XCV2000E-6BG560I

The XCV2000E-6BG560I is an AMD Virtex®-E family FPGA supplied in a 560-LBGA exposed-pad metal package. It integrates high-density programmable logic, on-chip memory, and flexible I/O to address designs that require significant logic capacity and varied interface support within an industrial temperature range.

Key architectural highlights for the Virtex‑E series used by this device include high-performance SelectI/O+ I/O technology, advanced on‑chip memory organization, and built‑in clock management — delivering a platform suitable for high-speed interfaces and memory‑centric applications.

Key Features

• Logic Capacity — 43,200 logic elements and approximately 2,541,952 gates provide high-density programmable logic for complex designs.
• Embedded Memory — 655,360 total RAM bits (approximately 0.66 Mbits) of on‑chip memory for distributed and block RAM usage.
• I/O and Interface Flexibility — 404 available I/O pins; Virtex‑E SelectI/O+ technology supports many high‑performance interface standards and differential signalling options (LVDS, BLVDS, LVPECL) as described for the series.
• Clock Management — Series-level clock circuitry provides multiple digital Delay‑Locked Loops (DLLs) for flexible clock multiplication, division and DDR-friendly duty-cycle control.
• Performance — Series documentation cites internal performance up to 130 MHz (four LUT levels) and architecture designed for high-speed, source-synchronous data transmission.
• Package and Mounting — 560-LBGA exposed pad, metal package; supplier device package listed as 560-MBGA (42.5 × 42.5 mm) and surface-mount mounting type.
• Power and Thermal — Internal supply voltage range 1.71 V to 1.89 V; industrial operating temperature range −40 °C to +100 °C.
• Compliance and Test — RoHS compliant and series documentation indicates 100% factory testing for production units.

Typical Applications

• High‑speed communications — Use the device's flexible SelectI/O+ interfaces and differential signalling support for protocol bridging, line cards, and packet processing where varied I/O standards are required.
• Memory interface controllers — On‑chip RAM capacity and series memory hierarchy support make it suitable for controllers and interfaces to external high‑speed memories.
• Signal processing and DSP — Dense logic and on‑chip memory enable implementation of data-paths, custom accelerators, and real‑time signal processing pipelines.
• In‑system programmable logic — SRAM‑based reprogrammability supports development, prototyping, and field updates for evolving application requirements.

Unique Advantages

• High-density programmable logic: 43,200 logic elements provide substantial on‑chip resources to consolidate functions and reduce external glue logic.
• Flexible I/O ecosystem: Series-level SelectI/O+ and differential signalling options let designers support multiple interface standards without changing device family.
• Integrated memory resources: Approximately 0.66 Mbits of embedded RAM reduces dependence on external memory for intermediate buffering and state storage.
• Robust clocking: Multiple DLLs and digital clock management features enable reliable timing architectures for DDR and high-frequency clock domains.
• Industrial temperature range: Rated from −40 °C to +100 °C for use in temperature‑sensitive deployments.
• Manufacturing readiness: Surface‑mount 560‑LBGA metal package with exposed pad and RoHS compliance supports industry manufacturing practices.

Why Choose XCV2000E-6BG560I?

The XCV2000E-6BG560I positions itself as an industrial‑grade, high‑density Virtex‑E FPGA option that brings together substantial logic resources, on‑chip memory, and a flexible I/O architecture in a production-ready 560‑LBGA package. Its voltage and thermal ranges, combined with series clocking and memory features, make it suitable for designs that need programmable performance and dependable operation in demanding environments.

This device is well suited to engineers building systems that require a mix of large logic capacity, memory bandwidth, and diverse interface support while maintaining manufacturing compatibility and RoHS compliance.

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