XCV200E-7FG256I

IC FPGA 176 I/O 256FBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 176 114688 5292 256-BGA

Quantity 307 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O176Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1176Number of Logic Elements/Cells5292
Number of Gates306393ECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits114688

Overview of XCV200E-7FG256I – Virtex®-E FPGA, 256-BGA, Industrial

The XCV200E-7FG256I is an industrial-grade Virtex®-E field programmable gate array (FPGA) in a 256-ball BGA package from AMD. It combines a 1.8 V core architecture with a high-density logic fabric and configurable I/O to address demanding embedded and system-level designs.

This device is suited for applications requiring reprogrammable logic, flexible I/O standards, and on-chip memory, delivering a balance of integration and performance for industrial systems and high-speed interface designs.

Key Features

  • Logic Capacity — 5,292 logic elements (cells) and approximately 306,393 gates provide a mid-range density fabric for implementing custom logic and control functions.
  • Embedded Memory — 114,688 bits of on-chip RAM, enabling local buffering, FIFOs, and small internal data storage without external memory for many functions.
  • I/O and Interface Flexibility — Up to 176 I/O pins with family-level support for differential signaling standards such as LVDS, BLVDS, and LVPECL as well as single-ended SelectI/O standards for a wide range of interface requirements.
  • Clock and Timing — Family features include multiple digital delay-locked loops (DLLs) to support clock management and DDR-friendly timing; suitable for designs requiring synchronized, high-speed clocks.
  • Voltage and Power — Core supply voltage range of 1.71 V to 1.89 V supports the Virtex‑E 1.8 V architecture; I/O buffers support multiple I/O standards as defined by the family architecture.
  • Package and Mounting — 256-ball FBGA (17 × 17) surface-mount package designed for compact PCB integration in industrial assemblies.
  • Operating Range — Industrial operating temperature range from −40°C to 100°C suitable for temperature-demanding environments.
  • In-System Reprogrammability — SRAM-based configuration enables unlimited re-programmability for iterative development and field updates.

Typical Applications

  • PCI and High‑Speed I/O Systems — Implements custom protocol bridging, interface logic, and timing-critical I/O processing for PCI-compliant and other high-throughput interfaces.
  • Memory Interface and Controller Prototyping — On-chip RAM and configurable logic enable prototyping of memory controllers and interface logic to external SRAM and SDRAM devices.
  • Industrial Control and Automation — Provides deterministic logic, I/O flexibility, and industrial temperature tolerance for motor control, sensor aggregation, and factory automation functions.
  • Reconfigurable System Integration — Useful for systems that require in-field updates or multiple product variants via reprogrammable logic without changing hardware.

Unique Advantages

  • Balanced Logic and Memory — 5,292 logic elements combined with 114,688 bits of embedded RAM reduce reliance on external memory for intermediate buffering and small data structures.
  • Flexible I/O Standards — Support for a broad set of differential and single‑ended interfaces allows the FPGA to adapt to diverse signal standards and board-level designs.
  • Clock Management — Digital DLL resources support precise clocking and DDR-friendly timing, simplifying high-speed data capture and synchronization tasks.
  • Industrial-Grade Operation — Rated for −40°C to 100°C operation to meet temperature requirements of industrial equipment and systems.
  • Compact Surface-Mount Package — 256-FBGA (17×17) enables dense PCB layouts while keeping a high pin count for complex designs.
  • Reprogrammable Architecture — SRAM-based configuration allows iterative design refinement and field updates without hardware replacement.

Why Choose XCV200E-7FG256I?

The XCV200E-7FG256I positions itself as a versatile, industrial-grade Virtex‑E FPGA that brings together mid-range logic capacity, embedded RAM, and extensive I/O flexibility in a compact 256-FBGA package. Its 1.8 V core architecture and DLL-based clock resources support a range of timing- and interface-sensitive designs.

This device is well suited for engineers and system designers building industrial control systems, high-speed interface modules, and reconfigurable platforms that benefit from in-system programmability, a robust operating temperature window, and a broad set of I/O options.

Request a quote or submit a pricing inquiry for XCV200E-7FG256I to evaluate availability and ordering details for your next design.

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