XCV300E-8PQ240C
| Part Description |
Virtex®-E Field Programmable Gate Array (FPGA) IC 158 131072 6912 240-BFQFP |
|---|---|
| Quantity | 952 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP | Number of I/O | 158 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1536 | Number of Logic Elements/Cells | 6912 | ||
| Number of Gates | 411955 | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 131072 |
Overview of XCV300E-8PQ240C – Virtex®-E FPGA IC, 158 I/O, ~0.13 Mbits RAM, 6912 logic elements, 240-BFQFP
The XCV300E-8PQ240C is a Virtex®-E series field programmable gate array (FPGA) in a 240-BFQFP surface-mount package. It provides 6,912 logic elements, approximately 0.13 Mbits of embedded RAM, and 158 I/O pins, making it suitable for commercial embedded and interface applications that require moderate gate density and flexible I/O.
Designed around the Virtex‑E 1.8 V architecture, the device targets designs needing a balance of logic capacity, on-chip memory, and diverse I/O support while operating within a commercial temperature range.
Key Features
- Core Logic — 6,912 logic elements and an effective gate count of 411,955 provide the programmable fabric for custom logic and control functions.
- Embedded Memory — Approximately 0.13 Mbits of on-chip RAM for buffering, small lookup tables, and temporary storage directly inside the FPGA.
- I/O and Interface Capability — 158 user I/Os available in the 240-BFQFP package support a variety of board-level interfaces and signaling options.
- Clocking and Timing — Virtex‑E series features such as fully digital delay-locked loops (DLLs) and support for high-speed clocks (as specified for the series) provide deterministic clock management for synchronous designs.
- Power and Supply — Core supply range specified at 1.71 V to 1.89 V (nominal 1.8 V), enabling integration into 1.8 V power domains.
- Package and Mounting — Supplied in a 240-BFQFP (supplier package listed as 240-PQFP, 32×32) surface-mount package for standard PCB assembly processes.
- Commercial Grade and Temperature — Rated for commercial operation from 0 °C to 85 °C and RoHS compliant for environmental compliance.
Typical Applications
- Embedded System Control — Implement glue logic, protocol handling, and custom peripherals where moderate logic density and on-chip RAM are required.
- High‑Speed I/O Bridging — Use the available 158 I/Os to bridge or translate between board-level interfaces and subsystems.
- Memory Interface Prototyping — On-chip RAM and series-level support for external memory interfaces enable development of memory controllers and buffering logic.
- Data Acquisition and Processing — Deploy the FPGA fabric for real‑time data capture, aggregation, and preprocessing before passing data to downstream systems.
Unique Advantages
- Balanced Logic and Memory: 6,912 logic elements paired with approximately 0.13 Mbits of embedded RAM make the device well suited for designs that need moderate compute with local buffering.
- Robust I/O Count: 158 I/Os in a compact 240‑pin BFQFP package allow dense connectivity for mixed-signal and digital peripherals without moving to a larger BGA package.
- 1.8 V Core Supply: A defined core voltage range (1.71–1.89 V) simplifies power supply planning for boards using 1.8 V domains.
- Commercial Temperature Range: Rated 0 °C to 85 °C for typical commercial deployments and RoHS compliance for environmental standards.
- Proven Series Architecture: Built on the Virtex‑E family architecture, benefiting from series-level features such as high-speed clocking and a flexible memory hierarchy documented in the series specification.
Why Choose XCV300E-8PQ240C?
The XCV300E-8PQ240C offers a practical combination of logic density, embedded memory, and a high I/O count in a 240‑pin surface-mount package, making it a solid choice for commercial embedded designs, interface bridging, and prototyping tasks. Its 1.8 V core supply and Virtex‑E series clocking and memory features provide a reliable platform for synchronous designs requiring deterministic timing and on-chip storage.
For teams seeking a well-documented, commercially rated FPGA with moderate gate count and diverse I/O capability, the XCV300E-8PQ240C delivers a balanced solution that supports scalable development within the Virtex‑E ecosystem.
Request a quote for the XCV300E-8PQ240C to get pricing and availability information or to initiate a procurement request.

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