XCV2000E-7BG560I
| Part Description |
Virtex®-E Field Programmable Gate Array (FPGA) IC 404 655360 43200 560-LBGA Exposed Pad, Metal |
|---|---|
| Quantity | 1,542 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 560-MBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 560-LBGA Exposed Pad, Metal | Number of I/O | 404 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9600 | Number of Logic Elements/Cells | 43200 | ||
| Number of Gates | 2541952 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 655360 |
Overview of XCV2000E-7BG560I – Virtex®-E FPGA, 43,200 Logic Elements, 560-LBGA
The XCV2000E-7BG560I is a Virtex®-E series Field Programmable Gate Array (FPGA) offered in a 560-LBGA exposed pad package. It delivers a combination of high logic density and extensive I/O capability for industrial-grade embedded and system designs.
Built on the Virtex‑E family architecture, this device targets high-performance interfaces and memory-centric applications with a 1.8 V core supply, large on-chip memory resources, and advanced I/O and clock management features.
Key Features
- Core Density 43,200 logic elements (approximately 2,541,952 equivalent gates) and 9,600 CLBs provide high functional integration for complex FPGA designs.
- Embedded Memory Approximately 0.66 Mbits of total on-chip RAM (655,360 bits) with family-level SelectRAM+ architecture including distributed RAM and block RAM options for high-bandwidth memory paths.
- I/O Capacity & Standards 404 I/O pins supporting a wide range of high-performance interface standards; the Virtex‑E family supports LVDS, BLVDS, LVPECL and PCI-compliant signaling for demanding interface requirements.
- Clock Management Family-level support for multiple digital DLLs enabling clock multiply/divide, DDR-friendly duty-cycle synthesis, and zero-delay clock conversion for high-speed external clocks.
- Performance & Bandwidth Virtex‑E family performance characteristics include internal operation up to 130 MHz (four LUT levels) and architecture-focused features for high aggregate I/O bandwidth.
- Power and Supply VCCINT supply range 1.71 V to 1.89 V consistent with the 1.8 V Virtex‑E core; the family is designed for low-power operation.
- Package & Mounting 560-LBGA exposed pad, metal package (supplier package: 560-MBGA, 42.5 × 42.5 mm) for surface-mount assembly and thermal conduction through the exposed pad.
- Industrial Temperature Range Specified operating range of −40 °C to 100 °C for industrial applications.
- Standards & Compliance RoHS-compliant device manufacturing.
Typical Applications
- High-speed memory interfaces Implement memory controller logic and bridges for ZBT SRAM or DDR SDRAM interfaces using the device’s embedded RAM hierarchy and high I/O bandwidth.
- Data communications and networking Leverage the extensive I/O standards and high aggregate bandwidth for protocol bridging, packet processing, and high-speed link implementations.
- Signal processing and compute acceleration Use the device’s dense logic resources and dedicated arithmetic structures for DSP tasks, custom accelerators, and real-time processing chains.
Unique Advantages
- High logic density: Enables consolidation of complex functions into a single device, reducing board-level component count.
- Robust I/O flexibility: Broad support for differential and single-ended standards provides adaptability across heterogeneous interface requirements.
- Integrated memory hierarchy: Combined distributed and block RAM resources deliver scalable on-chip buffering and bandwidth for memory-intensive designs.
- Advanced clocking: Multiple digital DLLs and synthesized DDR-friendly clock outputs simplify timing architectures for high-speed systems.
- Industrial readiness: Specified −40 °C to 100 °C operating range and a metal exposed-pad BGA package support deployment in industrial environments.
- Established development ecosystem: Family-level support by Xilinx Foundation and Alliance Series development systems aids design entry and optimization.
Why Choose XCV2000E-7BG560I?
The XCV2000E-7BG560I combines Virtex‑E family performance characteristics—high logic element count, sizeable embedded memory, and extensive I/O—with industrial-grade qualifications and a thermally capable 560-LBGA package. It is well suited for system designs that require dense logic, flexible high-speed interfaces, and reliable operation across a wide temperature range.
For teams developing memory-centric controllers, high-bandwidth communications modules, or compute-accelerated embedded systems, this FPGA provides a balance of integration and architectural features supported by the Virtex‑E development ecosystem.
Request a quote or submit a pricing inquiry for the XCV2000E-7BG560I to receive lead-time and availability details for your project.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








