XCV300-5BG432I

IC FPGA 316 I/O 432MBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 316 65536 6912 432-LBGA Exposed Pad, Metal

Quantity 692 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package432-MBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case432-LBGA Exposed Pad, MetalNumber of I/O316Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1536Number of Logic Elements/Cells6912
Number of Gates322970ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of XCV300-5BG432I – Virtex® Field Programmable Gate Array (FPGA)

The XCV300-5BG432I is a Virtex® SRAM-based field programmable gate array that provides a balanced combination of logic capacity, embedded memory, and I/O resources in a 432-LBGA exposed-pad package. Built on the Virtex family architecture, it targets high-performance, reprogrammable digital systems across industrial and embedded markets.

With 6,912 logic elements, approximately 65 Kbits of on-chip RAM, and 316 user I/O pins, this device is suited for designs requiring dense logic, flexible memory configurations, and a broad set of interface options while operating within an industrial temperature range.

Key Features

  • Core Architecture  SRAM-based Virtex architecture optimized for place-and-route efficiency; includes dedicated carry logic, multiplier support, and abundant registers and latches for arithmetic and control functions.
  • Logic Capacity  6,912 logic elements (32×48 CLB array) and 1,536 CLBs provide substantial programmable logic resources for complex designs.
  • Embedded Memory  Approximately 65,536 bits of on-chip RAM with configurable LUT-based RAM and dedicated block RAM options for flexible data storage and buffering.
  • I/O and Interface Support  316 user I/O pins; multi-standard SelectIO interface capabilities referenced in the Virtex family for diverse high-performance interface standards.
  • Clock Management  Built-in clock-management circuitry in the Virtex family includes multiple delay-locked loops (DLLs) and dedicated global and local clock nets for advanced clock control and low-skew distribution.
  • Configuration and Re-programmability  SRAM-based in-system configuration with multiple programming modes and unlimited re-programmability.
  • Package and Mounting  432-LBGA exposed pad, metal package (432-MBGA, 40×40) designed for surface-mount assembly and exposed-pad mounting.
  • Power and Temperature  Device supply voltage range 2.375 V to 2.625 V and industrial operating temperature range from −40 °C to 100 °C.
  • Quality  100% factory tested as specified for the Virtex family.

Typical Applications

  • High-performance interface controllers  Implement PCI/Compact PCI and other high-speed system interfaces using the device's multi-standard I/O and high I/O count.
  • Embedded system prototyping  In-system re-programmability and substantial logic capacity make the device suitable for iterative development and prototype platforms.
  • Signal processing and arithmetic acceleration  Dedicated multiplier support and carry logic enable implementation of arithmetic-intensive functions and DSP pipelines.
  • Memory-intensive control  Configurable LUT RAM and dedicated block RAM bits support buffering, FIFOs, and small on-chip data stores for control and interface logic.

Unique Advantages

  • High logic density: 6,912 logic elements and 1,536 CLBs provide the capacity to implement complex custom logic and control functions.
  • Comprehensive I/O resources: 316 user I/O pins enable extensive connectivity for multi-device systems and rich peripheral interfaces.
  • Flexible embedded memory: Approximately 65 Kbits of on-chip RAM in combination with configurable LUTs supports varied memory architectures without external components.
  • Industrial temperature capability: Rated for −40 °C to 100 °C operation to meet temperature requirements for industrial applications.
  • SRAM-based re-programmability: Multiple programming modes and unlimited re-programmability simplify field updates and design iteration.
  • Surface-mount exposed-pad package: 432-LBGA exposed pad, metal package supports standard surface-mount assembly in dense board designs.

Why Choose XCV300-5BG432I?

The XCV300-5BG432I delivers a balance of programmable logic, embedded memory, and extensive I/O in a robust industrial-temperature FPGA package. Its Virtex-family architecture and on-chip resources make it appropriate for designers who need reprogrammable logic with substantial interfacing and memory flexibility.

This device is well suited to teams developing industrial embedded systems, high-performance interface controllers, and signal-processing accelerators that require dependable factory-tested components and the agility of SRAM-based configuration.

Request a quote or submit an RFQ to receive pricing and availability information for the XCV300-5BG432I and help determine fit for your next design.

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