XCV2000E-6FG860I

The XCV2000E-6FG860I is a Virtex®-E family Field Programmable Gate Array (FPGA) IC designed for high-density, high-performance embedded and industrial systems. It implements a 1.8 V FPGA architecture with a large logic fabric, substantial on-chip memory, and a high I/O count to support complex interfaces and system-level integration.

Targeted at designs requiring extensive logic, fast interfaces, and robust operating range, this device delivers a balance of performance, integration, and industrial-grade operating limits for demanding applications.

Key Features

• Core / Logic  Up to 43,200 logic elements and an internal architecture supporting up to 2,541,952 gates for complex digital designs.
• Embedded Memory  655,360 total RAM bits (approximately 0.66 Mbits) of on-chip memory to support buffering, state storage, and local data processing.
• I/O Capacity & Flexibility  660 user I/Os provided in the 860-ball package; Virtex-E family SelectI/O+ technology supports multiple high-performance interface standards and differential signaling options.
• Performance Characteristics  Series-level architecture supports internal performance up to 130 MHz (four LUT levels) and high-bandwidth memory interfaces as described in the Virtex‑E family documentation.
• Clock Management  Family-level clock management features include multiple digital DLLs for clock multiply/divide and duty-cycle control to support synchronous system designs.
• Power & Voltage  Core supply range specified at 1.71 V to 1.89 V for the internal logic and memory.
• Package & Mounting  860-BGA exposed pad package (supplier package: 860-FBGA, 42.5 × 42.5 mm) with surface-mount mounting for high-density PCB assemblies.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Compliance  RoHS compliant.

Typical Applications

• High-performance embedded controllers  Implements complex control logic and real-time processing with large logic capacity and built-in memory for firmware and data buffering.
• Memory interface and bridging  Designed to support high-bandwidth external memory interfaces and synchronous memory control using the device’s embedded memory and clock management capabilities.
• PCI and bus-based systems  Series-level documentation highlights PCI-compliant operation and high I/O density to route and manage bus interfaces in system designs.
• High-speed serial and differential interfaces  Suitable for designs that leverage differential signaling standards and multiple I/Os for aggregated bandwidth.

Unique Advantages

• High logic density: 43,200 logic elements enable consolidation of large functions into a single device, reducing board-level complexity.
• Substantial on-chip memory: Approximately 0.66 Mbits of embedded RAM supports local storage and high-throughput buffering without immediate external RAM dependencies.
• Extensive I/O resources: 660 I/Os in an 860-ball package provide the pin count needed for complex interfacing and parallel data paths.
• Industrial-ready operating range: −40 °C to 100 °C rating and RoHS compliance support deployment in industrial environments with regulatory needs.
• Compact, high-density package: The 860-FBGA (42.5 × 42.5 mm) package offers a high I/O-to-footprint ratio for dense PCB implementations.
• Verified family-level features: Built on the Virtex‑E family architecture, including advanced I/O standards and clocking resources documented for this family.

Why Choose XCV2000E-6FG860I?

This Virtex‑E FPGA part combines a large logic fabric, meaningful on-chip memory, and a high-count BGA I/O package to support sophisticated embedded, industrial, and system-level designs. Its 1.8 V core supply, industrial temperature rating, and RoHS compliance make it suitable for long-life, robust deployments where integration and thermal tolerance matter.

Designers seeking a high-density programmable device with extensive I/O and embedded memory will find the XCV2000E-6FG860I appropriate for consolidating system functions, reducing external components, and enabling flexible interface options as documented for the Virtex‑E family.

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