XCV300-5BG432C

The XCV300-5BG432C is an SRAM-based Virtex FPGA offering a high-density, reprogrammable logic fabric with 6,912 logic elements and approximately 65,536 bits of embedded RAM. With 316 I/O pins and roughly 322,970 system gates, this device is targeted at high-performance programmable logic applications where flexibility, I/O density, and in-system reconfigurability are required.

Built on a 0.22 μm, 5-layer-metal CMOS process and supported by the Virtex development ecosystem, the device provides up to 200 MHz system performance, 66-MHz PCI compliance, multiple clock-management resources, and a 432-LBGA exposed-pad metal package suitable for surface-mount assembly in commercial-temperature applications.

Key Features

• Logic Capacity  6,912 logic elements (CLB-equivalent array) and approximately 322,970 system gates provide substantial programmable logic for mid-range designs.
• Embedded Memory  Approximately 65,536 bits of on-chip RAM with hierarchical memory options including LUT-configurable RAM and configurable 4k-bit synchronous dual-ported RAMs.
• I/O and Interfaces  316 user I/O pins and Multi-standard SelectIO™ support with 16 high-performance interface standards for flexible peripheral and memory interfacing.
• Clock Management  Four dedicated delay-locked loops (DLLs) plus four primary low-skew global clock nets and 24 secondary local clock nets enable advanced clock control and distribution.
• Performance & Standards  Series-level performance up to 200 MHz, 66-MHz PCI compliance, and hot-swappable capability for Compact PCI applications.
• Configuration & Reprogramming  SRAM-based in-system configuration with unlimited re-programmability and multiple programming modes (SelectMAP™, slave serial, master serial, JTAG).
• Process & Reliability  0.22 μm, 5-layer-metal process with 100% factory testing. Commercial-grade operation over 0 °C to 85 °C.
• Package & Mounting  432-LBGA exposed pad, metal package (supplier package: 432-MBGA 40×40) for surface-mount assembly.
• Power  Core voltage supply range: 2.375 V to 2.625 V.
• Compliance  RoHS compliant.

Typical Applications

• PCI and Compact PCI Systems  Use in PCI-compliant designs and hot-swappable Compact PCI modules leveraging the device’s 66-MHz PCI support and hot-swap compatibility.
• System Prototyping and ASIC Replacement  High-density reprogrammable logic and abundant routing resources make this device suitable for prototype platforms and designs replacing mask-programmed gate arrays.
• High-Performance I/O Bridges  Multi-standard SelectIO™ and 316 I/Os enable protocol bridging and custom interface logic between diverse subsystems and external memories.
• Custom Memory and DSP Functions  Configurable LUT RAM and dedicated carry and multiplier support enable embedded memory and arithmetic-intensive functions for custom compute blocks.

Unique Advantages

• High integration in a single device: Consolidates logic, RAM, and I/O in a single 432-LBGA package to reduce board-level component count.
• Flexible, reprogrammable architecture: SRAM-based configuration with unlimited reprogramming supports iterative development and in-field updates.
• Robust clocking resources: Four DLLs and extensive global/local clock distribution provide precise timing control for complex synchronous designs.
• Rich I/O support: 316 I/Os and multi-standard SelectIO™ enable direct interfacing with a wide range of peripherals and memories.
• Manufacturing and quality pedigree: Fabricated on a 0.22 μm 5-layer-metal process and 100% factory tested to help ensure device consistency.
• Development ecosystem: Supported by established Virtex development systems and libraries to streamline design implementation and verification.

Why Choose XCV300-5BG432C?

The XCV300-5BG432C delivers a balanced combination of logic capacity, embedded memory, and flexible I/O in a surface-mount 432-LBGA package for commercial-temperature applications. Its SRAM-based architecture and multiple programming modes make it well suited to iterative development, prototyping, and applications requiring in-field reconfiguration.

Designed for engineers who need mid-range gate density with comprehensive clocking and memory options, this Virtex device also benefits from a mature development toolset and a tested manufacturing process, offering a pragmatic platform for complex digital designs that require performance and design flexibility.

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