XCV2000E-7FG1156I

IC FPGA 804 I/O 1156FBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 804 655360 43200 1156-BBGA

Quantity 528 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1156-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1156-BBGANumber of I/O804Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9600Number of Logic Elements/Cells43200
Number of Gates2541952ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits655360

Overview of XCV2000E-7FG1156I – Virtex®-E FPGA, 1156-BBGA (Industrial)

The XCV2000E-7FG1156I is an industrial-grade Virtex®-E field programmable gate array (FPGA) in a 1156-ball BGA package. It combines high logic density, extensive I/O capability and embedded memory to support complex, configurable digital designs.

Designed for applications that require large programmable logic capacity and flexible high-speed interfacing, this device offers a balance of performance, integration and temperature resilience suitable for industrial systems.

Key Features

  • Logic Capacity — Approximately 43,200 logic elements and 2,541,952 usable gates for implementing large, multi-function digital systems.
  • Embedded Memory — Approximately 0.66 Mbits of on-chip RAM (655,360 bits) for local buffering, state machines and data storage.
  • I/O & Interface Flexibility — Up to 804 single-ended I/Os or 344 differential I/O pairs, enabling broad connectivity and aggregate bandwidth support for high-speed interfaces.
  • Clocking and Timing — Built-in digital clock management capabilities (series-level DLL architecture) and support for high-speed differential clock inputs to support robust timing architectures.
  • High-Performance System Interfaces — Series features support PCI 3.3 V 32/64-bit operation and common differential signaling standards for system-level interoperability.
  • Configuration & Test — SRAM-based in-system configuration with unlimited reprogramming and boundary-scan support for board-level testability.
  • Package & Mounting — Surface-mount 1156-BBGA package (supplier device package: 1156-FBGA, 35 × 35 mm) for dense board integration.
  • Power & Operating Range — Core supply between 1.71 V and 1.89 V; rated operating temperature from −40 °C to 100 °C for industrial environments.
  • Compliance — RoHS-compliant construction supporting modern assembly and environmental requirements.

Typical Applications

  • High-speed interface bridging — Use the device’s extensive I/O and differential signaling support to implement protocol translators, cross-connects or interface hubs.
  • Memory interface and buffering — Leverage embedded RAM and high gate count to build custom memory controllers, FIFOs and data buffering logic for external SRAM/DDR systems.
  • Industrial control and automation — Deploy in factory or process-control equipment that requires robust operation across −40 °C to 100 °C and flexible I/O mapping.
  • Data acquisition and signal preprocessing — Implement front-end logic for digitization, filtering and packetization where abundant logic and I/O are required.

Unique Advantages

  • High logic density: Approximately 43,200 logic elements enable consolidation of multiple functions into a single FPGA, reducing system component count.
  • Extensive I/O options: Up to 804 I/Os (or 344 differential pairs) provide headroom for complex, multi-interface designs without external multiplexers.
  • On-chip memory for local processing: Approximately 0.66 Mbits of embedded RAM supports buffering and on-chip data handling to minimize external memory dependence.
  • Industrial temperature rating: Specified operation from −40 °C to 100 °C makes the device suitable for demanding environmental conditions.
  • Surface-mount BGA packaging: The 1156-BBGA (35 × 35 mm) package allows high-density PCB layouts and reliable assembly for production hardware.
  • RoHS compliance: Meets environmental material requirements for modern product designs.

Why Choose XCV2000E-7FG1156I?

The XCV2000E-7FG1156I positions itself as a high-capacity, industrial-grade FPGA option that brings substantial programmable logic, significant on-chip memory and a large complement of I/O to complex embedded systems. Its supply voltage range, temperature rating and BGA packaging make it suitable for integrated designs that demand reliability and configurability.

This device is well suited to engineering teams building industrial controls, high-speed interfaces, data acquisition systems or any application that benefits from consolidating multiple digital functions into a single, reprogrammable device while maintaining robust environmental performance.

Request a quote or submit a quote to obtain pricing, lead-time and availability information for the XCV2000E-7FG1156I. Our team will respond with the details you need to move your design forward.

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