XCV2000E-8BG560C

The XCV2000E-8BG560C from AMD is a Virtex®-E family SRAM-based field programmable gate array (FPGA) supplied in a 560-LBGA exposed pad metal package. It delivers a high-density, reprogrammable logic fabric with on-chip memory and a large I/O count for high-bandwidth system designs.

Designed for commercial applications, the device combines up to 43,200 logic elements, approximately 0.655 Mbits of embedded memory, and 404 I/Os with series-level capabilities such as advanced SelectI/O and SelectRAM+ features to support high-performance interfaces and reconfigurable system architectures.

Key Features

• Core Logic — 43,200 logic elements and approximately 2,541,952 gates provide dense, programmable logic resources for complex digital designs.
• Embedded Memory — Total on-chip RAM of 655,360 bits (approximately 0.655 Mbits) enables local buffering and fast data paths for compute and interface tasks.
• I/O & Interface Flexibility — 404 I/Os with support for multiple high-performance differential standards at the series level (LVDS, BLVDS, LVPECL) and up to 20 interface standards, enabling aggregate bandwidths cited at the series level.
• Performance & Clock Management — Series-level features include up to 130 MHz internal performance (four LUT levels) and eight fully digital DLLs for clock multiply/divide, DDR-friendly duty cycles, and zero-delay conversions for high-speed clocking.
• Memory Hierarchy — Series SelectRAM+ architecture with up to 832 Kb of block RAM at the family level and high memory bandwidth capabilities for external memory interfaces.
• Packaging & Supply — 560-LBGA exposed pad, metal package (supplier package: 560-MBGA, 42.5 × 42.5 mm), surface-mount mounting, RoHS compliant.
• Power & Operating Range — Core supply range of 1.71 V to 1.89 V and commercial operating temperature range of 0 °C to 85 °C.
• Configuration & Test — SRAM-based in-system configuration with unlimited re-programmability and 100% factory-tested manufacturing assurance at the series level.

Typical Applications

• High‑bandwidth interfaces — Implement PCI or other high-speed bus interfaces and complex I/O protocols using the device’s broad I/O compatibility and series-level interface support.
• Memory interface controllers — Use the onboard RAM resources and SelectRAM+ architecture to build controllers and bridges for external memories and high-throughput data paths.
• Reconfigurable compute & signal processing — Leverage dense logic and embedded memory for custom DSP blocks, parallel processing, and protocol offload functions.
• Prototyping & in-system reconfigurable designs — SRAM-based architecture enables iterative development and field updates without device replacement.

Unique Advantages

• High-density programmable logic: 43,200 logic elements allow substantial on-chip integration of custom functions, reducing external component count.
• Flexible, high-performance I/O: 404 I/Os and series-level support for multiple differential standards enable adaptable interface design and high aggregate bandwidth.
• Programmable memory hierarchy: Approximately 0.655 Mbits of on-chip RAM combined with family-level block RAM options supports efficient local buffering and low-latency data paths.
• Advanced clocking: Multiple DLLs and DDR-friendly clock features help implement precise timing and high-speed serial/parallel interfaces.
• Commercial-grade reliability: Surface-mount 560-LBGA package with exposed pad and 100% factory testing supports standard commercial deployment requirements.
• Reprogrammability and development support: SRAM-based in-system configuration enables iterative updates and is supported by Xilinx development tool families at the series level.

Why Choose XCV2000E-8BG560C?

The XCV2000E-8BG560C positions itself as a high-density, reprogrammable FPGA option for commercial designs that require substantial logic capacity, flexible I/O, and embedded memory. Its combination of logic resources, on-chip RAM, and series-level clocking and interface technologies makes it suitable for system-level functions such as high-bandwidth interfaces, memory controllers, and reconfigurable compute blocks.

For engineering teams seeking a commercially graded, SRAM-based FPGA with comprehensive packaging and power specifications (1.71–1.89 V supply, 0 °C to 85 °C), the XCV2000E-8BG560C delivers a balance of performance, integration, and design flexibility backed by series-level development support and factory testing.

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