XCV200E-7BG352C

The XCV200E-7BG352C is a Virtex®-E series SRAM-based FPGA supplied in a 352-ball L-BGA package with exposed pad. It provides reprogrammable logic resources, embedded memory, and a flexible I/O set for applications that require configurable digital logic and high-performance interface support.

This device is targeted at commercial-grade systems and is well suited for designs needing on-chip embedded memory, multi-standard I/O capability, and configurable clock management while operating from a 1.71 V–1.89 V core supply in a surface-mount 352-LBGA package.

Key Features

• Logic Capacity  Approximately 5,292 logic elements and about 306,393 system gates provide the core combinatorial and sequential resources for custom logic implementation.
• Embedded Memory  Approximately 0.115 Mbits (114,688 bits) of on-chip RAM for distributed and block memory requirements.
• I/O Count & Flexibility  260 I/O pins delivered in SelectI/O capable architecture (family-level SelectI/O+ technology described in the datasheet), enabling support for multiple interface standards.
• Clocking and Timing  Integrated digital clock-management features (series-level DLLs and clock synthesis capabilities are described in the product datasheet) to support precise timing and DDR-friendly duty cycles.
• Memory Interface Support  Designed for high-performance interfaces to external memories (series-level support for ZBT SRAM and DDR SDRAM is documented in the datasheet).
• Package & Mounting  352-LBGA exposed pad, metal package (supplier device package: 352-MBGA, 35×35 mm footprint) for surface-mount assembly.
• Power & Voltage  Core supply range: 1.71 V to 1.89 V enabling 1.8 V internal logic operation.
• Operating Range & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C. RoHS compliant.

Typical Applications

• High-speed communications: Use the device’s flexible I/O standards and programmable logic to implement protocol bridging, SERDES interfaces, or custom packet processing functions described at the series level.
• Memory controller and interface logic: Implement controllers and glue logic for external memory subsystems leveraging the on-chip block RAM and the series-described support for high-performance external memories.
• Prototyping and system integration: Ideal for reconfigurable designs and in-system updates where SRAM-based reprogrammability enables iterative development and field upgrades.
• Custom compute and DSP kernels: Deploy arithmetic-intensive logic and pipelined datapaths using the device’s dedicated carry and multiplier support described in the datasheet.

Unique Advantages

• Reprogrammable logic: SRAM-based architecture enables unlimited re-programmability for design iteration, field updates, and algorithm refinement.
• Balanced integration: Combines thousands of logic elements with on-chip RAM and a substantial I/O count to consolidate functions and reduce external glue logic.
• High-performance interface capability: Datasheet-level SelectI/O+/differential signalling support and documented interface options provide flexibility for multi-standard designs.
• Configurable clock management: Built-in digital clock-management features (DLLs and synthesized duty-cycle control in the series documentation) simplify timing design for DDR and high-speed interfaces.
• Compact, manufacturable package: 352-LBGA exposed pad metal package supports surface-mount assembly in space-constrained designs while providing thermal conduction.
• Standards & compliance: Commercial-grade device with RoHS compliance to meet common environmental and manufacturing requirements.

Why Choose XCV200E-7BG352C?

The XCV200E-7BG352C positions itself as a flexible, reprogrammable FPGA suited to commercial applications that need moderate logic density, embedded RAM, and a substantial I/O complement in a compact 352-LBGA package. Its 1.8 V core operation, support for high-performance I/O modes documented for the Virtex®-E family, and on-chip clock management make it a practical choice for designers implementing memory interfaces, protocol bridging, and custom hardware accelerators.

This device is appropriate for engineering teams and procurement looking for a proven Virtex®-E architecture with factory-tested components, vendor-documented development tool support at the series level, and a clear specification set for core voltage, temperature range, package, and pin count.

Request a quote or submit a pricing inquiry to confirm availability and lead time for the XCV200E-7BG352C. Our team can provide ordering details and supply options tailored to your design schedule.