XCV2600E-7FG1156C

IC FPGA 804 I/O 1156FBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 804 753664 57132 1156-BBGA

Quantity 293 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1156-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1156-BBGANumber of I/O804Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs12696Number of Logic Elements/Cells57132
Number of Gates3263755ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits753664

Overview of XCV2600E-7FG1156C – Virtex®-E Field Programmable Gate Array (FPGA) IC 804 753664 57132 1156-BBGA

The XCV2600E-7FG1156C is a Virtex®-E series FPGA delivered in a 1156-ball BGA package, designed for high-density, reprogrammable digital logic. It combines a large number of logic elements, substantial on-chip RAM, and a high I/O count to address designs that require extensive logic capacity and high aggregate I/O bandwidth.

Built around the Virtex‑E architecture, the device is optimized for applications that need flexible I/O standards, on-chip memory resources, and integrated clock management while operating from a 1.71 V to 1.89 V core supply in commercial temperature environments.

Key Features

  • Logic Capacity — 57,132 logic elements, enabling complex combinational and sequential logic implementations.
  • On‑Chip Memory — Total embedded RAM of 753,664 bits (approximately 0.75 Mbits) for distributed and block memory requirements.
  • I/O Density & Bandwidth — Up to 804 single‑ended I/Os (or differential pair alternatives supported by the Virtex‑E family) to support high aggregate bandwidth applications.
  • System Performance Features — Series-level capabilities include digital Delay‑Locked Loops (DLLs) and support for DDR interfaces and high-speed clock inputs; architecture supports dedicated carry and multiplier resources.
  • External Memory & Interface Support — Series-level support for high-performance interfaces to external memories (e.g., ZBT SRAMs and DDR SDRAMs) and PCI compatibility as documented for the Virtex‑E family.
  • Power and Supply — Core voltage supply range of 1.71 V to 1.89 V, optimized for the 1.8 V Virtex‑E process.
  • Package & Mounting — 1156‑BBGA (supplier package: 1156‑FBGA, 35×35) intended for surface‑mount PCB assembly.
  • Operating Range — Commercial grade operation from 0 °C to 85 °C.
  • Standards & Compliance — RoHS compliant; 100% factory tested as part of the Virtex‑E production specification.

Typical Applications

  • High‑Performance Interfaces — Implement PCI and other wide parallel or source‑synchronous interfaces using the device’s high I/O count and series‑level interface support.
  • Memory Subsystem Controllers — Use the device where high bandwidth interfaces to external memories (ZBT SRAM, DDR SDRAM as supported by the Virtex‑E family) are required.
  • Data Acquisition & Aggregation — Aggregate many high‑speed I/Os for board‑level data collection and preprocessing before handing off to downstream systems.
  • Prototyping and In‑System Reconfigurable Logic — SRAM‑based, reprogrammable architecture suitable for iterative design and FPGA‑based prototyping flows.

Unique Advantages

  • High Logic Density: 57,132 logic elements provide headroom for large, integrated digital designs without partitioning across multiple devices.
  • Substantial Embedded Memory: Approximately 0.75 Mbits of on‑chip RAM reduces external memory dependencies for many buffering and local storage needs.
  • Extensive I/O Resources: Up to 804 I/Os support wide buses and dense peripheral connectivity, simplifying board routing and system partitioning.
  • Integrated Clock Management: Series-level DLLs and clocking features enable robust timing strategies for high-speed, multi-domain designs.
  • Commercial Temperature and RoHS Compliance: Commercial operating range (0 °C to 85 °C) and RoHS compliance ease integration into mainstream electronic products.
  • Complete Package Offering: 1156‑ball BGA surface‑mount footprint supports high‑pin‑count, compact PCB layouts for space‑constrained designs.

Why Choose XCV2600E-7FG1156C?

The XCV2600E-7FG1156C positions itself as a high‑capacity, flexible FPGA option within the Virtex‑E family, combining tens of thousands of logic elements, substantial embedded memory, and a very high I/O count in a compact BGA package. It is suited to customers and designs that need to consolidate complex logic, memory buffering, and extensive peripheral interfaces into a single reprogrammable device.

With series‑level features such as advanced clock management, differential signaling support, and strong external memory interface capabilities, this device delivers a balanced platform for memory‑intensive and I/O‑heavy applications while maintaining standard commercial operating conditions and environmental compliance.

Request a quote or submit an inquiry to get pricing and availability for the XCV2600E-7FG1156C. Our team can provide lead‑time and procurement support tailored to your project timeline.

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