XCV300-6PQ240C
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 166 65536 6912 240-BFQFP |
|---|---|
| Quantity | 131 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP | Number of I/O | 166 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1536 | Number of Logic Elements/Cells | 6912 | ||
| Number of Gates | 322970 | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of XCV300-6PQ240C – Virtex® Field Programmable Gate Array (FPGA) IC, 6,912 logic elements, 65,536-bit RAM, 240‑BFQFP
The XCV300-6PQ240C is a Virtex® series Field Programmable Gate Array (FPGA) integrated circuit offered by AMD. It provides a flexible, SRAM-based programmable-logic fabric suitable for performance-oriented embedded designs and board-level integration.
Built for high-density logic and on-chip memory utilization, this commercial-grade device is supplied in a 240‑pin BFQFP package, supports a core supply range of 2.375 V to 2.625 V, and operates across a 0 °C to 85 °C ambient temperature range.
Key Features
- Logic Capacity Approximately 6,912 logic elements and around 322,970 system gates to implement medium-complexity digital logic and control functions.
- Embedded Memory Approximately 65,536 bits of on-chip RAM (about 0.064 Mbits) for LUT-configurable RAM, SelectRAM-style blocks, and small data buffering needs.
- I/O and Package 166 user I/O pins in a 240‑BFQFP surface-mount package (supplier package: 240‑PQFP, 32×32 mm) for board-level connectivity and signal routing.
- Clock Management Integrated clock-management resources including multiple dedicated delay-locked loops (DLLs) and multi-tier clock distribution for controlled clocking and low-skew routing.
- Interface Support Series-level features include multi-standard SelectIO interfaces and support for common bus standards—suitable for PCI-class performance and Compact PCI hot-swap environments as described in the series specification.
- Configuration and Re-programmability SRAM-based in-system configuration enables unlimited re-programmability and multiple programming modes for development and field updates.
- Electrical and Thermal Voltage supply range: 2.375 V to 2.625 V; commercial operating temperature: 0 °C to 85 °C; surface-mount package for standard PCB assembly.
- Environmental Compliance RoHS compliant.
Typical Applications
- PCI and Compact PCI systems Leverage the series’ PCI compliance and hot-swap support for board-level interface logic and bridge functions in PCI-based equipment.
- Embedded control and signal processing Use the device’s logic density and on-chip RAM for custom control, finite-state machines, and moderate data buffering in embedded products.
- Prototype and in-system reconfigurable designs SRAM-based configuration and re-programmability make the device suitable for iterative development, algorithm validation, and reconfigurable prototypes.
Unique Advantages
- Balanced logic and memory mix: 6,912 logic elements combined with 65,536 bits of embedded RAM provide a practical balance for control-dominant and mixed logic designs.
- Board-ready package: 240‑BFQFP surface-mount package (32×32 PQFP outline) simplifies PCB design and assembly for through-life manufacturing.
- Flexible clocking: Integrated DLLs and hierarchical clock nets offer designers more control over timing and clock distribution without external PLLs.
- Commercial-grade suitability: Specified for 0 °C to 85 °C operation and a narrow core supply range, appropriate for standard commercial electronic products.
- RoHS compliant: Manages regulatory requirements for lead-free assemblies and environmentally conscious manufacturing.
Why Choose XCV300-6PQ240C?
The XCV300-6PQ240C positions itself as a flexible, re-programmable FPGA option for designers needing moderate logic capacity, integrated on‑chip RAM, and dependable clocking resources in a compact surface-mount package. Its combination of roughly 6,912 logic elements, 65,536 bits of embedded memory, and 166 I/O pins supports a variety of board-level functions from interface bridging to embedded control.
This commercial-grade device is well suited to development teams and OEMs building PCI-class boards, compact system controllers, or prototypes that require in-system re-configurability and established FPGA series-level features. The device’s supply and thermal specifications, plus RoHS compliance, support reliable integration into standard commercial product workflows.
If you would like pricing, availability, or to request a quote for the XCV300-6PQ240C, please submit a quote request or contact sales through your usual procurement channel.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








