XCV200E-6FG456C

The XCV200E-6FG456C is a Virtex®-E family 1.8 V field programmable gate array (FPGA) in a 456-ball BGA package, manufactured by AMD. It provides a balance of logic capacity, on-chip memory and high I/O count for commercial embedded designs that require reprogrammable digital logic and flexible interfacing.

Designed for commercial-grade applications, this device targets systems requiring significant I/O bandwidth, embedded RAM, and configurable logic resources while operating within a 0 °C to 85 °C range and a 1.71 V–1.89 V internal supply window.

Key Features

• Logic Capacity — 5,292 logic elements (cells) and 306,393 gates provide a measurable foundation for medium-complexity digital designs.
• Configurable Memory — Approximately 0.11 Mbits (114,688 bits) of on-chip RAM to support embedded buffers, FIFOs and small data storage needs.
• High I/O Count — 284 I/O pins accommodate broad interfacing requirements for multiple peripherals, buses and external devices.
• Package & Mounting — 456‑BBGA (supplier package 456‑FBGA, 23×23) with surface-mount mounting for compact board-level integration.
• Supply & Temperature — Internal VCCINT range 1.71 V to 1.89 V and commercial operating temperature 0 °C to 85 °C.
• Series-Level Capabilities — Virtex‑E family features cited in the series documentation include support for high-performance differential signaling (LVDS, LVPECL, BLVDS), advanced clock management (multiple DLLs and DDR-friendly clocking), and flexible SelectI/O standards for multiple interface types.
• Regulatory — RoHS compliant, supporting modern environmental requirements for lead-free assemblies.

Typical Applications

• High-speed interface bridging — Use the device’s high I/O count and Virtex‑E series signaling support to implement protocol converters and interface bridges.
• Memory interface control — Embedded RAM and logic resources enable controller functions and buffering for external memory systems and SDRAM interfaces.
• Custom logic and prototyping — Reprogrammable FPGA fabric is suitable for proof-of-concept implementations and evolving product logic in commercial embedded systems.

Unique Advantages

• Balanced integration: Combines thousands of logic elements with on-chip RAM and hundreds of I/Os to reduce external component count and simplify board design.
• Commercial-ready thermal profile: Rated for 0 °C to 85 °C operation to match a wide range of commercial embedded products.
• Compact BGA package: 456‑ball FBGA footprint offers high pin density in a package suitable for space-constrained PCBs.
• Supply compatibility: Internal 1.8 V logic supply window (1.71 V–1.89 V) aligns with lower-voltage FPGA core requirements for reduced power operation.
• Environmentally compliant: RoHS compliance supports lead-free assembly processes and end-product environmental requirements.

Why Choose XCV200E-6FG456C?

The XCV200E-6FG456C positions itself as a versatile Virtex‑E FPGA option for commercial embedded designs needing moderate logic density, significant I/O capability and on-chip memory in a compact BGA package. Its combination of 5,292 logic elements, approximately 0.11 Mbits of embedded memory and 284 I/Os makes it suitable for applications that require reprogrammable logic with substantial interfacing needs while operating within standard commercial temperature and supply ranges.

This part is appropriate for design teams seeking a reconfigurable platform that aligns with established Virtex‑E series features and supports RoHS-compliant manufacturing. Its package and electrical characteristics support compact board layouts and integration into commercial embedded systems.

Request a quote or submit an inquiry to receive pricing, availability and additional technical support for the XCV200E-6FG456C.