XCV300-5PQ240I

IC FPGA 166 I/O 240QFP
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 166 65536 6912 240-BFQFP

Quantity 870 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case240-BFQFPNumber of I/O166Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1536Number of Logic Elements/Cells6912
Number of Gates322970ECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of XCV300-5PQ240I – Virtex FPGA, 166 I/O, 65,536-bit RAM, 240-BFQFP

The XCV300-5PQ240I is an AMD Virtex® SRAM-based Field Programmable Gate Array (FPGA) providing mid-range programmable logic capacity and extensive on-chip resources. With 6,912 logic elements, approximately 65,536 bits of embedded RAM and 166 user I/Os in a 240-BFQFP package, it targets high-performance, reconfigurable digital systems where field programmability and interface flexibility are required.

Architected for high-speed, high-density applications, the device includes built-in clock-management circuitry, multi-standard I/O support and hierarchical memory options, enabling designers to implement complex custom logic and interface functions with in-system reprogrammability.

Key Features

  • Logic Capacity — 6,912 logic elements and approximately 322,970 system gates provide a mid-range programmable fabric for custom logic implementations.
  • Embedded Memory — Approximately 65,536 bits of on-chip RAM, with LUTs configurable as a variety of RAM types (including 16-bit and 32-bit RAM, dual-ported RAM and shift-register configurations).
  • I/O and Interface Support — 166 user I/Os with Multi-standard SelectIO™ interfaces supporting 16 high-performance interface standards for flexible board-level connectivity.
  • Clock Management — Four dedicated delay-locked loops (DLLs) plus four primary low-skew global clock nets and 24 secondary local clock nets for advanced clock distribution and control.
  • Configuration and Reprogrammability — SRAM-based in-system configuration with unlimited re-programmability and multiple programming modes (SelectMAP™, serial, slave serial and JTAG).
  • Package & Power — 240-BFQFP (32 × 32) surface-mount package; supply voltage 2.375 V to 2.625 V.
  • Environmental & Reliability — Industrial grade device with operating temperature range −40 °C to 100 °C and RoHS compliant; 100% factory tested.
  • Process & Performance — Implemented in a 0.22 μm 5-layer metal CMOS process; documented system performance up to 200 MHz and 66-MHz PCI compliance.
  • Developer Ecosystem — Supported by FPGA Foundation™ and Alliance Series™ development systems for design, place-and-route and configuration workflows.

Typical Applications

  • High-performance digital systems — Implement custom processing, control logic and glue logic where reprogrammability and mid-range logic density are required.
  • PCI / CompactPCI interfaces — Suitable for designs requiring 66‑MHz PCI compliance and hot-swap capability for CompactPCI platforms as documented.
  • Prototyping and in-system configurable designs — SRAM-based architecture and multiple programming modes enable rapid iteration and field updates.
  • Complex I/O bridging — Multi-standard SelectIO support enables interfacing between diverse high-performance peripherals and memory devices.

Unique Advantages

  • Field reprogrammability: SRAM-based configuration offers unlimited in-system reprogramming options to iterate designs or deploy updates without hardware changes.
  • Comprehensive clock control: Multiple DLLs and dedicated global/local clock nets simplify timing management for synchronous, multi-clock designs.
  • Flexible embedded memory: Configurable LUT-based RAM and dedicated block RAM enable efficient implementation of FIFOs, buffers and small on-chip memories.
  • Robust I/O capability: 166 I/Os with multi-standard SelectIO allow direct connection to a variety of high-performance interfaces, reducing external translation logic.
  • Industrial temperature range: Rated for −40 °C to 100 °C to support deployment in demanding thermal environments.
  • Proven development support: Compatible with established FPGA Foundation and Alliance development toolflows to accelerate design and verification.

Why Choose XCV300-5PQ240I?

The XCV300-5PQ240I delivers a balanced combination of logic capacity, embedded memory and flexible I/O in a compact 240-BFQFP package—making it well suited for mid-range designs requiring reprogrammability and robust clock and I/O management. Its documented performance characteristics, industrial temperature rating and RoHS compliance make it a practical choice for professional embedded systems, interface logic, and prototype-to-production workflows.

Backed by established development tool support and factory testing, this Virtex FPGA provides a predictable platform for customers who need scalable, field-updatable logic combined with comprehensive timing and memory resources.

Request a quote or submit an RFQ today to check availability and pricing for the XCV300-5PQ240I. Our team can provide lead-time information and help assess suitability for your design requirements.

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