loops (DLLs) for clock multiply/divide and duty-cycle synthesis suitable for DDR and high-speed clocking.
  • Performance Virtex‑E family internal performance up to 130 MHz (four LUT levels) and PCI-compliant 3.3 V 32/64-bit operation at 33/66 MHz (family-level).
  • Power and Supply Internal supply voltage range of 1.71 V to 1.89 V (VCCINT) for the device core.
  • Package and Mounting Surface-mount 456‑BBGA package (supplier device package: 456‑FBGA, 23 × 23 mm) for high-density board integration.
  • Commercial Grade and Environment Rated for 0 °C to 85 °C operating temperature and RoHS compliant.
  • Manufacturing and Support SRAM-based in-system configuration for unlimited re-programmability and family-level tooling/support referenced in the Virtex‑E documentation; devices are 100% factory tested.

Typical Applications

  • High-speed data interfaces — Implement protocol bridges, custom serializers/deserializers, and interface logic using the device’s high-performance I/O and differential signalling support.
  • Memory controller and buffering — Use on-chip RAM and abundant logic elements for small buffering, arbitration, and glue logic when interfacing to external memories supported by Virtex‑E family features.
  • PCI-based systems — Leverage family-level PCI compliance (3.3 V, 32/64-bit, 33/66‑MHz) for integration into legacy and embedded PC architectures.
  • Signal processing and custom accelerators — Implement custom datapaths, arithmetic chains, and control logic taking advantage of dedicated carry and multiplier support in the Virtex‑E architecture.

Unique Advantages

  • Flexible I/O capability: 312 I/Os and SelectI/O+™ support a wide range of single-ended and differential standards, enabling multi-protocol designs without extensive external logic.
  • Reprogrammable platform: SRAM-based in-system configuration allows design iteration and field updates to extend product life and accelerate development cycles.
  • Integrated clocking resources: Eight digital DLLs simplify clock distribution and enable DDR-friendly timing without additional external PLL/DLL components.
  • High integration density: 6912 logic elements and ~0.125 Mbits of embedded memory reduce external component count and simplify board-level design.
  • Commercial-ready package: 456‑BBGA (23 × 23 mm) surface-mount package supports compact, high-density PCB layouts for space-constrained systems.
  • Regulatory and assembly readiness: RoHS compliance and 100% factory testing support current manufacturing and environmental requirements.

Why Choose XCV300E-7FG456C?

The XCV300E-7FG456C delivers a practical combination of programmable logic, embedded memory, and high I/O density in a commercial-grade Virtex‑E FPGA package. Its 1.8 V core supply, robust clock management resources, and broad I/O capability make it well suited for designers building high-throughput interfaces, memory controllers, and custom processing blocks that benefit from in-field reprogrammability.

This device is a fit for teams that need a proven SRAM-based FPGA platform with family-level features such as SelectI/O+™ and multiple DLLs, while maintaining control over BOM and board space through high integration and a compact 456‑BBGA package.

If you would like pricing, availability, or technical procurement information for XCV300E-7FG456C, submit a quote request or contact our sales channel for a tailored response.

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