XCV400-4FG676C

The XCV400-4FG676C is a Virtex® SRAM-based field programmable gate array offering 10,800 logic cells and approximately 468,252 system gates in a 676-ball BGA package. Built for high-capacity programmable logic designs, this device combines a dense CLB array with on-chip memory and flexible I/O to address demanding digital, interface and prototyping applications.

Designed with on-chip clock management, multi-standard I/O and in-system reprogrammability, the device targets systems where performance, integration and design flexibility are required within a commercial-temperature, RoHS-compliant package.

Key Features

• Configurable Logic Resources — 2,400 configurable logic blocks (CLBs) providing 10,800 logic cells to implement complex custom logic and control functions.
• Gate Density — Approximately 468,252 system gates to support high-capacity designs and integration of multiple subsystems on a single device.
• Embedded Memory — Approximately 81,920 bits of on-chip RAM for LUT-based RAM and block RAM configurations to support buffering, FIFOs and small data stores.
• Rich I/O — 404 user I/O pins for broad interface connectivity and system integration.
• Clock Management — Built-in clock-management circuitry including dedicated delay-locked loops (DLLs) and multiple global/local clock nets for advanced timing control (series-level feature).
• Multi-standard SelectIO — Support for multiple high-performance interface standards and direct connection to external ZBT RAM devices (series-level feature).
• In-system Configuration — SRAM-based architecture with unlimited re-programmability and multiple programming modes for development and field updates (series-level feature).
• Package & Assembly — 676-BGA surface-mount package; supplier device package 676-FBGA (27×27) for high-density board placement.
• Power & Temperature — Voltage supply range 2.375 V to 2.625 V; commercial operating temperature range 0 °C to 85 °C.
• Compliance & Test — RoHS-compliant and 100% factory tested (series-level feature).

Typical Applications

• PCI and Compact PCI systems — Family-level PCI compliance and hot-swap support enable use on PCI/Compact PCI cards and mezzanines requiring reconfigurable logic.
• High-performance interface bridging — Extensive I/O and SelectIO support suit protocol conversion, memory interfacing and glue-logic between high-speed subsystems.
• DSP and arithmetic engines — Dedicated carry and multiplier support at the architecture level makes the device suitable for arithmetic-heavy custom blocks and signal processing pipelines.
• Prototyping and gate-array replacement — SRAM-based in-system configuration and large gate density provide a flexible platform for prototyping and replacing mask-programmed gate arrays.

Unique Advantages

• High integration density: 10,800 logic cells and ~468k gates reduce board-level component count by consolidating logic into a single FPGA.
• Flexible memory options: On-chip RAM resources allow LUT-based RAM and block RAM configurations for diverse buffering and storage needs.
• Advanced clock control: Dedicated DLLs and multiple clock nets simplify clock-tree design and help maintain timing across complex logic domains.
• Broad I/O capability: 404 I/O pins and multi-standard SelectIO facilitate direct interfacing to a wide range of external devices and memory.
• Reprogrammable development flow: SRAM-based configuration with multiple programming modes accelerates development cycles and field updates.
• Production-ready packaging: 676-FBGA (27×27) package and surface-mount mounting support compact, high-density PCB layouts.

Why Choose XCV400-4FG676C?

The XCV400-4FG676C positions itself as a high-capacity, reprogrammable logic device for designers who need substantial gate counts, abundant logic cells and on-chip RAM within a commercial-temperature, RoHS-compliant BGA package. Its combination of multi-standard I/O, clock-management features and programmable memory supports complex system designs while enabling iterative development and in-field updates.

Supported by the Virtex family development ecosystem and factory-tested production, this device is suited to engineering teams building PCI/Compact PCI modules, interface bridges, DSP subsystems or prototypes that require scalable logic resources and flexible configuration options.

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