XCV2000E-6BG560C

The XCV2000E-6BG560C is a Virtex®-E field programmable gate array offered in a 560-ball LBGA exposed-pad package. This 1.8 V, commercial-grade FPGA integrates a high-density logic fabric with on-chip RAM and extensive I/O for system-level digital integration.

Designed for high-performance digital logic, interface bridging and memory-centric designs, the device combines 43,200 logic elements, approximately 0.66 Mbits of embedded memory, and 404 user I/Os in a surface-mount 560-MBGA (42.5 × 42.5 mm) package.

Key Features

• Core Density  The device provides 43,200 logic elements and approximately 2,541,952 logic gates, enabling complex digital implementations.
• Embedded Memory  Approximately 0.66 Mbits of on-chip RAM (655,360 total bits) supports buffering, FIFOs and local data storage.
• I/O Capacity  404 user I/Os available for flexible system interfacing in this package.
• Power Supply  Internal core supply range specified at 1.71 V to 1.89 V to match 1.8 V-class FPGA system designs.
• Package & Mounting  560-LBGA exposed pad, metal package (supplier device package: 560-MBGA, 42.5 × 42.5 mm) optimized for surface-mount PCB assembly.
• Operating Range  Commercial operating temperature specified from 0 °C to 85 °C.
• RoHS Compliant  Meets RoHS environmental requirements for restricted substances.
• Family-Level Capabilities (Virtex-E)  The Virtex-E family includes architectural features such as high-performance SelectI/O+ technology, support for differential signalling standards, and a large SelectRAM memory hierarchy for demanding interface and memory applications.

Typical Applications

• High‑performance digital systems  Implement custom datapaths, signal processing blocks and control logic where high logic density and on-chip RAM are required.
• Interface and bridging  Use the device’s extensive I/O count and family-level SelectI/O capabilities to bridge between disparate bus standards and external peripherals.
• Memory controller and buffering  On-chip RAM and family memory features suit designs that require local buffering or high-throughput memory interfaces.
• In-system reconfigurable designs  SRAM-based configuration enables repeated reprogramming for development, prototyping and field updates.

Unique Advantages

• High integration: Combines 43,200 logic elements, ~0.66 Mbits of embedded memory and 404 I/Os in a single 560-ball LBGA package, reducing system BOM and board area.
• Flexible I/O capability: Large I/O count supports complex interfacing and multi-protocol designs without extensive external logic.
• Compact surface-mount package: 560-MBGA (42.5 × 42.5 mm) exposed-pad package facilitates thermal management and high-density PCB layouts.
• Commercial temperature rating: Specified 0 °C to 85 °C operation for standard commercial applications.
• RoHS compliance: Conforms to environmental regulations for restricted substances.

Why Choose XCV2000E-6BG560C?

The XCV2000E-6BG560C positions itself as a high-density, 1.8 V Virtex‑E FPGA solution for designers who need substantial logic capacity, embedded memory and a large I/O complement in a single surface-mount package. Its combination of logic resources and family-level features supports demanding interface, memory and system-integration tasks while maintaining a commercial-grade operating range.

This device is suited to engineering teams building prototype and production systems that require reprogrammability, localized buffering and flexible I/O without sacrificing board-level integration.

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