XCV2000E-7BG560I

IC FPGA 404 I/O 560MBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 404 655360 43200 560-LBGA Exposed Pad, Metal

Quantity 1,542 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package560-MBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case560-LBGA Exposed Pad, MetalNumber of I/O404Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9600Number of Logic Elements/Cells43200
Number of Gates2541952ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits655360

Overview of XCV2000E-7BG560I – Virtex®-E FPGA, 43,200 Logic Elements, 560-LBGA

The XCV2000E-7BG560I is a Virtex®-E series Field Programmable Gate Array (FPGA) offered in a 560-LBGA exposed pad package. It delivers a combination of high logic density and extensive I/O capability for industrial-grade embedded and system designs.

Built on the Virtex‑E family architecture, this device targets high-performance interfaces and memory-centric applications with a 1.8 V core supply, large on-chip memory resources, and advanced I/O and clock management features.

Key Features

  • Core Density  43,200 logic elements (approximately 2,541,952 equivalent gates) and 9,600 CLBs provide high functional integration for complex FPGA designs.
  • Embedded Memory  Approximately 0.66 Mbits of total on-chip RAM (655,360 bits) with family-level SelectRAM+ architecture including distributed RAM and block RAM options for high-bandwidth memory paths.
  • I/O Capacity & Standards  404 I/O pins supporting a wide range of high-performance interface standards; the Virtex‑E family supports LVDS, BLVDS, LVPECL and PCI-compliant signaling for demanding interface requirements.
  • Clock Management  Family-level support for multiple digital DLLs enabling clock multiply/divide, DDR-friendly duty-cycle synthesis, and zero-delay clock conversion for high-speed external clocks.
  • Performance & Bandwidth  Virtex‑E family performance characteristics include internal operation up to 130 MHz (four LUT levels) and architecture-focused features for high aggregate I/O bandwidth.
  • Power and Supply  VCCINT supply range 1.71 V to 1.89 V consistent with the 1.8 V Virtex‑E core; the family is designed for low-power operation.
  • Package & Mounting  560-LBGA exposed pad, metal package (supplier package: 560-MBGA, 42.5 × 42.5 mm) for surface-mount assembly and thermal conduction through the exposed pad.
  • Industrial Temperature Range  Specified operating range of −40 °C to 100 °C for industrial applications.
  • Standards & Compliance  RoHS-compliant device manufacturing.

Typical Applications

  • High-speed memory interfaces  Implement memory controller logic and bridges for ZBT SRAM or DDR SDRAM interfaces using the device’s embedded RAM hierarchy and high I/O bandwidth.
  • Data communications and networking  Leverage the extensive I/O standards and high aggregate bandwidth for protocol bridging, packet processing, and high-speed link implementations.
  • Signal processing and compute acceleration  Use the device’s dense logic resources and dedicated arithmetic structures for DSP tasks, custom accelerators, and real-time processing chains.

Unique Advantages

  • High logic density: Enables consolidation of complex functions into a single device, reducing board-level component count.
  • Robust I/O flexibility: Broad support for differential and single-ended standards provides adaptability across heterogeneous interface requirements.
  • Integrated memory hierarchy: Combined distributed and block RAM resources deliver scalable on-chip buffering and bandwidth for memory-intensive designs.
  • Advanced clocking: Multiple digital DLLs and synthesized DDR-friendly clock outputs simplify timing architectures for high-speed systems.
  • Industrial readiness: Specified −40 °C to 100 °C operating range and a metal exposed-pad BGA package support deployment in industrial environments.
  • Established development ecosystem: Family-level support by Xilinx Foundation and Alliance Series development systems aids design entry and optimization.

Why Choose XCV2000E-7BG560I?

The XCV2000E-7BG560I combines Virtex‑E family performance characteristics—high logic element count, sizeable embedded memory, and extensive I/O—with industrial-grade qualifications and a thermally capable 560-LBGA package. It is well suited for system designs that require dense logic, flexible high-speed interfaces, and reliable operation across a wide temperature range.

For teams developing memory-centric controllers, high-bandwidth communications modules, or compute-accelerated embedded systems, this FPGA provides a balance of integration and architectural features supported by the Virtex‑E development ecosystem.

Request a quote or submit a pricing inquiry for the XCV2000E-7BG560I to receive lead-time and availability details for your project.

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