XCV2000E-8FG1156C

The XCV2000E-8FG1156C is an SRAM-based Virtex®-E Field Programmable Gate Array (FPGA) provided in a 1156-ball BGA package. It combines high logic density with substantial on-chip memory and a large I/O count to support complex, high-bandwidth digital designs.

Designed for commercial applications, this device targets system designs that require dense logic integration, significant embedded memory, and flexible high-speed I/O — all while operating from a 1.71 V to 1.89 V core supply within a 0 °C to 85 °C temperature range.

Key Features

• Logic Density  43,200 logic elements (cells) and approximately 2,541,952 gates provide capacity for complex logic and custom processing functions.
• Embedded Memory  Approximately 655,360 bits of on-chip RAM, supported by the Virtex-E SelectRAM+ memory hierarchy including up to 1 Mb of distributed RAM and up to 832 Kb of synchronous block RAM.
• I/O Capacity and Standards  Up to 804 single-ended I/Os (or support for differential signaling across available pins) and SelectI/O+ technology supporting multiple high-performance interface standards and differential signaling (LVDS, BLVDS, LVPECL).
• High-Speed Interfaces  Series-level support for PCI-compliant 3.3 V 32/64-bit 33/66-MHz interfaces and DDR/SelectLink connectivity for high-bandwidth links to external devices.
• Clock Management  Eight fully digital Delay-Locked Loops (DLLs) for clock multiply/divide, duty-cycle synthesis for DDR, and zero-delay conversion of high-speed differential clocks.
• Performance and Architecture  Dedicated carry logic, multiplier support, abundant registers with clock enable and synchronous/asynchronous set/reset, and cascade chain support for wide-input functions.
• Package and Mounting  1156-ball BGA package (supplier device package: 1156-FBGA, 35×35) for high pin count surface-mount board designs.
• Power and Temperature  Core supply range 1.71 V to 1.89 V; commercial operating temperature 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-speed interface bridging  Implement PCI and other high-throughput bus interfaces using the device's PCI compliance and SelectI/O+ capabilities.
• Memory interface and prototyping  Use built-in SelectRAM+ and DDR/SelectLink support for rapid prototyping of memory controllers and high-bandwidth external memory interfaces.
• Custom DSP and logic acceleration  Leverage 43,200 logic elements, dedicated arithmetic resources, and abundant registers for bespoke signal processing and compute offload tasks.
• Multi-standard I/O systems  Integrate multiple differential and single-ended standards (LVDS, BLVDS, LVPECL) across a high I/O count for mixed-signal and multi-protocol designs.

Unique Advantages

• High integration density: Consolidate complex logic and multiple functions into a single FPGA to reduce board-level component count and simplify system architecture.
• Significant on-chip memory: Large distributed and block RAM resources enable high-bandwidth buffering and local data storage for performance-sensitive designs.
• Flexible, high-performance I/O: Up to 804 I/Os with support for numerous high-speed differential standards simplifies interfacing to contemporary external devices and links.
• Advanced clocking: Eight DLLs provide robust clock management for multi-domain systems and DDR timing requirements.
• SRAM-based reprogrammability: In-system configuration allows design iterations and field updates without device replacement.
• Commercial-grade readiness: Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream electronic systems.

Why Choose XCV2000E-8FG1156C?

The XCV2000E-8FG1156C places substantial logic capacity, embedded memory, and a very high I/O count into a single 1156-ball BGA package, making it well suited to dense, I/O-rich designs that demand flexible interface options and on-chip storage. Its Virtex-E family features — including SelectI/O+, SelectRAM+, multiple DLLs, and SRAM-based in-system configurability — provide an architecture optimized for high-bandwidth interfaces and complex custom logic.

This device is a practical choice for commercial system designers who need scalable logic resources, extensive on-chip memory, and proven clocking and I/O technologies to accelerate development and reduce system-level complexity.

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