XCV300E-8FG256C

IC FPGA 176 I/O 256FBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 176 131072 6912 256-BGA

Quantity 1,777 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O176Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1536Number of Logic Elements/Cells6912
Number of Gates411955ECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits131072

Overview of XCV300E-8FG256C – Virtex®-E Field Programmable Gate Array (FPGA) IC 176 131072 6912 256-BGA

The XCV300E-8FG256C is a Virtex®-E family Field Programmable Gate Array supplied in a 256-ball BGA (256-FBGA, 17×17) package. It combines a substantial logic capacity with on-chip RAM and high I/O density to support complex digital designs in commercial applications.

As a member of the Virtex-E 1.8 V family, the device is specified for low-voltage operation (VCCINT 1.71 V to 1.89 V) and is targeted at designs requiring flexible I/O standards, on-chip memory, and high logic gate counts within a surface-mount 256-BGA footprint.

Key Features

  • Logic Capacity — 6,912 logic elements (cells) providing a programmable fabric suitable for medium-density logic integration and custom digital functions.
  • On-Chip Memory — 131,072 total RAM bits of embedded memory for buffering, low-latency storage, and local data processing.
  • I/O Density & Standards — 176 user I/O pins; Virtex-E family SelectI/O+ technology supports a wide range of high-performance interface standards and differential signaling (LVDS, BLVDS, LVPECL) as specified for the family.
  • Performance Characteristics — Virtex-E family performance parameters include up to 130 MHz internal operation (four LUT levels) and dedicated resources for arithmetic and wide functions, as documented for the series.
  • Memory & External Interfaces — Family-level SelectRAM+ memory hierarchy and support for high-performance external memory interfaces (for example, ZBT SRAM and DDR SDRAM) to facilitate cache and buffering architectures.
  • Clock Management — Built-in clock management features at the family level, including multiple digital DLLs for clock multiplication/division and duty-cycle control.
  • Package & Mounting — 256-BGA (256-FBGA, 17×17) surface-mount package for compact board integration.
  • Electrical & Environmental — VCCINT range 1.71 V to 1.89 V; commercial grade with an operating temperature range of 0 °C to 85 °C; RoHS compliant.
  • Device Scale — Approximately 411,955 equivalent gates as listed for this part, enabling substantial logic implementation in a single device.

Typical Applications

  • High-Speed Interface & Bus Bridging — Use where PCI-compliant 3.3 V, 32/64-bit, 33/66 MHz interface support and multiple high-performance I/O standards are required for bridging and protocol conversion.
  • Memory Interface & Buffering — Ideal for designs that integrate external high-speed memories (ZBT SRAM, DDR SDRAM) and need on-chip RAM plus configurable I/O to manage memory timing and bandwidth.
  • Signal Processing & Arithmetic Acceleration — Suitable for compute kernels that leverage the family’s dedicated carry logic, multiplier support, and abundant register resources for high-speed arithmetic and data-path implementations.
  • Custom Logic & Control Systems — Fits commercial embedded control and logic consolidation tasks where medium-density gate count, flexible I/O, and reprogrammability enable rapid iteration and in-system updates.

Unique Advantages

  • High Interface Density: 176 I/O pins and SelectI/O+ family support enable integration of multiple high-performance standards and differential signaling options without large external glue logic.
  • Balanced Logic and Memory: 6,912 logic elements paired with 131,072 bits of on-chip RAM deliver local storage and processing capacity, reducing the need for external buffering in many designs.
  • Low-Voltage Core Operation: 1.71 V–1.89 V internal supply reduces core power compared to higher-voltage families, supporting lower power budgets in commercial systems.
  • Compact, Surface-Mount Packaging: 256-FBGA (17×17) package provides a compact footprint for space-constrained PCBs while retaining robust I/O count.
  • Commercial-Grade Reliability: Specified operating range of 0 °C to 85 °C and RoHS compliance make the device suitable for mainstream commercial and industrial-adjacent applications.

Why Choose XCV300E-8FG256C?

The XCV300E-8FG256C positions itself as a versatile Virtex-E series FPGA option for commercial designs that need a balance of logic density, embedded memory, and flexible I/O in a compact 256-BGA package. Its family-provided features—such as strong clock management, differential signaling support, and SelectRAM+ memory architecture—make it suitable for projects involving high-speed interfaces, memory subsystems, and arithmetic-intensive tasks.

This device is well suited to engineering teams seeking a reprogrammable, commercially graded FPGA with substantial on-chip resources and a proven series feature set, enabling scalable designs and in-system configurability while simplifying board-level integration.

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