XCV300E-8FG456C

The XCV300E-8FG456C is a Virtex®-E 1.8 V Field Programmable Gate Array in a 456-ball BGA package. It provides 6,912 logic elements, 131,072 bits of on-chip RAM (approximately 0.13 Mbits), and 312 user I/Os in a surface-mount 456-FBGA (23×23) package for commercial-grade applications.

Engineered for high-density, reprogrammable digital logic, this FPGA is suitable for designs requiring flexible I/O standards, on-chip memory, and clock-management features while operating within a 1.71 V to 1.89 V core supply range and a 0 °C to 85 °C operating temperature range.

Key Features

• Core Capacity and Logic: 6,912 logic elements and 411,955 equivalent gates provide substantial programmable logic for complex digital functions.
• Embedded Memory: Total on-chip RAM of 131,072 bits (approximately 0.13 Mbits) supports distributed and block memory requirements within designs.
• I/O Density and Flexibility: 312 I/O pins with SelectI/O capabilities support multiple high-performance interface standards and differential signalling options.
• High-Speed Interfaces: Family-level support for LVDS, BLVDS, and LVPECL differential signalling and PCI-compliant 3.3 V, 32/64-bit operation (datasheet series features).
• Clock Management: On-chip delay-locked loop (DLL) resources and digitally synthesized duty-cycle control enable precise clocking and DDR timing strategies (per Virtex‑E series specification).
• Configuration and Reprogrammability: SRAM-based in-system configuration provides unlimited re-programmability for iterative development and field updates.
• Packaging and Mounting: Surface-mount 456-ball FBGA (23×23) package supports compact board footprints and high pin-count routing.
• Power and Environment: Core supply range 1.71 V–1.89 V and commercial operating temperature of 0 °C–85 °C; RoHS compliant.

Typical Applications

• High-performance digital processing: Implement complex custom logic, datapaths, and arithmetic functions using the device's logic elements and dedicated carry/multiplier resources.
• High-speed interfaces and bridging: Leverage flexible SelectI/O and differential signalling support for protocol bridging, PCI-related designs, and source-synchronous interfaces.
• Embedded system prototyping and in-system reconfiguration: Use SRAM-based programming to iterate firmware and hardware functions during development and field upgrades.
• Memory interface buffering and control: On-chip RAM and high-bandwidth memory support (series-level features) make it suitable for designs requiring tight memory integration and external memory interfacing.

Unique Advantages

• High logic and I/O count: 6,912 logic elements and 312 I/Os enable dense implementations without immediate need for external glue logic.
• Flexible I/O standards: Support for multiple differential and single-ended signalling standards at the series level allows broad interface compatibility.
• On-board memory resources: Approximately 0.13 Mbits of embedded RAM reduce external memory dependence for many control and buffering tasks.
• Reprogrammable architecture: SRAM-based configuration permits design updates and field-level feature changes without hardware replacement.
• Compact, high-density packaging: 456-ball FBGA (23×23) offers a small PCB footprint while delivering a high pin count for complex designs.
• Commercial-grade and RoHS compliant: Suited for standard commercial applications with environmental compliance for lead-free manufacturing.

Why Choose XCV300E-8FG456C?

The XCV300E-8FG456C combines substantial programmable logic, flexible I/O, and on-chip memory in a compact 456-BBGA package, making it well suited to high-density commercial designs that require reprogrammability and diverse interface support. Its 1.8 V core operation and commercial temperature rating align with many standard embedded and communications applications.

Designers seeking a configurable platform with a broad set of series-level features—such as differential signalling support, clock management primitives, and SRAM-based in-system configuration—will find this FPGA delivers integration and adaptability for iterative development and deployment.

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