XCV300E-7FG456C
| Part Description |
Virtex®-E Field Programmable Gate Array (FPGA) IC 312 131072 6912 456-BBGA |
|---|---|
| Quantity | 264 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 456-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 456-BBGA | Number of I/O | 312 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1536 | Number of Logic Elements/Cells | 6912 | ||
| Number of Gates | 411955 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 131072 |
Overview of XCV300E-7FG456C – Virtex®-E 1.8 V FPGA, 6912 logic elements, 131,072-bit RAM, 312 I/O, 456‑BBGA
The XCV300E-7FG456C is an SRAM-based Virtex®-E family Field Programmable Gate Array (FPGA) offered in a 456-ball BGA package. It provides a balance of on-chip logic, embedded memory, and high pin-count I/O for applications that require flexible, reprogrammable digital logic.
Designed for commercial-grade systems, this device combines 6912 logic elements, roughly 131,072 bits of embedded memory, and 312 I/O pins with family-level features such as high-performance SelectI/O+™ technology, multiple clock-management DLLs, and PCI-compliant interface support to enable high-throughput designs.
Key Features
- Core Logic 6912 logic elements and approximately 411,955 gates provide substantial programmable fabric for control, datapath, and glue-logic functions.
- Embedded Memory 131,072 total RAM bits (approximately 0.125 Mbits) of on-chip memory for FIFOs, buffers, and small data stores.
- I/O and Interface Flexibility 312 user I/Os and Virtex‑E family SelectI/O+™ technology supporting numerous high-performance interface standards, including differential signalling (LVDS, BLVDS, LVPECL).
- Clock Management Family-level support for eight fully digital Delay-Locked Loops (DLLs) for clock multiply/divide and duty-cycle synthesis suitable for DDR and high-speed clocking.
- Performance Virtex‑E family internal performance up to 130 MHz (four LUT levels) and PCI-compliant 3.3 V 32/64-bit operation at 33/66 MHz (family-level).
- Power and Supply Internal supply voltage range of 1.71 V to 1.89 V (VCCINT) for the device core.
- Package and Mounting Surface-mount 456‑BBGA package (supplier device package: 456‑FBGA, 23 × 23 mm) for high-density board integration.
- Commercial Grade and Environment Rated for 0 °C to 85 °C operating temperature and RoHS compliant.
- Manufacturing and Support SRAM-based in-system configuration for unlimited re-programmability and family-level tooling/support referenced in the Virtex‑E documentation; devices are 100% factory tested.
Typical Applications
- High-speed data interfaces — Implement protocol bridges, custom serializers/deserializers, and interface logic using the device’s high-performance I/O and differential signalling support.
- Memory controller and buffering — Use on-chip RAM and abundant logic elements for small buffering, arbitration, and glue logic when interfacing to external memories supported by Virtex‑E family features.
- PCI-based systems — Leverage family-level PCI compliance (3.3 V, 32/64-bit, 33/66‑MHz) for integration into legacy and embedded PC architectures.
- Signal processing and custom accelerators — Implement custom datapaths, arithmetic chains, and control logic taking advantage of dedicated carry and multiplier support in the Virtex‑E architecture.
Unique Advantages
- Flexible I/O capability: 312 I/Os and SelectI/O+™ support a wide range of single-ended and differential standards, enabling multi-protocol designs without extensive external logic.
- Reprogrammable platform: SRAM-based in-system configuration allows design iteration and field updates to extend product life and accelerate development cycles.
- Integrated clocking resources: Eight digital DLLs simplify clock distribution and enable DDR-friendly timing without additional external PLL/DLL components.
- High integration density: 6912 logic elements and ~0.125 Mbits of embedded memory reduce external component count and simplify board-level design.
- Commercial-ready package: 456‑BBGA (23 × 23 mm) surface-mount package supports compact, high-density PCB layouts for space-constrained systems.
- Regulatory and assembly readiness: RoHS compliance and 100% factory testing support current manufacturing and environmental requirements.
Why Choose XCV300E-7FG456C?
The XCV300E-7FG456C delivers a practical combination of programmable logic, embedded memory, and high I/O density in a commercial-grade Virtex‑E FPGA package. Its 1.8 V core supply, robust clock management resources, and broad I/O capability make it well suited for designers building high-throughput interfaces, memory controllers, and custom processing blocks that benefit from in-field reprogrammability.
This device is a fit for teams that need a proven SRAM-based FPGA platform with family-level features such as SelectI/O+™ and multiple DLLs, while maintaining control over BOM and board space through high integration and a compact 456‑BBGA package.
If you would like pricing, availability, or technical procurement information for XCV300E-7FG456C, submit a quote request or contact our sales channel for a tailored response.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








