XCV2000E-6FG1156C

The XCV2000E-6FG1156C is a Virtex®-E Field Programmable Gate Array (FPGA) optimized for high-density, high‑performance logic and I/O applications. Built on the Virtex‑E architecture, this commercial‑grade FPGA integrates a large logic fabric, abundant I/O, and on‑chip memory to address demanding interface, compute and memory‑centric designs.

Typical use cases include high‑bandwidth data interfaces, custom protocol bridging, embedded systems prototyping, and high‑performance memory interfacing — delivering a balance of integration, clocking resources, and re‑programmability for system designers and procurement teams.

Key Features

• Logic Capacity  Approximately 43,200 logic elements (equivalent to the device's stated logic cell capacity) and about 2,541,952 system gates for complex custom logic and wide combinational/arithmetical functions.
• On‑chip Memory  Approximately 0.66 Mbits of embedded RAM (655,360 total bits) and a memory hierarchy that supports high bandwidth internal block RAM usage.
• High I/O Density  Up to 804 single‑ended I/Os (or support for differential pair usage as described in the Virtex‑E family), enabling broad external interfacing and aggregate bandwidth for multi‑lane systems.
• Advanced I/O and Signalling  SelectI/O+ technology and support for differential standards including LVDS, BLVDS and LVPECL for high‑speed source‑synchronous applications and clocking.
• Clock Management  Multiple on‑die Delay‑Locked Loops (DLLs) for clock multiply/divide, duty‑cycle correction and zero‑delay conversion of high‑speed differential clocks to I/O standards.
• Power and Supply  Internal core supply centered around 1.8 V (specified supply range 1.71 V to 1.89 V), designed for lower‑voltage operation in the Virtex‑E family.
• Packaging  1156‑BBGA package; supplier device package listed as 1156‑FBGA (35×35 mm) for high‑pin‑count, surface‑mount system integration.
• Commercial Grade & Environmental  Commercial operating range 0 °C to 85 °C and RoHS compliant.
• Manufacturing & Test  Documented as 100% factory tested, supporting reliable board‑level integration and production usage.

Typical Applications

• High‑Performance Interface Bridging  Implement PCI/parallel or high‑speed differential interfaces and protocol conversion using the device's high I/O count and SelectI/O+ capabilities.
• Memory Interface Design  Prototype and implement high‑bandwidth interfaces to external memories (DDR, ZBT‑style SRAMs) leveraging the internal block RAM and clock management features.
• Data Acquisition & Signal Processing  Process multi‑lane, high‑throughput data streams using dense logic and on‑chip RAM for buffering and custom DSP pipelines.
• Custom Compute & Prototyping  Create wide arithmetic, control, and glue‑logic functions for embedded systems or system‑level prototypes with abundant logic resources and re‑programmability.

Unique Advantages

• High logic density: Enables complex custom functions and wide datapaths without excessive external glue logic.
• Substantial I/O bandwidth: Large single‑ended I/O count and support for differential signalling provide flexibility for multi‑lane and mixed‑voltage systems.
• Integrated memory resources: On‑chip embedded RAM simplifies buffering and state storage, reducing dependence on external memory for many designs.
• Comprehensive clocking: Multiple DLLs and clock management features make it easier to implement DDR and source‑synchronous architectures.
• Lower core voltage operation: 1.71–1.89 V supply range aligns with the Virtex‑E 1.8 V core design for reduced power compared with older, higher‑voltage families.
• Production readiness: 100% factory tested and supplied in a high‑pin‑count BGA package suitable for volume assembly.

Why Choose XCV2000E-6FG1156C?

The XCV2000E-6FG1156C positions itself as a versatile mid‑to‑high density Virtex‑E FPGA option that combines large logic capacity, significant on‑chip memory, and extensive I/O in a single, surface‑mount BGA package. It is suited to designers who need a reprogrammable platform for high‑bandwidth interfaces, memory‑centric subsystems, and complex custom logic.

Backed by documented Virtex‑E architecture features (advanced SelectI/O+ and SelectRAM+ technologies, DLL‑based clock management, and support in established Xilinx toolflows as noted in the product family materials), this device provides a stable, scalable platform for embedded system development and production deployments within commercial temperature ranges.

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