XCV300-4FG456C

The XCV300-4FG456C is a Virtex® SRAM-based FPGA delivering high-capacity programmable logic in a 456-ball BGA package. It provides 6,912 logic elements, 65,536 bits of on-chip RAM, and 312 user I/O pins to support complex digital designs.

Built on the Virtex architecture, this device targets high-performance embedded logic, system interfacing and compute-acceleration applications where reprogrammability, rich I/O standards and on-chip memory integration are required. The device operates from a 2.375 V to 2.625 V core supply and is specified for commercial temperature environments (0 °C to 85 °C).

Key Features

• Logic Capacity — 6,912 logic elements (322,970 system-gate equivalent) to implement medium-to-large logic functions and custom datapaths.
• On-Chip Memory — 65,536 bits of embedded RAM for LUT-configurable RAM blocks and small dual-ported RAM structures.
• I/O Resources — 312 user I/O pins with multi-standard SelectIO support for flexible external device interfacing and high-performance signaling.
• Clock and Timing — Integrated clock-management including four dedicated DLLs and multiple global/local clock nets for low-skew distribution and advanced clock control.
• Configuration Flexibility — SRAM-based in-system reprogrammability with multiple configuration modes (SelectMAP, serial, JTAG) for iterative development and field updates.
• Package & Mounting — 456-ball FBGA (23×23) surface-mount package for compact board mounting and robust signal routing.
• Power & Supply — Core voltage supply range of 2.375 V to 2.625 V to match system power domains.
• Commercial Grade & Compliance — Rated for 0 °C to 85 °C operation and RoHS compliant.
• Proven Process & Testing — 0.22 µm, 5-layer-metal CMOS process and 100% factory-tested devices.

Typical Applications

• PCI and Compact PCI Systems — Use the device's 66‑MHz PCI compliance and hot‑swap capability for mezzanine or backplane interface logic.
• High‑Performance I/O Bridging — Multi-standard SelectIO and abundant I/O pins make the device suitable for protocol bridging and interface concentration between processors and external memories.
• Custom Logic and Acceleration — Implement custom datapaths, arithmetic units and control logic leveraging dedicated carry and multiplier support in the Virtex architecture.
• Memory Interface Control — Connect directly to high-performance external RAMs and ZBT RAM devices for buffering, packet processing, and data staging functions.

Unique Advantages

• Reprogrammable Hardware — SRAM-based configuration allows unlimited in-field reprogramming, enabling fast design iteration and feature updates without board changes.
• Balanced Speed and Density — Architecture optimized for place-and-route efficiency supports complex designs while maintaining system performance up to documented device capabilities.
• Integrated Clock Management — Multiple DLLs and hierarchical clock nets simplify timing control for multi-clock designs and reduce system-level clock skew.
• Compact, High‑I/O Package — 456‑ball FBGA provides dense routing and a large number of I/Os in a compact footprint, reducing PCB area for system integration.
• Industry-Standard Development Support — Supported by established development systems and libraries for design flow compatibility and productivity.

Why Choose XCV300-4FG456C?

The XCV300-4FG456C offers a practical balance of logic capacity, on-chip RAM and I/O resources for designers requiring a reprogrammable, medium‑density FPGA in a compact BGA package. Its Virtex architecture provides dedicated arithmetic resources, flexible LUT-based memory configurations and integrated clock-management features to address demanding embedded and interface-centric designs.

For development projects that need field reconfiguration, robust I/O capability and a commercially rated operating range, this device provides a tested, standards-supported FPGA solution that integrates easily into existing tool flows and system designs.

Request a quote today to evaluate XCV300-4FG456C for your next board design or to obtain pricing and availability information.