XCV3200E-7CG1156C

The XCV3200E-7CG1156C is an AMD Virtex®-E field programmable gate array (FPGA) supplied in a 1156-BCBGA package. It provides a high logic capacity platform with a substantial number of I/O pins and on-chip memory targeted at commercial embedded applications requiring dense programmable logic and connectivity.

Key architectural characteristics include 73,008 logic elements, approximately 0.85 Mbits of embedded memory, and 804 I/Os, with a support voltage range of 1.71 V to 1.89 V and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  73,008 logic elements provide a large fabric for implementing complex combinational and sequential logic designs.
• Embedded Memory  Approximately 0.85 Mbits of on-chip RAM to support buffering, state storage, and data handling within logic designs.
• I/O Density  804 I/O pins enable extensive external interfacing for multi-channel systems, high-pin-count peripherals, and complex board-level connectivity.
• Gate Equivalent  4,074,387 gates indicate the equivalent transistor-level complexity available for integration in designs.
• Package and Mounting  1156-BCBGA (supplier device package: 1156-CBGA, 35×35) package with surface-mount mounting for compact board integration.
• Power and Temperature  Supported supply voltage range of 1.71 V to 1.89 V and a commercial operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High-density interface systems  Use the 804 I/Os to implement boards that require many external connections, parallel interfaces, or multiple transceiver channels.
• Memory-centric logic  Leverage approximately 0.85 Mbits of embedded RAM for buffering, packet processing, or data staging within FPGA logic.
• Complex digital processing  Deploy the 73,008 logic elements and 4,074,387 gate equivalent capacity for sizable state machines, protocol handling, and custom datapaths.

Unique Advantages

• High logic density: 73,008 logic elements enable implementation of large, integrated digital subsystems on a single device.
• Significant on-chip memory: Approximately 0.85 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs.
• Extensive I/O count: 804 I/Os offer flexibility for connecting a wide variety of peripherals and buses without external multiplexing.
• Compact, surface-mount package: 1156-BCBGA (1156-CBGA, 35×35) supports high-density board layouts while maintaining a stable mechanical footprint.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to match standard commercial embedded deployments.
• RoHS compliant: Conforms to RoHS requirements for environmentally conscious designs.

Why Choose XCV3200E-7CG1156C?

The XCV3200E-7CG1156C balances large logic capacity, on-chip memory, and very high I/O density to meet the needs of commercial embedded designs that require substantial programmable resources and connectivity. Its 1156-BCBGA package and surface-mount form factor make it suitable for compact board-level implementations.

This device is appropriate for design teams who require a single FPGA solution combining significant logic, embedded RAM, and extensive external interfacing within a commercial temperature range, delivering a stable platform for medium- to high-complexity programmable logic applications.

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