XCV400-4BG560I

The XCV400-4BG560I is an SRAM-based Virtex field programmable gate array (FPGA) optimized for high-capacity, high-performance programmable logic designs. This industrial-grade device integrates 10,800 logic cells across 2,400 CLBs with 81,920 bits of embedded RAM and 404 user I/O, delivering a versatile platform for complex system designs that require reprogrammability and flexible I/O.

Its architecture combines dedicated arithmetic resources, hierarchical on-chip memory, multi-standard I/O support and advanced clock-management features to address applications where configurable logic density, deterministic timing and broad interfacing are required.

Key Features

• Core Capacity — 10,800 logic cells across 2,400 CLBs and approximately 468,252 system gates provide substantial programmable logic for medium-to-high complexity designs.
• Embedded Memory — 81,920 total RAM bits (approximately 0.082 Mbits) for LUT-configurable RAM, dual-ported RAM and shift-register implementations.
• I/O and Interface Flexibility — 404 user I/O pins and multi-standard SelectIO support (16 interface standards) for broad external memory and peripheral interfacing.
• Clock Management — Four dedicated delay-locked loops (DLLs) with four primary low-skew global clock distribution nets and 24 secondary local clock nets for refined timing control.
• Arithmetic and Logic Resources — Dedicated carry logic and multiplier support for high-speed arithmetic and wide-input functions.
• Configuration and Test — SRAM-based in-system configuration with multiple programming modes and IEEE 1149.1 boundary-scan for manufacturing and testability.
• Performance and System Compatibility — Series-level capabilities include system performance up to 200 MHz, 66-MHz PCI compliance, and hot-swappable support for Compact PCI systems.
• Package and Thermal — 560-LBGA exposed pad, metal package (560-MBGA, 42.5×42.5); surface-mount mounting. Voltage supply range: 2.375 V to 2.625 V. Operating temperature: −40 °C to 100 °C.
• Manufacturing and Reliability — Built on a 0.22 µm, 5-layer-metal process and 100% factory tested; RoHS compliant.

Typical Applications

• PCI/Compact PCI System Interfaces — Implement custom bridging, protocol adaptation and hot-swappable designs leveraging the device’s PCI compliance and extensive I/O resources.
• High-Speed Data Processing — Use on-chip logic, dedicated arithmetic resources and predictable clocking to implement packet processing, filtering, or real-time data manipulation.
• Embedded and Industrial Control — Industrial-grade operating range and flexible I/O make the device suitable for control logic, motor/servo interfaces and sensor aggregation in industrial systems.
• FPGA-Based Prototyping — Reprogrammability and abundant routing resources support hardware prototyping and iterative design development.

Unique Advantages

• High Integrable Logic — Tens of thousands of logic elements and dedicated arithmetic units reduce external ASIC or discrete logic requirements.
• Flexible I/O Standards — Multi-standard SelectIO enables direct connection to a wide variety of memories and peripherals, simplifying board-level design.
• Deterministic Clocking — Multiple DLLs and hierarchical clock distribution help deliver stable timing for synchronous designs.
• On-Board Memory Options — Configurable LUT-based RAM and block RAM provide designers with flexible embedded storage for buffering and state machines.
• Industrial Qualification — Specified operating range from −40 °C to 100 °C and surface-mount 560-LBGA packaging support deployment in industrial environments.
• Reprogrammability and Test Support — SRAM-based configuration with multiple programming modes and boundary-scan support improves development turnaround and manufacturability.

Why Choose XCV400-4BG560I?

The XCV400-4BG560I positions itself as a robust, reprogrammable logic platform combining substantial logic density, flexible I/O and embedded memory with advanced clocking and arithmetic support. It is well suited for designers who need deterministic timing, broad interfacing and in-system reconfiguration in industrial-temperature applications.

Backed by the Virtex architecture and established FPGA development tools, this device offers a scalable solution for prototyping, system integration and production deployments where performance, integration and manufacturability are priorities.

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