XCV200E-7FG456C

IC FPGA 284 I/O 456FBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 284 114688 5292 456-BBGA

Quantity 976 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package456-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case456-BBGANumber of I/O284Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1176Number of Logic Elements/Cells5292
Number of Gates306393ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits114688

Overview of XCV200E-7FG456C – Virtex®-E FPGA, 5,292 logic elements, 456-BBGA

The XCV200E-7FG456C is a Virtex®-E Field Programmable Gate Array (FPGA) in a 456-BBGA package engineered for commercial embedded and high-performance interface applications. This device provides 5,292 logic elements, 114,688 bits of on-chip RAM, and 284 user I/O pins, with an operating supply range of 1.71 V to 1.89 V and a commercial operating temperature range of 0 °C to 85 °C.

As a member of the Virtex‑E 1.8 V family, the device leverages the series’ architectural features—high-density logic, a flexible SelectI/O+ architecture, advanced clock management and a SelectRAM+ memory hierarchy—making it suitable for commercial systems requiring programmable logic, rich I/O, and in-system reconfigurability.

Key Features

  • Core Logic  Approximately 5,292 logic elements and about 306,393 gates provide a moderate-density programmable fabric for custom logic implementations.
  • Embedded Memory  Includes 114,688 bits of on-chip RAM (approximately 0.11 Mbits) for buffering, FIFOs, and small local data stores.
  • I/O Density & Flexibility  284 I/O pins in a single device; part of the Virtex‑E SelectI/O+ architecture that supports a broad set of high-performance interface standards and differential signaling options described for the family.
  • Clocking & Timing  Virtex‑E family clock-management features such as multiple Delay-Locked Loops (DLLs) and digitally synthesized duty cycles enable precise timing control and DDR support as described in the Virtex‑E documentation.
  • High-Performance Memory Interface (family-level)  The Virtex‑E SelectRAM+ memory hierarchy described for the family includes distributed RAM and synchronous block RAM designed for high-bandwidth external memory interfaces.
  • Configuration & Reliability  SRAM-based in-system reprogrammability and family-level production testing practices ensure field reconfiguration and device validation as outlined in the Virtex‑E materials.
  • Power & Supply  Internal supply operation in the 1.71 V to 1.89 V range consistent with the Virtex‑E 1.8 V device family.
  • Package & Mounting  456-BBGA package, supplier package listed as 456-FBGA (23 × 23), surface-mount mounting type; commercial-grade temperature rating of 0 °C to 85 °C.

Typical Applications

  • PCI and system interface bridging  The Virtex‑E family includes PCI-compliant interfaces (3.3 V, 32/64-bit, 33/66-MHz) suitable for implementing host or bridge logic in commercial systems.
  • Memory controller and interface logic  Use with high-performance external memories (DDR SDRAMs and ZBT SRAMs are described in the Virtex‑E documentation) for buffering, caching, and controller logic.
  • High-speed differential signaling  Support for LVDS, BLVDS and LVPECL (family-level features) enables high-speed data and clock distribution in communications and measurement equipment.
  • Reconfigurable commercial embedded systems  On-chip logic, embedded RAM and in-system SRAM configuration allow iterative development and field updates for commercial products.

Unique Advantages

  • Reprogrammable in-system FPGA  SRAM-based configuration enables design updates and iterative development without hardware changes.
  • Balanced logic and memory resources  The combination of ~5,292 logic elements and ~0.11 Mbits of embedded RAM supports mid-density logic functions with local buffering.
  • Flexible I/O architecture (family-level)  The Virtex‑E SelectI/O+ architecture provides broad interface support and differential signaling capabilities to simplify board-level interfacing.
  • Robust clock management (family-level)  Multiple DLLs and digitally synthesized clock features described for the family help meet demanding timing and DDR requirements.
  • Compact BGA footprint  The 456-ball BGA (23 × 23) package provides a high I/O count in a compact surface-mount form factor for space-constrained commercial designs.

Why Choose XCV200E-7FG456C?

The XCV200E-7FG456C offers a practical balance of programmable logic density, embedded memory, and a high I/O count in a commercial-grade Virtex‑E device. It is well suited to commercial embedded designs that require moderate logic resources, flexible high-speed I/O options, and the ability to reconfigure in-system.

As part of the Virtex‑E 1.8 V family, this device benefits from the architectural features and development tool support documented for the family, providing a clear upgrade path and predictable integration for system designs that need programmable logic with high-bandwidth interfacing.

Request a quote or submit an RFQ to check current availability and pricing for the XCV200E-7FG456C and to discuss how this Virtex‑E FPGA can fit into your next commercial design.

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