XCV200E-6FG256C

The XCV200E-6FG256C is a Virtex®-E Field Programmable Gate Array (FPGA) in a 256‑ball Fine-pitch BGA (17×17) package. It provides 5,292 logic elements, approximately 0.11 Mbits of embedded memory (114,688 total RAM bits), and 176 user I/O pins, delivering a balance of programmable logic, on-chip memory, and I/O density for commercial electronic designs.

Configured for 1.71–1.89 V internal supply operation and rated for commercial temperature (0 °C to 85 °C), this surface-mount device is suited to applications that require reprogrammable logic, multiple I/O standards, and compact board-level integration while meeting RoHS compliance.

Key Features

• Logic Capacity — 5,292 logic elements providing programmable resources for custom logic, control functions, and glue-logic integration.
• Embedded Memory — 114,688 bits of on-chip RAM (approximately 0.11 Mbits) for FIFOs, buffering, and small embedded data storage requirements.
• I/O Count & Flexibility — 176 user I/Os to support multiple parallel and serial interfaces and dense board-level connectivity.
• Power and Supply — Internal supply specified at 1.71 V to 1.89 V, enabling low-voltage internal operation consistent with Virtex-E family design.
• Package & Mounting — 256‑ball FBGA (17×17) surface-mount package for high-density PCB layouts and robust mechanical mounting.
• Commercial Temperature Range — Rated for 0 °C to 85 °C operation suitable for a wide range of commercial electronics.
• RoHS Compliance — Conforms to RoHS environmental requirements for lead-free assembly.
• Series-Level Capabilities (Virtex‑E) — Family features include high-performance SelectI/O+ technology, built-in clock management (DLLs), and configurable block RAM and distributed RAM architectures as described in the Virtex‑E product specification.

Typical Applications

• Embedded Control Systems — Implement custom state machines, protocol handling, and control logic using the device’s programmable logic and embedded RAM.
• High‑I/O Interface Bridging — Use the 176 I/Os to bridge multiple parallel interfaces or to aggregate signals between system blocks on compact PCBs.
• Prototyping and In‑System Reprogramming — Reprogrammable FPGA fabric allows iterative development and in-field updates for commercial electronics.

Unique Advantages

• Balanced Logic and Memory: 5,292 logic elements paired with ~0.11 Mbits of embedded RAM enable implementation of moderate-complexity logic plus local buffering without external memory for many designs.
• High I/O Density: 176 user I/Os support multi-channel interfaces and flexible pin assignments to simplify board-level routing and reduce the need for additional interface components.
• Compact Surface-Mount Package: The 256‑FBGA (17×17) package offers a small footprint for space-constrained PCBs while maintaining robust soldered connections.
• Commercial Temperature and RoHS Compliance: Designed for 0 °C to 85 °C operation and RoHS compliance to meet common commercial product requirements and environmental standards.
• Series-Proven Features: Leverages Virtex‑E family architectures such as SelectI/O+ and digital clock management to support diverse interface standards and clocking needs at the family level.

Why Choose XCV200E-6FG256C?

The XCV200E-6FG256C offers a practical combination of programmable logic, embedded memory, and I/O capacity in a compact 256‑FBGA package for commercial designs. Its 1.8 V class internal supply, RoHS compliance, and surface-mount package make it a suitable choice for developers who need in-system reprogrammability, moderate logic density, and flexible interfacing on space-conscious PCBs.

This device is well suited to customers developing commercial embedded systems, interface controllers, and prototype platforms who require reliable, reprogrammable logic with accessible on-chip RAM and a high number of user I/Os backed by the Virtex‑E family specification.

Request a quote or submit a procurement inquiry to receive pricing and availability for the XCV200E-6FG256C for your next design.