XCV200-6FG456C

The XCV200-6FG456C is a Virtex® SRAM-based Field Programmable Gate Array optimized for high-density, reprogrammable logic integration. Configured with 5,292 logic elements and approximately 57 kbits of embedded RAM, this device targets high-performance digital designs that require large I/O counts and flexible on-chip resources.

Built on the Virtex architecture, the device is suited for applications that benefit from in-system configurability, hierarchical memory options, and dedicated clock-management features. Its commercial-grade temperature range and surface-mount 456-BBGA package make it suitable for a wide range of commercial electronic systems.

Key Features

• Logic Resources — 5,292 logic elements and approximately 236,666 system gates provide substantial programmable logic capacity for complex designs.
• Embedded Memory — 57,344 bits of on-chip RAM (approximately 57 kbits) with LUTs configurable as RAM or shift registers and support for 4k-bit synchronous dual-ported RAMs as described in the Virtex architecture.
• I/O Capacity — 284 user I/O pins enable extensive external interfacing and system connectivity.
• Clock Management — Built-in clock-management circuitry including four dedicated delay-locked loops (DLLs) and multiple global and local clock nets for advanced clock control and low-skew distribution (series-level feature).
• Configuration and Reprogrammability — SRAM-based in-system configuration with unlimited re-programmability and multiple programming modes (series-level feature).
• Power and Supply — Core supply range specified at 2.375 V to 2.625 V for power planning and system integration.
• Package and Mounting — Surface-mount 456-BBGA (supplier device package: 456-FBGA, 23 × 23 mm) for compact, board-level integration.
• Operating Range — Commercial-grade operation from 0 °C to 85 °C.
• Environmental — RoHS compliant.

Typical Applications

• High-performance digital systems — Use the device’s sizable logic and gate count to implement complex custom datapaths, control logic, and system glue in commercial electronics.
• Interface and I/O intensive designs — 284 I/O pins support applications requiring many external connections, board-level bridging, or protocol translation.
• Reconfigurable prototyping — SRAM-based, reprogrammable architecture enables iterative development, in-system updates, and functional prototyping of custom hardware.
• Clocked systems and synchronous designs — Built-in DLLs and hierarchical clock nets facilitate low-skew clock distribution for timing-critical logic.

Unique Advantages

• High logic density: 5,292 logic elements and ~236,666 gates provide substantial capability for complex logic integration, reducing the need for multiple discrete devices.
• Flexible on-chip memory: Approximately 57 kbits of embedded RAM and configurable LUT-based memory structures support varied data buffering and state storage needs.
• Extensive I/O: 284 I/O pins enable broad external connectivity and simplify system partitioning between FPGA and peripherals.
• Integrated clock control: Four DLLs and multiple clock nets (series-level architecture feature) reduce external clocking complexity and simplify synchronous design.
• Compact package: 456-BBGA surface-mount package (456-FBGA, 23 × 23 mm) delivers high pin density in a board-space-efficient footprint.
• Commercial ready and RoHS compliant: Designed for commercial temperature ranges (0 °C to 85 °C) and compliant with RoHS requirements for regulated markets.

Why Choose XCV200-6FG456C?

The XCV200-6FG456C combines a proven Virtex FPGA architecture with a balance of logic capacity, embedded memory, and a high pin count to address demanding commercial designs that require reprogrammability and substantial interfacing. Its SRAM-based configuration, on-chip clock-management features, and flexible memory structures support iterative development cycles and in-field updates.

This device is well suited for engineers and system designers who need a compact, high-density FPGA in a surface-mount BBGA package with clearly defined supply and temperature specifications. The combination of logic resources, I/O bandwidth, and the Virtex development ecosystem make it a practical choice for complex commercial applications where flexibility and integration density matter.

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