XCV200E-7BG352I

The XCV200E-7BG352I is a Virtex®-E family field programmable gate array supplied in a 352-LBGA exposed pad metal package. It delivers a combination of programmable logic, embedded RAM and a high-density I/O count for industrial-grade embedded and communications designs.

Built on the Virtex‑E 1.8 V FPGA architecture, this device is targeted at applications requiring flexible I/O, on-chip memory and in-system reconfigurability while operating across an industrial temperature range.

Key Features

• Logic Capacity — 5,292 logic elements and approximately 306,393 equivalent gates for implementing custom digital functions and control logic.
• Embedded Memory — Approximately 0.11 Mbits (114,688 bits) of on-chip RAM for buffering, FIFOs and local storage.
• I/O Resources — 260 user I/Os to support high-pin-count interfacing and parallel or serial connectivity.
• Package & Mounting — 352‑LBGA exposed pad, metal package (352‑MBGA 35×35 supplier package); surface-mount mounting type suited for compact board designs.
• Power Supply — Internal supply range of 1.71 V to 1.89 V, aligned with the Virtex‑E 1.8 V core specification.
• Temperature & Grade — Industrial grade with an operating temperature range of −40°C to 100°C for demanding environments.
• Series-Level Capabilities — Virtex‑E family features in-series include SelectI/O+ differential signalling support (LVDS, BLVDS, LVPECL), advanced SelectRAM memory hierarchy and multiple clock management DLLs as described in the Virtex‑E product specification.
• Standards & Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Implement real-time control logic, custom interfaces and deterministic I/O aggregation within industrial automation equipment operating across −40°C to 100°C.
• Communications & Networking — Use the device’s high I/O count and family differential signaling support for protocol bridging, packet processing and custom interface implementation.
• Embedded Systems — Integrate custom peripherals, glue logic and local memory for embedded processing tasks and subsystem integration.
• Prototyping & In‑System Reconfiguration — Leverage SRAM-based in-system configuration capability from the Virtex‑E family for iterative development and field updates.

Unique Advantages

• Balanced Logic and Memory: 5,292 logic elements combined with approximately 114.7 Kbits of on-chip RAM provides a compact platform for mid-density FPGA applications.
• High I/O Density: 260 user I/Os enable flexible connectivity and support for multiple parallel interfaces without requiring external multiplexing.
• Industrial Reliability: Rated for −40°C to 100°C operation and supplied in a robust 352‑LBGA metal package suitable for industrial deployments.
• Flexible Supply Range: Core voltage support across 1.71 V to 1.89 V aligns with the Virtex‑E 1.8 V architecture for predictable power integration.
• RoHS Compliant: Meets RoHS requirements for environmental compliance and modern manufacturing processes.
• Series-Proven Feature Set: Benefits from Virtex‑E family capabilities such as advanced I/O standards, memory hierarchy and clock management circuitry as described in the product specification.

Why Choose XCV200E-7BG352I?

The XCV200E-7BG352I combines mid-range programmable logic, compact embedded memory and a high I/O count in an industrial-grade 352‑LBGA package. It is well suited for engineers who need a reconfigurable platform with robust I/O and on-chip resources for industrial, communications and embedded subsystems.

Choosing this Virtex‑E device provides access to a family of architectural features—including advanced I/O signaling and memory hierarchy—while delivering the predictable voltage and temperature specifications required for reliable deployment and lifecycle support.

Request a quote or submit a product inquiry for availability and pricing of XCV200E-7BG352I.