XCV200E-6FG256I

The XCV200E-6FG256I is a Virtex®-E family field programmable gate array (FPGA) in a 256‑FBGA (17×17) package, designed for industrial-grade, reconfigurable logic applications. This 1.8 V-class FPGA provides 5,292 logic elements, approximately 114,688 bits of on-chip RAM and 176 user I/O pins, addressing mid-range integration needs where in-system programmability and robust I/O are required.

With an operating temperature range from −40 °C to 100 °C and RoHS compliance, the device targets industrial applications that require wide temperature operation, significant I/O density and flexible memory structures.

Key Features

• Logic Capacity and Fabric 5,292 logic elements and approximately 306,393 system gates provide a reconfigurable fabric for custom logic, control, and glue‑logic implementations.
• Embedded Memory Approximately 114,688 bits of on-chip RAM for distributed and block memory usage, supporting data buffering and local storage.
• I/O and Interface Flexibility 176 I/O pins with SelectI/O+ style capabilities described in the Virtex‑E family documentation, offering support for multiple high-performance interface standards and differential signalling (LVDS, BLVDS, LVPECL).
• Performance and Clocking Family-level timing includes internal performance up to 130 MHz (four LUT levels) and sophisticated clock management with multiple DLLs for clock multiply/divide and duty‑cycle control, aiding high-speed synchronous designs.
• Packaging and Mounting 256‑FBGA (17×17) surface-mount package (256‑BGA case) for compact board-level integration.
• Power Supply Core supply range of 1.71 V to 1.89 V, consistent with the Virtex‑E 1.8 V device family.
• Industrial Temperature and Qualification Rated for industrial operation from −40 °C to 100 °C.
• Reconfiguration and Development Ecosystem SRAM-based in-system configuration enables unlimited reprogramming; the Virtex‑E family is supported by established development tool flows and reference designs as noted in family documentation.
• Regulatory and Environmental RoHS compliant for lead‑free manufacturing and assembly processes.

Typical Applications

• Industrial Control and Automation Implement machine control logic, sensor fusion and protocol bridging with reconfigurable logic and wide-temperature operation.
• Communications and Networking Use the device’s flexible I/O and differential signalling support for protocol interfaces, data framing and protocol conversion tasks.
• Memory Interfaces and Controllers Leverage on-chip RAM and the family’s SelectRAM+ memory architecture for buffering, custom memory controllers and high-bandwidth data paths.
• Embedded Processing and Glue Logic Integrate peripheral control, timing-critical glue logic and custom state machines in a single programmable device.

Unique Advantages

• Balanced Mid-Range Integration: Combines 5,292 logic elements with significant on-chip RAM to support moderate-complexity designs without external PLDs.
• Flexible High‑Performance I/O: 176 I/Os and documented support for multiple differential standards enable diverse interface implementations from a single device.
• Industrial Reliability: Rated for −40 °C to 100 °C operation and supplied in a 256‑FBGA package suitable for compact, board-level industrial designs.
• Reprogrammable In-System: SRAM-based configuration allows design updates and field reconfiguration throughout product life.
• Established Family-Level Toolflow: Part of the Virtex‑E family with documented clocking, memory and I/O features that are supported by established development methodologies.
• Environmental Compliance: RoHS compliant to support lead‑free assembly processes.

Why Choose XCV200E-6FG256I?

The XCV200E-6FG256I positions itself as a versatile, industrial-grade Virtex‑E FPGA option for designs that require mid-range logic density, flexible high-performance I/O and reprogrammable in-system configuration. Its combination of 5,292 logic elements, approximately 114,688 bits of embedded RAM and 176 I/Os makes it well suited to industrial control, communications interfaces and embedded processing tasks where temperature range and RoHS compliance are important.

Choosing this part benefits teams seeking a field-upgradable FPGA with documented Virtex‑E family features—clock management, differential signalling support and a mature development ecosystem—while maintaining compact board-level packaging in a 256‑FBGA footprint.

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