XCV2000E-8FG680C

The XCV2000E-8FG680C is a Virtex®-E field programmable gate array (FPGA) in a 680-LBGA exposed pad package targeted at commercial-temperature designs. It combines a high logic element count with substantial on-chip memory and a broad, flexible I/O set, enabling complex digital system integration for high-performance interface, processing and memory-bridging applications.

Key Features

• Core logic Up to 43,200 logic elements (logic cells) and approximately 2,541,952 system gates provide the combinational and sequential resources for complex logic designs.
• Configurable memory Approximately 0.66 Mbits of total on-chip RAM and support for block and distributed RAM structures for data buffering and on-chip storage.
• I/O density and flexibility 512 user I/Os with SelectI/O+™ technology supporting a wide range of interface standards and differential signalling options including LVDS, BLVDS and LVPECL.
• High-speed interfacing Family-level support for PCI-compliant 3.3 V 32/64-bit operation at 33/66 MHz and double-data-rate link options for high-bandwidth system links.
• Clock management Multiple digital DLLs and clock management features enable frequency multiplication, divide and duty-cycle synthesis suitable for synchronous, high-speed designs.
• Performance and process Designed on a 0.18 µm, 6-layer metal process with internal performance targets noted at family-level (e.g., 130 MHz internal performance for four LUT levels).
• Power and supply Internal supply (VCCINT) specified at 1.71 V to 1.89 V for the device core; I/O supplies are designed to support multiple I/O standards.
• Package and mounting 680-ball FTE BGA (40 × 40 mm) with exposed pad, surface-mount package for board-level thermal performance and dense integration.
• Operating grade and compliance Commercial temperature range of 0 °C to 85 °C and RoHS-compliant construction.

Typical Applications

• High-speed interface bridging Implement PCI and other parallel/serial protocol bridges leveraging the device’s PCI compliance and flexible I/O standards support.
• Memory controller and buffering Use the on-chip block and distributed RAM resources to implement controllers and buffering for external memory interfaces.
• High-performance digital signal processing Deploy the abundant logic elements and dedicated arithmetic/carry resources for DSP pipelines and complex bit-manipulation tasks.
• Multi-standard I/O conversion Integrate LVDS, BLVDS and LVPECL signaling for systems requiring mixed signaling and high aggregate bandwidth.

Unique Advantages

• High logic capacity: 43,200 logic elements enable large-scale designs and substantial functional integration on a single device.
• Significant embedded memory: Approximately 0.66 Mbits of on-chip RAM reduces dependence on external memory for many buffering and scratchpad needs.
• Flexible, high-density I/O: 512 I/Os with SelectI/O+ support a wide set of signaling standards to simplify interfacing with legacy and high-speed peripherals.
• Comprehensive clocking: Multiple digital DLLs and clock synthesis features enable robust timing architectures for high-speed systems.
• Compact, manufacturable package: 680‑LBGA exposed pad surface-mount package supports dense PCB routing and thermal contact for power-dissipation needs.
• Regulatory and process consistency: 0.18 µm process design and RoHS compliance support continuity across production and environmental requirements.

Why Choose XCV2000E-8FG680C?

The XCV2000E-8FG680C positions itself as a high-capacity Virtex®-E FPGA option for designers who need a blend of large logic resources, on-chip memory, and flexible high-speed I/O in a commercially graded device. Its combination of approximately 43,200 logic elements, substantial embedded RAM, and broad I/O capability makes it suitable for advanced interface bridging, processing acceleration and memory-intensive functions.

For engineering teams seeking a field-programmable solution with proven family-level features—such as SelectI/O+ signaling, multiple clock DLLs, and PCI interoperability—this device offers a strong foundation for building scalable, reprogrammable systems while maintaining standard commercial temperature and power requirements.

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