XCV2000E-6FG1156I

IC FPGA 804 I/O 1156FBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 804 655360 43200 1156-BBGA

Quantity 964 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1156-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1156-BBGANumber of I/O804Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9600Number of Logic Elements/Cells43200
Number of Gates2541952ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits655360

Overview of XCV2000E-6FG1156I – Virtex®-E Field Programmable Gate Array (FPGA) IC 804 655360 43200 1156-BBGA

The XCV2000E-6FG1156I is a Virtex®-E family FPGA supplied in a 1156-ball BGA package. It combines a large logic fabric with high I/O density and on-chip memory to support reprogrammable digital designs.

Designed for industrial applications, this 1.8 V FPGA targets high-performance I/O, memory-interface, and system-integration tasks where abundant logic resources, many I/Os and a compact BGA footprint are required.

Key Features

  • Logic Capacity  Approximately 43,200 logic elements and about 2,541,952 equivalent gates provide substantial combinational and sequential resources for complex designs.
  • On-Chip Memory  Approximately 0.66 Mbits of embedded memory (655,360 total RAM bits) enables local buffering, FIFOs and small on-chip data stores.
  • I/O Density & Standards  Up to 804 single-ended I/Os (or support for differential pairs per family capability) allow high aggregate bandwidth and flexible interfacing with external systems.
  • High-Speed Interfaces  Family-level support for SelectI/O+ interface standards and differential signaling such as LVDS and LVPECL enables high-speed serial and source-synchronous designs (as described for the Virtex‑E series).
  • Clock Management  Built-in, fully digital clock management circuitry (including multiple DLLs in the Virtex‑E family) supports clock multiply/divide and duty-cycle control for high-performance timing.
  • Dedicated Arithmetic Support  Architecture includes dedicated carry and multiplier logic for efficient implementation of high-speed arithmetic and DSP functions.
  • Package  1156-ball BGA (supplier device package: 1156-FBGA, 35×35) provides a compact, surface-mount footprint for board-level integration.
  • Power  Internal supply (VCCINT) range of 1.71 V to 1.89 V consistent with the Virtex‑E 1.8 V operating domain.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • Environmental Compliance  RoHS compliant for regulatory and manufacturing requirements.

Typical Applications

  • High-speed I/O Systems  Leverage the high I/O count and differential signaling support to implement multi-channel serial interfaces and source-synchronous links.
  • Memory Interface and Bridge Logic  On-chip block RAM and architecture-level support for memory interfaces make the device suitable for bridging and controller functions for external memories.
  • Embedded System Integration  Use the reprogrammable logic and dense resource set for prototype development, custom peripheral integration, and mid-range embedded processing tasks.
  • Industrial Control and Automation  Industrial temperature rating and high I/O density support sensor aggregation, motor-control logic, and field-device interfacing.

Unique Advantages

  • Substantial Logic Resource  Large logic element count simplifies partitioning of complex functions into a single FPGA, reducing system BOM and inter-component latency.
  • High I/O Bandwidth  Up to 804 I/Os allow dense external connectivity without resorting to multiple devices, simplifying PCB routing and system design.
  • Compact BGA Packaging  1156-ball BGA (35×35) keeps board area low while delivering a high pin count for demanding designs.
  • Industrial Ready  Rated for −40 °C to 100 °C and RoHS compliant for deployment in industrial applications with environmental considerations.
  • Flexible Clocking and Interfaces  On-chip clock management and family-level support for high-speed differential standards enable disciplined timing and robust interface implementations.

Why Choose XCV2000E-6FG1156I?

The XCV2000E-6FG1156I balances sizable logic capacity, meaningful embedded memory, and extensive I/O in a compact 1156‑ball BGA package. Its 1.8 V internal domain, industrial temperature rating, and RoHS compliance position it for robust use in industrial and system-integration projects that require reprogrammable logic and high I/O throughput.

This device is well suited to engineering teams building high-performance interfaces, memory-centric controllers, and dense embedded systems who need the flexibility of SRAM-based in-system reprogrammability combined with proven family-level features.

Request a quote or submit an inquiry to obtain pricing, availability and ordering information for the XCV2000E-6FG1156I.

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