XCV2000E-6FG1156I
| Part Description |
Virtex®-E Field Programmable Gate Array (FPGA) IC 804 655360 43200 1156-BBGA |
|---|---|
| Quantity | 964 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1156-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA | Number of I/O | 804 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9600 | Number of Logic Elements/Cells | 43200 | ||
| Number of Gates | 2541952 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 655360 |
Overview of XCV2000E-6FG1156I – Virtex®-E Field Programmable Gate Array (FPGA) IC 804 655360 43200 1156-BBGA
The XCV2000E-6FG1156I is a Virtex®-E family FPGA supplied in a 1156-ball BGA package. It combines a large logic fabric with high I/O density and on-chip memory to support reprogrammable digital designs.
Designed for industrial applications, this 1.8 V FPGA targets high-performance I/O, memory-interface, and system-integration tasks where abundant logic resources, many I/Os and a compact BGA footprint are required.
Key Features
- Logic Capacity Approximately 43,200 logic elements and about 2,541,952 equivalent gates provide substantial combinational and sequential resources for complex designs.
- On-Chip Memory Approximately 0.66 Mbits of embedded memory (655,360 total RAM bits) enables local buffering, FIFOs and small on-chip data stores.
- I/O Density & Standards Up to 804 single-ended I/Os (or support for differential pairs per family capability) allow high aggregate bandwidth and flexible interfacing with external systems.
- High-Speed Interfaces Family-level support for SelectI/O+ interface standards and differential signaling such as LVDS and LVPECL enables high-speed serial and source-synchronous designs (as described for the Virtex‑E series).
- Clock Management Built-in, fully digital clock management circuitry (including multiple DLLs in the Virtex‑E family) supports clock multiply/divide and duty-cycle control for high-performance timing.
- Dedicated Arithmetic Support Architecture includes dedicated carry and multiplier logic for efficient implementation of high-speed arithmetic and DSP functions.
- Package 1156-ball BGA (supplier device package: 1156-FBGA, 35×35) provides a compact, surface-mount footprint for board-level integration.
- Power Internal supply (VCCINT) range of 1.71 V to 1.89 V consistent with the Virtex‑E 1.8 V operating domain.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
- Environmental Compliance RoHS compliant for regulatory and manufacturing requirements.
Typical Applications
- High-speed I/O Systems Leverage the high I/O count and differential signaling support to implement multi-channel serial interfaces and source-synchronous links.
- Memory Interface and Bridge Logic On-chip block RAM and architecture-level support for memory interfaces make the device suitable for bridging and controller functions for external memories.
- Embedded System Integration Use the reprogrammable logic and dense resource set for prototype development, custom peripheral integration, and mid-range embedded processing tasks.
- Industrial Control and Automation Industrial temperature rating and high I/O density support sensor aggregation, motor-control logic, and field-device interfacing.
Unique Advantages
- Substantial Logic Resource Large logic element count simplifies partitioning of complex functions into a single FPGA, reducing system BOM and inter-component latency.
- High I/O Bandwidth Up to 804 I/Os allow dense external connectivity without resorting to multiple devices, simplifying PCB routing and system design.
- Compact BGA Packaging 1156-ball BGA (35×35) keeps board area low while delivering a high pin count for demanding designs.
- Industrial Ready Rated for −40 °C to 100 °C and RoHS compliant for deployment in industrial applications with environmental considerations.
- Flexible Clocking and Interfaces On-chip clock management and family-level support for high-speed differential standards enable disciplined timing and robust interface implementations.
Why Choose XCV2000E-6FG1156I?
The XCV2000E-6FG1156I balances sizable logic capacity, meaningful embedded memory, and extensive I/O in a compact 1156‑ball BGA package. Its 1.8 V internal domain, industrial temperature rating, and RoHS compliance position it for robust use in industrial and system-integration projects that require reprogrammable logic and high I/O throughput.
This device is well suited to engineering teams building high-performance interfaces, memory-centric controllers, and dense embedded systems who need the flexibility of SRAM-based in-system reprogrammability combined with proven family-level features.
Request a quote or submit an inquiry to obtain pricing, availability and ordering information for the XCV2000E-6FG1156I.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








