XCV300-5FG456I

The XCV300-5FG456I is a Virtex® SRAM-based FPGA that delivers a medium-density, reprogrammable logic platform. It combines an array of configurable logic elements with on-chip RAM and flexible I/O to address system-level programmable-logic requirements.

Designed for industrial applications, the device supports in-system reconfiguration and is targeted at designs that require deterministic I/O, embedded memory, and programmable clock management within a compact 456-BBGA package.

Key Features

• Logic Capacity — 6,912 logic elements (CLBs) and approximately 322,970 system gates provide medium-density programmable logic for custom digital functions.
• Embedded Memory — 65,536 bits of on-chip RAM suitable for FIFOs, small buffers, and distributed storage.
• I/O Resources — 312 user I/O pins for flexible peripheral and bus interfacing.
• Clock Management — Built-in clock-management circuitry including dedicated delay-locked loops (DLLs) and multiple global/local clock nets for advanced clock control.
• SRAM-based Configuration — In-system, SRAM-based configuration with unlimited re-programmability and multiple programming modes for development and field updates.
• Package and Mounting — 456-ball BGA (456-FBGA, 23×23) in a surface-mount package, optimized for board-level integration.
• Power and Temperature — Nominal voltage supply range 2.375 V to 2.625 V and an industrial operating temperature range of −40 °C to 100 °C.
• Standards and Compliance — RoHS-compliant manufacturing.

Typical Applications

• PCI and Compact PCI Systems — Supports system designs requiring PCI-compliant interfaces and hot-swappable Compact PCI configurations.
• Embedded System Prototyping — Reprogrammable logic and on-chip RAM make the device suitable for iterative hardware development and prototyping.
• I/O and Protocol Bridging — Abundant user I/O enables custom interface implementations and protocol translation tasks.
• Clock-Critical Designs — Built-in DLLs and hierarchical clock distribution support applications that require controlled clocking and low-skew signals.

Unique Advantages

• Medium-density integration: 6,912 logic elements and ~323k system gates enable complex logic without excessive board-level components.
• On-chip memory availability: 65,536 bits of embedded RAM reduce external memory dependencies for small buffers and state storage.
• Flexible I/O count: 312 user I/O pins provide headroom for multiple peripheral interfaces and parallel buses.
• Industrial temperature range: Rated −40 °C to 100 °C for deployment in demanding ambient conditions.
• Reconfigurable platform: SRAM-based architecture with unlimited re-programmability supports ongoing firmware and hardware updates.
• Board-level integration: 456-BBGA surface-mount package supports compact, high-density PCB designs.

Why Choose XCV300-5FG456I?

The XCV300-5FG456I offers a balanced combination of logic capacity, embedded memory, and flexible I/O in a compact industrial-grade package. It is well suited for designers who need a reprogrammable medium-density FPGA with on-chip resources and controlled clocking for system-level integration.

Supported by established development tool ecosystems for Virtex devices, this FPGA provides a practical platform for iterative development, in-field updates, and production designs that require predictable electrical and thermal operating ranges.

Request a quote or submit an inquiry to evaluate the XCV300-5FG456I for your next programmable-logic design project.