XCV2000E-7BG560C

IC FPGA 404 I/O 560MBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 404 655360 43200 560-LBGA Exposed Pad, Metal

Quantity 1,713 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package560-MBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case560-LBGA Exposed Pad, MetalNumber of I/O404Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9600Number of Logic Elements/Cells43200
Number of Gates2541952ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits655360

Overview of XCV2000E-7BG560C – Virtex®-E Field Programmable Gate Array (FPGA)

The XCV2000E-7BG560C is a Virtex®-E family FPGA offered in a 560-ball LBGA package with exposed metal pad. This SRAM-based, reprogrammable device provides a high-density programmable fabric—43,200 logic elements with 2,541,952 equivalent gates—and is targeted at commercial embedded and interface-intensive applications.

Key attributes include a large I/O count (404 pins), approximately 655,360 bits of on-chip RAM, configurable clock management and I/O flexibility from the Virtex‑E architecture, and a nominal core supply range of 1.71 V to 1.89 V. The device is RoHS compliant and specified for commercial temperature operation (0 °C to 85 °C).

Key Features

  • Programmable Logic Capacity — 43,200 logic elements (listed as logic cells) delivering a total gate-equivalent count of 2,541,952 for complex glue logic, protocol engines, and algorithm implementation.
  • On‑Chip Memory — Total RAM of 655,360 bits (approximately 0.655 Mbits) for embedded storage and buffering within user designs.
  • I/O Density and Flexibility — 404 I/O pins accommodate wide parallel interfaces and multiple high-speed links; the Virtex‑E family supports a broad set of I/O standards and differential signalling options at the device-family level.
  • Clock and Timing — Built-in digital clock management primitives in the Virtex‑E series (including multiple DLLs) enable flexible clocking, duty‑cycle synthesis and support for high-performance synchronous interfaces.
  • Power and Supply — Core voltage supply range specified at 1.71 V to 1.89 V, enabling operation within the Virtex‑E 1.8 V architecture.
  • Package and Mounting — 560-LBGA exposed pad, metal package; supplier device package listed as 560-MBGA (42.5×42.5 mm). Surface-mount mounting type for standard PCB assembly.
  • Commercial Grade and Environmental — Commercial temperature grade (0 °C to 85 °C) and RoHS compliant.
  • SRAM-Based, Reprogrammable — SRAM configuration enables in-system reprogramming and design iteration during development and deployment (series-level device capability).

Typical Applications

  • High‑speed Interface Bridging — Implement protocol translation and interface logic for PCI-compliant and other high-throughput bus systems using the device’s abundant I/O and Virtex‑E I/O capabilities.
  • Memory Controller and Buffering — Use the on-chip RAM and programmable fabric to build custom memory interfaces, buffering, and data path pipelines for external SDRAM/ZBT/DDR memories (series-level memory interface support).
  • Real‑time Data Processing — Apply the large logic capacity and dedicated arithmetic resources to signal processing, packet handling, and real-time control tasks in embedded systems.
  • Prototyping and System Integration — Leverage reprogrammability and dense I/O to consolidate glue logic, accelerate prototypes, and integrate multiple functions onto a single FPGA platform.

Unique Advantages

  • High Logic Density: 43,200 logic elements enable complex functions and integration of multiple sub-systems into a single device, reducing overall BOM count.
  • Large I/O Complement: 404 I/Os provide the flexibility to interface with many peripherals and buses without external expander chips.
  • Embedded RAM for Low-Latency Data Paths: 655,360 bits of on-chip RAM support buffering and fast local storage, improving throughput for pipelined designs.
  • Flexible Clocking and Timing: Series-level DLL and clock management features permit robust timing architectures for DDR and source-synchronous designs.
  • Standard Surface‑Mount Package: 560-LBGA exposed pad package supports standard assembly processes and provides a compact form factor for system boards.
  • RoHS Compliant: Meets environmental requirements for lead-free assembly and commercial product deployment.

Why Choose XCV2000E-7BG560C?

The XCV2000E-7BG560C places a high-density Virtex‑E FPGA fabric, plentiful I/O, and on-chip RAM into a compact 560-LBGA package suitable for commercial embedded applications. Its combination of logic capacity, configurable memory, and series-level clock and I/O features makes it appropriate for designers building high-throughput interfaces, custom memory controllers, and integrated prototypes.

For development teams seeking a reprogrammable platform that supports iterative design and consolidation of discrete logic, this device provides a balanced mix of performance, integration and packaging in a RoHS-compliant commercial-grade FPGA.

Request a quote or submit an inquiry for pricing and availability of the XCV2000E-7BG560C to move your design forward.

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