XCV300-5BG352I

The XCV300-5BG352I is an SRAM-based Virtex FPGA delivering high-density programmable logic with 6,912 logic cells and approximately 65,536 bits of embedded RAM. Designed for industrial-grade applications, the device combines a flexible FPGA architecture with in-system reprogrammability to support development, prototyping, and system-level deployment.

Built for system designs that require rich I/O and on-chip memory, the device supports up to 260 I/O pins, operates from a 2.375 V to 2.625 V core supply, and is specified across an industrial temperature range of -40 °C to 100 °C. The device is available in a 352-LBGA exposed pad metal package (352-MBGA, 35×35) for surface-mount assembly.

Key Features

• Logic Capacity — 6,912 logic cells and 322,970 system gates enable complex combinational and sequential logic implementations.
• Embedded Memory — Approximately 65,536 bits of on-chip RAM provide configurable LUT-based and block RAM resources for data buffering and small memory arrays.
• I/O Density — 260 programmable I/O pins accommodate a wide range of system interfaces and external peripherals.
• Clock Management — Built-in clock-management circuitry includes four dedicated delay-locked loops (DLLs), four primary low-skew global clock nets, and 24 secondary local clock nets for advanced timing control.
• High-Speed System Support — Device supports system performance up to 200 MHz and is 66-MHz PCI compliant; it is also listed as hot-swappable for Compact PCI applications in the product family feature set.
• Configuration and Reprogrammability — SRAM-based architecture provides unlimited re-programmability with multiple programming modes for in-system configuration.
• Process and Test — Implemented in a 0.22 μm, 5-layer metal CMOS process and 100% factory tested.
• Package and Mounting — 352-LBGA exposed pad metal package (supplier package: 352-MBGA, 35×35) for surface-mount assembly; exposed pad supports thermal coupling to PCB.
• Industrial Grade & Environmental — Specified for industrial temperature range (-40 °C to 100 °C) and RoHS compliant.
• Development Ecosystem — Supported by FPGA Foundation and Alliance development systems for design and toolchain integration as noted in the product family documentation.

Typical Applications

• PCI and Compact PCI Systems — Suitable for designs requiring 66-MHz PCI compliance and hot-swappable Compact PCI functionality as identified in the Virtex product feature set.
• Embedded Systems — On-chip RAM, plentiful I/O, and reprogrammability make the device appropriate for embedded control, protocol bridging, and interface aggregation.
• Prototyping and Mask-Array Replacement — High logic capacity and flexible architecture support prototyping and use as an alternative to mask-programmed gate arrays.
• High-Speed Digital Processing — Clock-management resources and dedicated arithmetic/carry structures described in the family specification support timing-sensitive and compute-oriented logic.

Unique Advantages

• Reprogrammable SRAM Core: Unlimited in-system reprogramming enables iterative development and field updates without hardware changes.
• Balanced Speed and Density: The device’s architecture and 0.22 μm process provide a balance of performance (up to 200 MHz) and logic capacity (322,970 gates) for mid-range FPGA designs.
• Comprehensive Clock Control: Four DLLs and extensive clock distribution networks simplify multi-domain timing management in complex designs.
• Industrial Temperature Range: Specified operation from -40 °C to 100 °C addresses deployments in demanding environmental conditions.
• Robust Packaging: 352-LBGA exposed pad metal package supports surface-mount assembly and thermal coupling to the PCB for reliable operation.
• Toolchain Support: Documented support from the FPGA Foundation and Alliance development systems facilitates integration into existing design flows.

Why Choose XCV300-5BG352I?

The XCV300-5BG352I offers a mid-range Virtex FPGA solution that combines substantial logic capacity, embedded memory, and extensive I/O in an industrial-grade package. Its SRAM-based reprogrammability, dedicated clock resources, and proven process technology make it well suited for system-level designs that require flexibility, field updates, and reliable operation across a wide temperature range.

This device is a fit for engineering teams building PCI/Compact PCI modules, embedded controllers, and digital processing functions that benefit from in-system configuration and a supported development ecosystem. The combination of performance, integration, and industrial qualification supports both development and deployed systems where sustained operation and updateability are required.

Request a quote or submit a pricing inquiry to obtain availability and lead-time details for the XCV300-5BG352I. Our team can provide a formal quote and support information to help with design and procurement planning.