XCV200-6PQ240C

IC FPGA 166 I/O 240QFP
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 166 57344 5292 240-BFQFP

Quantity 516 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFPNumber of I/O166Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1176Number of Logic Elements/Cells5292
Number of Gates236666ECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits57344

Overview of XCV200-6PQ240C – Virtex® Field Programmable Gate Array (FPGA) IC 166 57344 5292 240-BFQFP

The XCV200-6PQ240C is an SRAM-based Virtex FPGA delivering high-capacity, reprogrammable logic in a 240-pin BFQFP package. It combines a structured array of configurable logic elements with a hierarchical memory system and flexible I/O to address demanding programmable-logic requirements.

Designed for commercial-grade applications, this device provides on-chip embedded memory, dedicated arithmetic support and multi-standard I/O capability, making it suitable for system logic, interface bridging and high-performance prototyping where reconfigurability and integration matter.

Key Features

  • Logic Capacity — 5,292 logic elements (CLB array 28×42) and 236,666 system gates, providing substantial programmable logic resources for complex designs.
  • Embedded Memory — 57,344 total on-chip RAM bits with configurable LUT-based RAM options and support for synchronous dual-ported 4k-bit RAMs.
  • I/O and Interfaces — 166 user I/O pins on the device; multi-standard SelectIO™ interfaces and documented support for direct connections to external memory devices.
  • Clock Management — Four dedicated delay-locked loops (DLLs) plus four primary low-skew global clock nets and 24 secondary local clock nets for advanced clock control and distribution.
  • Arithmetic and Logic Support — Dedicated carry logic, multiplier support and cascade chain capability for wide-input and high-speed arithmetic operations.
  • Package & Power — 240-BFQFP (240-PQFP, 32×32) surface-mount package; supply voltage range 2.375 V to 2.625 V.
  • Operating Range & Compliance — Commercial grade with an operating temperature range of 0 °C to 85 °C; RoHS compliant.
  • Manufacturing & Configuration — 0.22 μm 5-layer-metal process, SRAM-based in-system configuration with unlimited re-programmability, and 100% factory tested.

Typical Applications

  • PCI and Compact PCI systems — Implements 66‑MHz PCI-compliant interfaces and supports hot-swappable use in Compact PCI environments as documented for the Virtex family.
  • High-performance system logic and prototyping — Reprogrammable fabric and abundant logic resources enable system-level prototyping and iterative design refinement.
  • Custom I/O bridging and memory interfaces — Multi-standard SelectIO™ interfaces and fast external memory interfaces facilitate custom protocol bridging and memory controller development.
  • Arithmetic-accelerated functions — Dedicated carry logic and multiplier support make the device suitable for arithmetic-heavy processing blocks within an FPGA-based design.

Unique Advantages

  • Substantial programmable capacity: 5,292 logic elements and 236,666 system gates allow implementation of complex logic and state machines without external ASICs.
  • Flexible embedded memory: 57,344 bits of on-chip RAM and configurable LUT-based memory modes simplify designs that require small on-chip buffers or FIFOs.
  • Robust clocking resources: Four DLLs and an extensive global/local clock network enable deterministic clock distribution for synchronized subsystems.
  • Versatile I/O capability: Multi-standard interface support and 166 I/O pins provide adaptability to diverse peripheral and bus requirements.
  • Reconfigurable in-system operation: SRAM-based architecture with unlimited reprogramming supports iterative development and field updates.
  • Proven manufacturing: 0.22 μm, 5-layer-metal process and 100% factory testing support consistent device quality for production use.

Why Choose XCV200-6PQ240C?

The XCV200-6PQ240C positions itself as a high-capacity, reprogrammable logic device for commercial applications that require a balance of logic resources, embedded memory and flexible I/O. Its Virtex architecture provides a regular array of configurable logic elements, on-chip RAM options and dedicated clock-management circuitry to help reduce integration complexity and accelerate development cycles.

Backed by the Virtex family’s documented tool and ecosystem support and built using a mature 0.22 μm manufacturing process, this device is well suited for teams needing a reliable, reconfigurable platform for system logic, interface development and prototyping where commercial-grade temperature range and RoHS compliance are required.

Request a quote or submit a pricing request for the XCV200-6PQ240C today to evaluate its fit for your design or production requirements.

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