XCV200E-6FG456I

The XCV200E-6FG456I is a Virtex®-E series Field Programmable Gate Array designed for industrial applications that require reprogrammable digital logic, high I/O density, and on-chip memory. This device combines a low-voltage 1.8 V core architecture with abundant I/O and embedded RAM for prototyping, interface bridging, and system integration tasks.

With 5,292 logic elements, 114,688 bits of on-chip RAM, and 284 general-purpose I/Os in a 456-BBGA package, the part delivers a balance of integration and flexibility for medium-density FPGA designs operating across an industrial temperature range.

Key Features

• Core Logic — 5,292 logic elements provide the programmable fabric for custom logic, state machines, and control functions; device contains approximately 306,393 gates.
• Configurable Memory — 114,688 total RAM bits of embedded memory (≈0.11 Mbit) for buffering, FIFOs, and local data storage.
• I/O Density & Flexibility — 284 user I/Os to support extensive external connectivity and high pin-count peripheral interfaces.
• Package & Mounting — 456-ball BGA (supplier package: 456-FBGA, 23×23) in a surface-mount form factor for compact board-level integration.
• Voltage & Power — Core supply range specified at 1.71 V to 1.89 V (1.8 V class device).
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet demanding environmental conditions.
• SRAM-Based In-System Configuration — Reprogrammable configuration memory enables design iteration and in-field updates.
• Standards & Interfaces (family-level) — Virtex‑E family features noted in the datasheet include high-performance SelectI/O technology, differential signaling support (LVDS, BLVDS, LVPECL), and PCI-compliant operation for relevant devices in the family.
• Compliance — RoHS-compliant manufacturing.

Typical Applications

• High-Speed Interface Bridge — Use the device’s large I/O count and differential signaling support to implement protocol translation and interface bridging between high-speed peripherals and system logic.
• Memory Interface and Controllers — On-chip RAM and the Virtex‑E family’s memory hierarchy support designs requiring local buffering and external memory interfacing.
• Industrial Control and Automation — Industrial-grade temperature rating and surface-mount BGA packaging make the FPGA suitable for control logic, motor control interfaces, and factory automation systems.
• Prototyping and System Integration — Reprogrammable SRAM configuration enables iterative development, algorithm validation, and system-level integration before production.

Unique Advantages

• Balanced Integration: 5,292 logic elements with on-chip RAM reduce the need for external glue logic and memory in mid-density designs.
• High I/O Count: 284 I/Os provide the pin budget necessary for complex peripheral and sensor interfacing without adding external multiplexing logic.
• Industrial Readiness: Qualified to operate from −40 °C to 100 °C, supporting reliable operation in harsh environments.
• Flexible Packaging: 456-ball BGA (23×23) enables dense board layouts while maintaining a compact footprint for space-constrained systems.
• Reconfigurability: SRAM-based, in-system reprogrammability enables design updates and field upgrades to extend product lifecycles.
• Standards-Compatible (family-level): Family features include support for PCI and multiple differential I/O standards, facilitating integration with a range of external devices and buses.

Why Choose XCV200E-6FG456I?

The XCV200E-6FG456I offers a practical combination of logic capacity, embedded RAM, and high I/O count in an industrial-temperature FPGA package. It suits engineering teams that need a reprogrammable, medium-density FPGA to implement interface logic, memory buffering, and system control functions while keeping board BOM and complexity under control.

Backed by the Virtex‑E family’s design ecosystem and SRAM-based in-system configuration, this device supports iterative development and long-term design flexibility for applications where reliability, integration, and reprogrammability are priorities.

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