XCV2000E-6FG680C

The XCV2000E-6FG680C is a Virtex®-E family Field Programmable Gate Array (FPGA) offering high-density, reprogrammable logic in a 680-LBGA exposed pad package. Built for commercial-grade designs, it combines 43,200 logic elements with extensive I/O capability and embedded RAM to address demanding system interfaces and high-performance embedded applications.

This device targets applications that require dense programmable logic, wide external memory interfaces, and flexible high-speed I/O, while operating from a 1.71 V to 1.89 V core supply and within a 0 °C to 85 °C commercial temperature range.

Key Features

• Logic Capacity  43,200 logic elements and approximately 2,541,952 gates provide substantial combinational and sequential resources for complex designs.
• Embedded Memory  Approximately 0.66 Mbits of on-chip RAM (655,360 total RAM bits) for distributed and block memory needs.
• I/O Density and Flexibility  512 available I/O pins with SelectI/O+ capabilities from the Virtex-E series enable multiple high-performance interface standards and high aggregate bandwidth.
• High-Speed Interface Support  Series-level features include support for LVDS, BLVDS, LVPECL and PCI-compliant 3.3 V 32/64-bit interfaces (33/66 MHz), facilitating fast, source-synchronous and differential signalling.
• Clock Management  Virtex-E family clock resources include multiple fully digital delay-locked loops (DLLs) and features for DDR-friendly 50% duty-cycle generation and frequency multiplication (series-level capability).
• Package and Mounting  680-LBGA exposed pad package (supplier package: 680-FTEBGA, 40×40) designed for surface-mount assembly and thermal management via exposed pad.
• Power  Core supply operating range of 1.71 V to 1.89 V suited to the 1.8 V Virtex-E process node.
• Commercial Grade & Compliance  Commercial temperature grade (0 °C to 85 °C) and RoHS compliant.

Typical Applications

• High‑Performance Interface Controllers  Implement wide, high-speed bus interfaces and protocol bridges using the device’s abundant I/O and differential signalling support.
• Memory Interface and Controllers  Use the on-chip RAM and series-level SelectRAM+ architecture for controllers and interfaces to external ZBT SRAM and DDR SDRAM.
• Signal Processing and Data Aggregation  Leverage the device’s logic density and clock-management features to build data-paths, packet processing, and aggregation engines.
• In-System Programmable Prototyping  SRAM-based in-system configuration supports iterative development and field updates for evolving designs.

Unique Advantages

• High Logic Density: 43,200 logic elements provide room for complex functions without external gate arrays or CPLDs.
• Rich I/O Capability: 512 I/Os and support for multiple differential standards enable flexible connectivity to modern high-speed peripherals.
• Embedded Memory Resources: Approximately 0.66 Mbits of on-chip RAM reduce dependency on external memory for many control and buffering tasks.
• Configurable Clocking: Series-level DLL and clock-management features simplify synchronization of high-speed interfaces and DDR applications.
• Practical Commercial Grade: Designed for 0 °C to 85 °C operation and RoHS compliance, suitable for mainstream commercial electronic systems.
• Surface-Mount, Thermally Managed Package: 680-LBGA exposed pad package supports compact board layouts with improved thermal dissipation.

Why Choose XCV2000E-6FG680C?

The XCV2000E-6FG680C delivers a blend of high logic capacity, substantial embedded RAM, and broad I/O flexibility in a compact 680-LBGA exposed pad package—making it well suited for commercial designs that require dense programmable logic and robust interface support. Its 1.8 V core supply, wide I/O options, and in-system programmability provide designers with a scalable and reconfigurable platform for a variety of system-level tasks.

Choose this device when you need a commercially graded FPGA with significant on-chip resources, flexible high-speed I/O, and the ability to implement complex custom logic and memory interfaces while maintaining surface-mount packaging and RoHS compliance.

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