XCV300E-7FG456C0773

The XCV300E-7FG456C0773 is a Virtex®-E field programmable gate array (FPGA) supplied in a 456-ball BGA package. It provides reconfigurable digital logic resources and on-chip memory suitable for custom digital functions and I/O-intensive designs.

With 1536 configurable logic blocks and 6,912 logic elements, 312 user I/O pins and approximately 0.13 Mbits of embedded RAM, this device targets applications that require moderate logic capacity, substantial I/O connectivity and compact surface-mount packaging.

Key Features

• Logic Resources — 1536 CLBs (configurable logic blocks) delivering 6,912 logic elements for implementing custom digital logic and control functions.
• Embedded Memory — Approximately 0.13 Mbits (131,072 bits) of on-chip RAM to support small FIFOs, state machines and buffering without external memory.
• I/O Density — 312 user I/O pins to support multi-channel interfaces, sensor arrays, and peripheral connectivity.
• Gate Count — 411,955 gates providing a metric for overall device complexity and integration capability.
• Package & Mounting — 456-ball BGA surface-mount package; supplier package listed as 456-FBGA (23×23) for compact, board-level integration.
• Power Supply — Core supply specified at 1.71 V to 1.89 V for compatibility with target system power domains.
• Operating Conditions — Commercial grade operation from 0 °C to 85 °C suitable for standard commercial environments.
• Regulatory — RoHS compliant to support lead-free assembly processes and regulatory requirements.

Typical Applications

• Interface Bridging — Use the 312 I/O pins to implement protocol conversion and signal routing between multiple peripherals or buses.
• Custom Digital Control — Implement finite-state machines, glue logic and control paths using the 1536 CLBs and 6,912 logic elements.
• Data Buffering and Small Memory Tasks — Leverage approximately 0.13 Mbits of embedded RAM for FIFOs, look-up tables and temporary data storage without external memory.
• Prototyping and Evaluation — Compact 456-ball BGA package and surface-mount mounting enable board-level prototyping and integration into development platforms.

Unique Advantages

• Balanced Logic and I/O — A combination of 6,912 logic elements and 312 I/O pins supports designs that need moderate logic capacity with substantial external connectivity.
• On-Chip Memory for Compact Designs — Approximately 0.13 Mbits of embedded RAM reduces dependence on external memory for small buffering and control tasks, simplifying BOM and layout.
• Compact BGA Footprint — 456-ball BGA (supplier package 456-FBGA 23×23) enables high-density board integration while maintaining surface-mount assembly compatibility.
• Commercial Temperature Range — Rated for 0 °C to 85 °C operation to match standard commercial electronics deployment requirements.
• RoHS Compliant — Meets lead-free assembly requirements for compliant manufacturing processes.

Why Choose XCV300E-7FG456C0773?

The XCV300E-7FG456C0773 offers a practical balance of logic capacity, I/O density and on-chip memory in a compact BGA package, making it suitable for commercial designs that require customizable digital logic and significant peripheral connectivity. Its electrical and thermal specifications provide clear bounds for integration into board-level systems.

Choose this Virtex®-E FPGA when your design requires reprogrammable logic (1536 CLBs, 6,912 logic elements), extensive I/O (312 pins) and on-chip RAM (approximately 0.13 Mbits) packaged for surface-mount assembly. The device’s specification set supports scalable prototyping and deployment with RoHS-compliant manufacturing.

Request a quote or submit a procurement inquiry to obtain pricing, availability and ordering information for the XCV300E-7FG456C0773. Our team can provide lead-time details and support for your design evaluation and production planning.