XCV2000E-7FG860C

The XCV2000E-7FG860C is an AMD Virtex®-E field programmable gate array (FPGA) in an 860‑ball BGA exposed pad package. It delivers a high-density, SRAM-based programmable fabric with 43,200 logic elements and extensive I/O capability for demanding digital designs.

Designed for systems requiring high logic capacity, large on-chip memory, and flexible I/O, this commercial‑grade device is suitable for applications such as high-performance memory interfaces, PCI-compliant systems, and programmable in‑system configuration tasks.

Key Features

• Logic Capacity — 43,200 logic elements (logic cells) and approximately 2,541,952 gates for complex logic integration.
• Embedded Memory — 655,360 bits of on-chip RAM (approximately 0.625 Mbits) to support buffering, FIFOs, and local data storage.
• I/O Density — 660 user I/O pins in an 860‑ball FBGA (42.5 × 42.5 mm) package to support wide parallel interfaces and high pin‑count systems.
• Power and Voltage — Core supply specified at 1.71 V to 1.89 V to match the Virtex‑E family’s 1.8 V internal logic domain.
• Clock and Timing — Family-level features include eight fully digital DLLs for clock management, supporting synchronized clocking and DDR-friendly timing.
• Flexible I/O Standards — Virtex‑E SelectI/O+ technology (series feature) supports numerous high‑performance interface standards and differential signalling options for LVDS/LVPECL/BLVDS usage.
• Package — 860‑BGA with exposed pad (860‑FBGA, 42.5 × 42.5 mm) for robust board mounting and thermal conduction.
• Operating Range — Commercial grade operation from 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• PCI and Bus-Based Systems — Implement PCI‑compliant interfaces and bridging logic using the device’s high logic density and family support for PCI 3.3 V, 32/64‑bit, 33/66‑MHz operation (series capability).
• High‑Performance Memory Interfaces — Build controllers and interfaces for ZBT SRAM and DDR SDRAM or other high‑speed memories leveraging the Virtex‑E memory hierarchy and I/O bandwidth.
• Differential and Serial Interfaces — Support LVDS, BLVDS, and LVPECL signaling for high‑speed differential data paths and clock inputs.
• In‑System Programmable Prototyping — Use SRAM‑based in‑system configuration to iterate firmware and hardware designs without device replacement.

Unique Advantages

• High Logic Integration: 43,200 logic elements allow consolidation of complex functions into a single device, reducing system BOM and board area.
• Substantial Embedded Memory: Approximately 0.625 Mbits of on-chip RAM enables local buffering and memory‑intensive algorithms without immediate external memory dependence.
• Extensive I/O Count: 660 I/Os give designers flexibility for wide parallel buses, multiple interfaces, and high‑pin‑count peripheral connections.
• Advanced Clock Management: Eight digital DLLs (series‑level feature) support precise clocking and DDR timing strategies for demanding timing requirements.
• Flexible Signalling: SelectI/O+ family capabilities support a wide range of single‑ended and differential I/O standards for interoperability with diverse interfaces.
• Commercial Temperature and RoHS Compliance: Commercial operating range (0 °C to 85 °C) and RoHS compliance to meet standard production and environmental requirements.

Why Choose XCV2000E-7FG860C?

The XCV2000E-7FG860C positions itself as a high‑density, versatile FPGA option for designs that require abundant logic resources, significant on‑chip memory, and a large number of I/Os in a compact BGA footprint. Its SRAM‑based in‑system programmability and family-level clock and I/O features make it suitable for development, prototyping, and deployment in commercial electronic systems.

Engineers and procurement teams targeting solutions that balance logic capacity, embedded memory, and flexible interfacing will find this Virtex‑E device aligned with high‑performance interface and configurable logic requirements while maintaining commercial temperature and RoHS compliance.

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