XCV2000E-7FG1156C
| Part Description |
Virtex®-E Field Programmable Gate Array (FPGA) IC 804 655360 43200 1156-BBGA |
|---|---|
| Quantity | 1,382 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1156-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA | Number of I/O | 804 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9600 | Number of Logic Elements/Cells | 43200 | ||
| Number of Gates | 2541952 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 655360 |
Overview of XCV2000E-7FG1156C – Virtex®-E FPGA 1156-BBGA
The XCV2000E-7FG1156C is a Virtex®-E family field programmable gate array (FPGA) in a 1156-BBGA package from AMD. This commercial-grade, SRAM-based FPGA integrates 43,200 logic elements, approximately 0.655 Mbits of on-chip RAM, and up to 804 I/O pins to address board-level designs that require dense, reprogrammable logic.
Designed for high-performance system interfaces and memory-centric designs, the device operates from a 1.71 V to 1.89 V core supply and supports an ambient temperature range of 0 °C to 85 °C. It is RoHS compliant and optimized for applications requiring flexible I/O standards and substantial gate density.
Key Features
- Core density and logic — 43,200 logic elements and 2,541,952 equivalent gates provide substantial programmable fabric for complex logic and control functions.
- Embedded memory — Total on-chip RAM of 655,360 bits (approximately 0.655 Mbits) for distributed and block memory needs within the design.
- I/O capacity and flexibility — Up to 804 single-ended I/Os (or support for differential signaling as provided by the Virtex‑E family) to enable wide data buses and multiple high-speed interfaces.
- Voltage and package — 1.71 V to 1.89 V core supply with a 1156-BBGA (supplier package 1156-FBGA, 35 × 35 mm) surface-mount package for compact board integration.
- Operating range — Commercial-grade operation from 0 °C to 85 °C suitable for standard electronics and embedded systems deployments.
- Reprogrammable architecture — SRAM-based, in-system reprogrammability typical of the Virtex‑E family for iterative development and field updates.
- Standards and interfaces (family-level) — Virtex‑E family supports a broad set of interface standards and high-speed differential signaling options, enabling designs that require PCI and high-bandwidth links (see family datasheet for details).
Typical Applications
- High-speed communications — Implement protocol bridging, packet processing, and interface logic where large I/O counts and dense logic are required.
- Memory interface controllers — Implement ZBT/DDR memory controllers and data buffering using the device’s embedded RAM and high I/O capacity.
- PCI-based systems — Use in PCI-compliant 32/64-bit system designs that need reprogrammable logic for control and bridging functions (family-level support documented in the datasheet).
- Embedded processing and prototyping — Rapid development and iteration for system prototypes requiring reconfigurable logic and significant on-chip resources.
Unique Advantages
- High logic capacity: 43,200 logic elements enable complex finite-state machines, wide datapaths, and substantial control logic without off-chip glue logic.
- Large I/O footprint: Up to 804 single-ended I/Os allow direct connection to multiple peripherals, memories, and board-level interfaces, reducing the need for external multiplexing.
- On-chip RAM for data buffering: Approximately 0.655 Mbits of embedded memory supports local buffering, FIFOs, and small lookup tables to accelerate data-path designs.
- Commercial-grade, RoHS-compliant package: Surface-mount 1156-BBGA packaging simplifies board assembly while meeting RoHS environmental requirements.
- Reprogrammability for iterative development: SRAM-based in-system configuration enables design updates and field-level revisions without device replacement.
Why Choose XCV2000E-7FG1156C?
The XCV2000E-7FG1156C positions itself as a versatile Virtex‑E family FPGA offering a balance of high logic density, substantial on-chip memory, and a large I/O count in a compact 1156-BBGA package. Its 1.8 V-class core and commercial operating range make it suitable for board-level systems and embedded designs that require reprogrammable logic and flexible interface support.
This device is well suited to engineering teams designing communications equipment, memory interface logic, PCI-based systems, and complex control architectures that benefit from in-system reprogrammability and a mature FPGA architecture.
Request a quote or submit a purchasing inquiry to receive availability and pricing information for the XCV2000E-7FG1156C. Our team can provide technical and procurement assistance to move your design forward.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








