XCV200E-6PQ240I

The XCV200E-6PQ240I is an industrial-grade Virtex®-E field programmable gate array delivered in a 240-pin BFQFP package. Built on the Virtex‑E 1.8 V FPGA architecture, it combines programmable logic, on-chip memory, and flexible I/O to address demanding embedded, communications, and industrial control designs.

This device offers 5,292 logic elements, approximately 0.11 Mbits of embedded memory, and 158 I/O pins in a surface-mount 240-BFQFP footprint, providing a compact, reprogrammable platform for mid-density FPGA applications.

Key Features

• Core Architecture (Virtex‑E 1.8 V) 1.8 V FPGA family architecture with series-level capabilities such as high-density logic and improved performance.
• Logic Capacity 5,292 logic elements and approximately 306,393 equivalent gates for implementing combinational and sequential logic functions.
• On-Chip Memory Total embedded memory of 114,688 bits (approximately 0.11 Mbits) for distributed and block memory requirements.
• I/O and Signalling 158 user I/Os in a SelectI/O+ capable architecture (series feature) offering support for multiple high-performance interface standards.
• Power Supply Core voltage supply range: 1.71 V to 1.89 V, optimized for the Virtex‑E 1.8 V process.
• Clock Management (Series-Level) Virtex‑E family clock management features such as multiple DLLs to support high-performance clocking schemes.
• Package & Mounting 240-BFQFP package (supplier package: 240-PQFP, 32×32) intended for surface-mount assembly.
• Operating Range & Grade Industrial-grade device with an operating temperature range of −40 °C to 100 °C.
• Regulatory Status RoHS compliant.

Typical Applications

• Industrial Control Systems Implement motor control, PLC logic, and real-time I/O aggregation using mid-density programmable logic and on-chip memory.
• Communications & Networking Use the device’s flexible I/O and Virtex‑E family signalling support to implement protocol interfaces and custom packet processing.
• Data Acquisition & Instrumentation Combine the available logic resources and embedded memory to handle sensor interfacing, buffering, and preprocessing tasks.
• Prototyping & System Integration Reprogrammability and a compact BFQFP package make the device suitable for development boards and integration into larger systems.

Unique Advantages

• Compact, Mid-Density Integration: 5,292 logic elements and on-chip memory in a 240-pin BFQFP deliver a balance of capacity and package size for space-constrained designs.
• Flexible I/O Count: 158 user I/Os provide broad interfacing options for peripherals, sensors, and high-speed links.
• Industrial Temperature Range: Rated for −40 °C to 100 °C, enabling deployment in industrial environments that require extended temperature capability.
• Low-Voltage Core Operation: 1.71 V to 1.89 V core supply minimizes power draw consistent with the Virtex‑E 1.8 V architecture.
• Surface-Mount Packaging: 240-BFQFP (240-PQFP supplier package) supports volume manufacturing with standard SMT processes.
• RoHS Compliance: Meets RoHS requirements for applications that require lead-free components.

Why Choose XCV200E-6PQ240I?

The XCV200E-6PQ240I positions itself as a capable mid-density Virtex‑E FPGA that balances logic capacity, embedded memory, and flexible I/O in a compact, industrial-grade package. Its combination of 5,292 logic elements, approximately 114,688 bits of on-chip RAM, and 158 I/Os makes it suitable for embedded systems, communications interfaces, and industrial control applications that need reprogrammable logic at moderate density.

Designed for engineers and procurement professionals seeking a reprogrammable platform that adheres to industrial temperature and RoHS requirements, this device provides a stable, established FPGA architecture backed by the Virtex‑E family feature set for clocking and I/O flexibility.

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