XCV3200E-6CG1156C

The XCV3200E-6CG1156C is an AMD Virtex®-E Field Programmable Gate Array (FPGA) supplied in a 1156-BCBGA package. It delivers high logic capacity and extensive I/O resources for designs that require dense programmable logic and flexible interfacing.

Key on-chip resources include tens of thousands of logic elements, approximately 0.85 Mbits of embedded memory, and a wide operating voltage range, making it suitable for commercial embedded and system integration projects within its specified temperature range.

Key Features

• Core logic  Approximately 73,008 logic elements implemented across 16,224 CLBs to support complex, high-density logic designs.
• Embedded memory  Approximately 0.85 Mbits of on-chip RAM (851,968 bits) for local data buffering and fast on-chip storage.
• I/O capacity  804 user I/O pins to enable extensive peripheral and bus connectivity directly from the FPGA fabric.
• Gate-equivalent scale  Approximately 4,074,387 gates providing a measure of the device’s overall logic capability.
• Power and supply  Specified core voltage range of 1.71 V to 1.89 V for compatibility with appropriate system power domains.
• Package and mounting  1156-BCBGA (supplier package: 1156-CBGA, 35×35) in a surface-mount format to support compact PCB layouts.
• Commercial operating range  Rated for operation from 0 °C to 85 °C and classified as commercial grade.
• Environmental compliance  RoHS compliant for reduced hazardous substance content.

Typical Applications

• High-density programmable logic  Implements complex custom logic and control functions where large numbers of logic elements are required.
• Interface bridging and I/O aggregation  Leverages the 804 I/O pins to connect and translate between multiple buses and peripherals on a single device.
• Embedded system integration  Combines logic, memory, and I/O to consolidate functions in compact commercial embedded products.
• Prototyping and development  Provides a feature-rich platform for validating and iterating on dense digital designs before production.

Unique Advantages

• High logic density: The large number of logic elements supports sophisticated and highly parallel designs without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 0.85 Mbits of embedded RAM reduces reliance on external memory for many buffering and scratchpad needs.
• Extensive I/O resources: 804 I/O pins enable direct connections to a wide range of external interfaces, simplifying board-level routing and integration.
• Compact BGA footprint: The 1156-BCBGA (35×35) package enables a high-pin-count solution in a space-efficient surface-mount form factor.
• Commercial temperature rating: Specified 0 °C to 85 °C operation aligns with standard commercial embedded and system applications.
• Regulatory readiness: RoHS compliance supports environmentally conscious design and manufacturing practices.

Why Choose XCV3200E-6CG1156C?

The XCV3200E-6CG1156C positions itself as a high-capacity Virtex®-E FPGA option for commercial designs that require substantial programmable logic, abundant I/O, and on-chip memory within a compact BGA package. Its combination of logic elements, embedded RAM, and I/O count makes it well-suited to consolidate multiple functions and reduce external component count in complex systems.

Designed for engineers and procurement teams targeting commercial embedded and system-integration projects, this device offers a balance of integration and scalability while adhering to RoHS environmental requirements.

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