XCV2000E-6FG680I

The XCV2000E-6FG680I is a Virtex®-E family Field Programmable Gate Array (FPGA) in a 680-LBGA exposed-pad package. It provides a high-density, 1.8 V FPGA architecture with 43,200 logic elements, approximately 0.655 Mbits of embedded memory, and 512 user I/Os targeted at demanding logic and interface applications.

Designed for industrial use, this surface-mount device combines large on-chip memory, abundant I/O capability, and a comprehensive clock-management feature set to support high-performance and configurable system designs.

Key Features

• Core Logic  43,200 logic elements and 2,541,952 equivalent gates provide substantial capacity for complex logic and control functions.
• Embedded Memory  Approximately 0.655 Mbits of total on-chip RAM to support buffering, state storage, and compact memory-mapped functions.
• I/O Capacity & Standards  512 user I/Os in this package; Virtex‑E family support includes a wide set of differential and single-ended standards such as LVDS, BLVDS, and LVPECL and PCI-compliant 3.3 V operation for 32/64-bit, 33/66-MHz interfaces (family-level capability).
• Clock Management  Eight fully digital Delay-Locked Loops (DLLs) provide flexible clock multiplication/division and duty-cycle control for system timing and DDR applications (family-level feature).
• Performance & Process  1.8 V core process targeting high-density, lower-power operation; family-level internal performance targets include multi-level LUT performance and clocking features described in the Virtex‑E specification.
• Package & Mounting  680-LBGA exposed pad (supplier package 680-FTEBGA 40×40), surface-mount mounting type suitable for compact board implementations.
• Voltage & Temperature  Core supply range 1.71 V to 1.89 V and operating temperature range −40 °C to 100 °C suitable for industrial environments.
• Standards & Configuration  SRAM-based in-system configuration for re-programmability and support by Xilinx Foundation™ and Alliance Series™ development systems (family-level support noted in documentation).
• Compliance  RoHS compliant.

Typical Applications

• High-density logic integration: Implement complex control, datapath, and protocol logic using the device’s 43,200 logic elements and on-chip RAM.
• High-speed interface bridging: Use the device’s I/O count and family support for LVDS/LVPECL/BLVDS and PCI-standard interfaces to connect fast peripherals and memory subsystems.
• Industrial control and automation: Industrial-grade temperature range (−40 °C to 100 °C) and robust package options make the device suitable for embedded control and communications in industrial equipment.

Unique Advantages

• Substantial logic capacity: 43,200 logic elements and over 2.5 million equivalent gates enable consolidation of multiple functions into a single FPGA.
• Significant on-chip memory: Approximately 0.655 Mbits of embedded RAM reduces external memory dependency for many buffering and state-storage tasks.
• Versatile I/O and interface support: 512 I/Os in the package with family-level support for differential signaling and PCI interfaces simplifies integration with high-speed peripherals.
• Flexible clocking: Eight digital DLLs provide precise clock control and DDR-friendly timing options to address demanding timing requirements.
• Industrial readiness: Industrial operating range and RoHS compliance support deployment in regulated and ruggedized applications.
• Reprogrammability and toolchain support: SRAM-based in-system configuration and documented support in established development systems enable iterative design and field updates.

Why Choose XCV2000E-6FG680I?

The XCV2000E-6FG680I positions itself as a high-density, industrial-grade Virtex‑E FPGA option that balances sizable logic capacity, meaningful on-chip memory, and broad I/O capability in a compact 680-LBGA package. Its 1.8 V core, industrial temperature rating, and family-level clocking and I/O features make it suitable for system designs that require reprogrammability, high interface bandwidth, and reliable operation across temperature extremes.

This device is well suited to engineering teams building complex embedded systems, high-speed interface bridges, or consolidated logic controllers that benefit from an established Virtex‑E architecture and documented toolchain support.

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