XCV200-6PQ240C
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 166 57344 5292 240-BFQFP |
|---|---|
| Quantity | 516 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP | Number of I/O | 166 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1176 | Number of Logic Elements/Cells | 5292 | ||
| Number of Gates | 236666 | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 57344 |
Overview of XCV200-6PQ240C – Virtex® Field Programmable Gate Array (FPGA) IC 166 57344 5292 240-BFQFP
The XCV200-6PQ240C is an SRAM-based Virtex FPGA delivering high-capacity, reprogrammable logic in a 240-pin BFQFP package. It combines a structured array of configurable logic elements with a hierarchical memory system and flexible I/O to address demanding programmable-logic requirements.
Designed for commercial-grade applications, this device provides on-chip embedded memory, dedicated arithmetic support and multi-standard I/O capability, making it suitable for system logic, interface bridging and high-performance prototyping where reconfigurability and integration matter.
Key Features
- Logic Capacity — 5,292 logic elements (CLB array 28×42) and 236,666 system gates, providing substantial programmable logic resources for complex designs.
- Embedded Memory — 57,344 total on-chip RAM bits with configurable LUT-based RAM options and support for synchronous dual-ported 4k-bit RAMs.
- I/O and Interfaces — 166 user I/O pins on the device; multi-standard SelectIO™ interfaces and documented support for direct connections to external memory devices.
- Clock Management — Four dedicated delay-locked loops (DLLs) plus four primary low-skew global clock nets and 24 secondary local clock nets for advanced clock control and distribution.
- Arithmetic and Logic Support — Dedicated carry logic, multiplier support and cascade chain capability for wide-input and high-speed arithmetic operations.
- Package & Power — 240-BFQFP (240-PQFP, 32×32) surface-mount package; supply voltage range 2.375 V to 2.625 V.
- Operating Range & Compliance — Commercial grade with an operating temperature range of 0 °C to 85 °C; RoHS compliant.
- Manufacturing & Configuration — 0.22 μm 5-layer-metal process, SRAM-based in-system configuration with unlimited re-programmability, and 100% factory tested.
Typical Applications
- PCI and Compact PCI systems — Implements 66‑MHz PCI-compliant interfaces and supports hot-swappable use in Compact PCI environments as documented for the Virtex family.
- High-performance system logic and prototyping — Reprogrammable fabric and abundant logic resources enable system-level prototyping and iterative design refinement.
- Custom I/O bridging and memory interfaces — Multi-standard SelectIO™ interfaces and fast external memory interfaces facilitate custom protocol bridging and memory controller development.
- Arithmetic-accelerated functions — Dedicated carry logic and multiplier support make the device suitable for arithmetic-heavy processing blocks within an FPGA-based design.
Unique Advantages
- Substantial programmable capacity: 5,292 logic elements and 236,666 system gates allow implementation of complex logic and state machines without external ASICs.
- Flexible embedded memory: 57,344 bits of on-chip RAM and configurable LUT-based memory modes simplify designs that require small on-chip buffers or FIFOs.
- Robust clocking resources: Four DLLs and an extensive global/local clock network enable deterministic clock distribution for synchronized subsystems.
- Versatile I/O capability: Multi-standard interface support and 166 I/O pins provide adaptability to diverse peripheral and bus requirements.
- Reconfigurable in-system operation: SRAM-based architecture with unlimited reprogramming supports iterative development and field updates.
- Proven manufacturing: 0.22 μm, 5-layer-metal process and 100% factory testing support consistent device quality for production use.
Why Choose XCV200-6PQ240C?
The XCV200-6PQ240C positions itself as a high-capacity, reprogrammable logic device for commercial applications that require a balance of logic resources, embedded memory and flexible I/O. Its Virtex architecture provides a regular array of configurable logic elements, on-chip RAM options and dedicated clock-management circuitry to help reduce integration complexity and accelerate development cycles.
Backed by the Virtex family’s documented tool and ecosystem support and built using a mature 0.22 μm manufacturing process, this device is well suited for teams needing a reliable, reconfigurable platform for system logic, interface development and prototyping where commercial-grade temperature range and RoHS compliance are required.
Request a quote or submit a pricing request for the XCV200-6PQ240C today to evaluate its fit for your design or production requirements.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








