XCV400-4BG432I

IC FPGA 316 I/O 432MBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 316 81920 10800 432-LBGA Exposed Pad, Metal

Quantity 296 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package432-MBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case432-LBGA Exposed Pad, MetalNumber of I/O316Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2400Number of Logic Elements/Cells10800
Number of Gates468252ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits81920

Overview of XCV400-4BG432I – Virtex Field Programmable Gate Array (FPGA) IC, 316 I/O, 432-LBGA

The XCV400-4BG432I is an SRAM-based Virtex FPGA offering a high-density, reprogrammable logic fabric for demanding embedded and system-level designs. It integrates approximately 10,800 logic elements and 468,252 gates with approximately 81,920 bits of on-chip RAM to support complex digital functions.

Designed for industrial applications, the device provides multi-standard I/O flexibility, on-chip clock management, and in-system reprogrammability suitable for communications, industrial control, Compact PCI and other high-performance programmable-logic applications.

Key Features

  • Logic Capacity – Approximately 10,800 logic elements (10,800 logic cells) and 468,252 gates to implement medium-to-large digital designs.
  • Embedded Memory – Approximately 81,920 bits of on-chip RAM for data buffering, state storage, and small local memory structures.
  • I/O – 316 user I/O pins with multi-standard SelectIO interfaces supporting a variety of high-performance signaling standards.
  • Clocking and Timing – Four dedicated delay-locked loops (DLLs) plus multiple global and local clock distribution nets for advanced clock control and low-skew distribution.
  • Performance – System performance up to 200 MHz and 66-MHz PCI compliance as documented in the product specification.
  • Configuration and Reprogrammability – SRAM-based in-system configuration with unlimited reprogramming and multiple programming modes for iterative development and field updates.
  • Package and Mounting – 432-LBGA exposed pad, metal package (supplier package: 432-MBGA 40×40) optimized for surface-mount assembly.
  • Power and Voltage – Single supply operation with a specified voltage range of 2.375 V to 2.625 V.
  • Temperature and Grade – Industrial grade device rated for operation from −40 °C to 100 °C.
  • Quality and Process – 0.22 μm, 5-layer-metal CMOS process and 100% factory tested as documented in the product materials.
  • Regulatory – RoHS compliant.

Typical Applications

  • High-performance communications – Use the device’s multi-standard SelectIO interfaces and on-chip clocking to implement protocol bridging, packet processing, and interface logic.
  • Compact PCI and PCI-based systems – The device is documented as 66‑MHz PCI compliant and supports hot-swappable Compact PCI applications.
  • Industrial control and automation – Industrial-grade temperature range and flexible I/O make the FPGA suitable for motor control, motion coordination, and machine-automation logic.
  • In-system prototyping and iterative development – SRAM-based configuration with multiple programming modes enables rapid design iterations and field updates.

Unique Advantages

  • Substantial logic integration: Approximately 10,800 logic elements and 468,252 gates let you consolidate complex functions into a single device, reducing system BOM and board area.
  • Flexible embedded memory: Approximately 81,920 bits of RAM plus LUT-configurable memory options support diverse buffering and state storage needs without external RAM.
  • Robust I/O and interface support: 316 I/O pins with multi-standard SelectIO capability enable direct interfacing to a wide range of peripherals and transceivers.
  • Deterministic clocking: Four DLLs and multiple global/local clock networks facilitate precise timing control for synchronous designs.
  • Development and reconfiguration workflow: SRAM-based in-system programmability with four programming modes supports iterative development and field-level updates.
  • Industrial readiness: Industrial operating temperature range (−40 °C to 100 °C), metal LBGA package, and RoHS compliance support deployment in rugged environments.

Why Choose XCV400-4BG432I?

The XCV400-4BG432I combines significant logic and memory resources with flexible I/O and advanced clocking to address medium-to-high complexity FPGA designs. Its SRAM-based architecture and multiple programming modes enable development agility and field reconfiguration, while documented PCI compliance and Compact PCI hot-swap support make it suitable for certain communications and system applications.

Backed by the Virtex family’s documented design ecosystem and factory-tested manufacturing, this device is positioned for teams needing a reliable, reprogrammable logic platform with industrial-grade temperature capability and a compact 432-LBGA footprint.

Request a quote or submit an inquiry to receive pricing and availability information for the XCV400-4BG432I.

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