XCV300-5BG432I
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 316 65536 6912 432-LBGA Exposed Pad, Metal |
|---|---|
| Quantity | 692 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 432-MBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 432-LBGA Exposed Pad, Metal | Number of I/O | 316 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1536 | Number of Logic Elements/Cells | 6912 | ||
| Number of Gates | 322970 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of XCV300-5BG432I – Virtex® Field Programmable Gate Array (FPGA)
The XCV300-5BG432I is a Virtex® SRAM-based field programmable gate array that provides a balanced combination of logic capacity, embedded memory, and I/O resources in a 432-LBGA exposed-pad package. Built on the Virtex family architecture, it targets high-performance, reprogrammable digital systems across industrial and embedded markets.
With 6,912 logic elements, approximately 65 Kbits of on-chip RAM, and 316 user I/O pins, this device is suited for designs requiring dense logic, flexible memory configurations, and a broad set of interface options while operating within an industrial temperature range.
Key Features
- Core Architecture SRAM-based Virtex architecture optimized for place-and-route efficiency; includes dedicated carry logic, multiplier support, and abundant registers and latches for arithmetic and control functions.
- Logic Capacity 6,912 logic elements (32×48 CLB array) and 1,536 CLBs provide substantial programmable logic resources for complex designs.
- Embedded Memory Approximately 65,536 bits of on-chip RAM with configurable LUT-based RAM and dedicated block RAM options for flexible data storage and buffering.
- I/O and Interface Support 316 user I/O pins; multi-standard SelectIO interface capabilities referenced in the Virtex family for diverse high-performance interface standards.
- Clock Management Built-in clock-management circuitry in the Virtex family includes multiple delay-locked loops (DLLs) and dedicated global and local clock nets for advanced clock control and low-skew distribution.
- Configuration and Re-programmability SRAM-based in-system configuration with multiple programming modes and unlimited re-programmability.
- Package and Mounting 432-LBGA exposed pad, metal package (432-MBGA, 40×40) designed for surface-mount assembly and exposed-pad mounting.
- Power and Temperature Device supply voltage range 2.375 V to 2.625 V and industrial operating temperature range from −40 °C to 100 °C.
- Quality 100% factory tested as specified for the Virtex family.
Typical Applications
- High-performance interface controllers Implement PCI/Compact PCI and other high-speed system interfaces using the device's multi-standard I/O and high I/O count.
- Embedded system prototyping In-system re-programmability and substantial logic capacity make the device suitable for iterative development and prototype platforms.
- Signal processing and arithmetic acceleration Dedicated multiplier support and carry logic enable implementation of arithmetic-intensive functions and DSP pipelines.
- Memory-intensive control Configurable LUT RAM and dedicated block RAM bits support buffering, FIFOs, and small on-chip data stores for control and interface logic.
Unique Advantages
- High logic density: 6,912 logic elements and 1,536 CLBs provide the capacity to implement complex custom logic and control functions.
- Comprehensive I/O resources: 316 user I/O pins enable extensive connectivity for multi-device systems and rich peripheral interfaces.
- Flexible embedded memory: Approximately 65 Kbits of on-chip RAM in combination with configurable LUTs supports varied memory architectures without external components.
- Industrial temperature capability: Rated for −40 °C to 100 °C operation to meet temperature requirements for industrial applications.
- SRAM-based re-programmability: Multiple programming modes and unlimited re-programmability simplify field updates and design iteration.
- Surface-mount exposed-pad package: 432-LBGA exposed pad, metal package supports standard surface-mount assembly in dense board designs.
Why Choose XCV300-5BG432I?
The XCV300-5BG432I delivers a balance of programmable logic, embedded memory, and extensive I/O in a robust industrial-temperature FPGA package. Its Virtex-family architecture and on-chip resources make it appropriate for designers who need reprogrammable logic with substantial interfacing and memory flexibility.
This device is well suited to teams developing industrial embedded systems, high-performance interface controllers, and signal-processing accelerators that require dependable factory-tested components and the agility of SRAM-based configuration.
Request a quote or submit an RFQ to receive pricing and availability information for the XCV300-5BG432I and help determine fit for your next design.

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Headquarters: Santa Clara, California, USA
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








