XCV400-4BG560C

IC FPGA 404 I/O 560MBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 404 81920 10800 560-LBGA Exposed Pad, Metal

Quantity 875 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package560-MBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case560-LBGA Exposed Pad, MetalNumber of I/O404Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2400Number of Logic Elements/Cells10800
Number of Gates468252ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits81920

Overview of XCV400-4BG560C – Virtex® Field Programmable Gate Array (FPGA) IC, 10,800 logic elements, 81,920 bits RAM, 404 I/O, 560-LBGA

The XCV400-4BG560C is a Virtex® SRAM-based Field Programmable Gate Array optimized for high-performance, reprogrammable digital logic. It combines a dense logic array, on-chip block RAM, and a rich I/O complement in a 560-ball LBGA package for surface-mount designs.

Designed for applications that require flexible, high-speed programmable logic—including system prototyping, PCI-based and Compact PCI systems, and designs needing in-system reconfiguration—this device delivers a balance of capacity, I/O density, and board-level integration for commercial-grade products.

Key Features

  • Logic Capacity — 10,800 logic elements (configurable CLB array) and approximately 468,252 system gates to implement complex digital functions.
  • Embedded Memory — 81,920 bits of on-chip RAM (block RAM and LUT-configurable memory) for data buffering, FIFOs, and small embedded data structures.
  • I/O Density — 404 user I/O pins to support wide parallel interfaces and multiple high-pin-count peripherals.
  • Clock Management — Four dedicated delay-locked loops (DLLs) plus multiple global and local clock nets for advanced clock control and low-skew distribution (as described in the Virtex family specification).
  • High-speed System Support — Family-level capabilities include system performance up to 200 MHz and 66-MHz PCI compliance, with hot-swap support for Compact PCI configurations (as described in the Virtex series documentation).
  • Packaging & Mounting — 560-LBGA exposed pad, metal package (560-MBGA footprint, 42.5 × 42.5 mm); surface-mount mounting type for modern PCB assembly.
  • Power & Operating Conditions — Core supply specified from 2.375 V to 2.625 V; commercial-grade operating temperature range from 0 °C to 85 °C.
  • SRAM-based, In-system Configuration — SRAM configuration architecture enables unlimited re-programmability and multiple programming modes for iterative development and field updates (Virtex family feature).
  • Standards & Testing — 100% factory tested and compliant with RoHS environmental requirements.

Typical Applications

  • PCI and Compact PCI Systems — Implements custom logic, bridges, and interface controllers for 66-MHz PCI-compliant designs and hot-swappable Compact PCI boards.
  • Prototyping and In-System Reconfiguration — Ideal for iterative development where unlimited re-programmability and multiple configuration modes shorten development cycles.
  • High-density Logic Integration — Suited for designs requiring dense combinational and sequential logic plus embedded memory for control, signal processing, or glue-logic tasks.

Unique Advantages

  • High integration density: 10,800 logic elements and 81,920 bits of embedded RAM reduce external component count and simplify board-level design.
  • Rich I/O capability: 404 I/O pins support wide parallel interfaces and flexible system connectivity without multiple external adapters.
  • Flexible clocking: Dedicated DLLs and multi-tier clock distribution enable precise timing control for synchronized, high-performance designs.
  • Re-programmable architecture: SRAM-based configuration allows in-system updates and iterative design refinement without hardware changes.
  • Commercial-grade readiness: Specified operating range of 0 °C to 85 °C and RoHS compliance for standard commercial applications.

Why Choose XCV400-4BG560C?

The XCV400-4BG560C positions itself as a flexible, reprogrammable logic building block for commercial embedded systems that need substantial logic capacity, abundant I/O, and on-chip memory. Its Virtex family architecture and SRAM-based configuration model make it well suited for development environments, PCI-class systems, and applications where in-field reconfiguration and rapid iteration are important.

Choosing this device provides designers with a tested, RoHS-compliant FPGA option in a compact 560-LBGA package, backed by the documented capabilities of the Virtex series for clock management, memory hierarchy, and system-level interfacing.

Request a quote or submit a procurement inquiry to receive pricing, availability, and ordering information for the XCV400-4BG560C.

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