XCV200E-6PQ240C
| Part Description |
Virtex®-E Field Programmable Gate Array (FPGA) IC 158 114688 5292 240-BFQFP |
|---|---|
| Quantity | 916 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP | Number of I/O | 158 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1176 | Number of Logic Elements/Cells | 5292 | ||
| Number of Gates | 306393 | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 114688 |
Overview of XCV200E-6PQ240C – Virtex®-E Field Programmable Gate Array, 240-BFQFP
The XCV200E-6PQ240C is a Virtex®-E FPGA IC from AMD in a 240-pin BFQFP package, designed for commercial-grade, reprogrammable logic applications. It provides mid-range integration with 5,292 logic elements, approximately 114,688 bits of embedded memory, and 158 user I/Os for system-level interfacing and control.
Built around the Virtex-E family architecture, the device targets applications that require flexible I/O support, on-chip memory resources, and SRAM-based in-system configuration for iterative development and field updates.
Key Features
- Core and Logic Density 5,292 logic elements and approximately 306,393 gates provide mid-range programmable logic capacity for custom digital functions.
- Embedded Memory 114,688 total RAM bits (approximately 0.115 Mbits) of on-chip RAM for buffering, FIFOs, and small memory structures.
- I/O and Interface Flexibility 158 user I/Os support a variety of board-level interfaces and system connections; Virtex‑E family SelectI/O+ technology supports numerous high-performance interface standards and differential signalling options.
- Clocking and Timing Family-level clock management includes multiple fully digital delay-locked loops (DLLs) for clock multiplication, division, and duty-cycle control to support synchronous system designs.
- Package and Mounting 240-BFQFP (240-PQFP, 32×32) surface-mount package suitable for standard SMT assembly processes.
- Power and Supply Core supply range specified at 1.71 V to 1.89 V for VCCINT operation.
- Operating Range and Compliance Commercial grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.
- Reconfigurability SRAM-based in-system configuration enables unlimited re-programmability for iterative development and field updates.
Typical Applications
- High‑Performance Interfaces Implement protocol bridging, serialization/deserialization, and custom interface logic leveraging the device’s flexible I/O and differential signalling support at the family level.
- Memory Interface Prototyping Use on-chip RAM and the Virtex‑E family’s memory hierarchy to prototype or interface with external synchronous memories and DDR architectures.
- Data Acquisition & Signal Processing Deploy logic density and embedded RAM for buffering and pre-processing of sensor or communication data streams.
- Embedded System Control Integrate custom control logic, peripheral glue, and state machines for compact, reprogrammable control subsystems.
Unique Advantages
- Reconfigurable Development Cycle SRAM-based in-system configuration enables rapid iteration and firmware updates without hardware changes.
- Balanced Logic and Memory A combination of 5,292 logic elements and approximately 114,688 bits of embedded RAM supports designs that need both logic and local data storage.
- Extensive I/O Count 158 I/Os provide broad board-level connectivity for sensors, peripherals, memory interfaces, and high-speed links.
- Commercial-Grade Reliability Specified commercial operating range (0 °C to 85 °C) and RoHS compliance simplify compliance for mainstream electronic products.
- Standard SMT Package 240-BFQFP surface-mount package facilitates integration into conventional PCB assembly flows.
Why Choose XCV200E-6PQ240C?
The XCV200E-6PQ240C offers a practical balance of logic density, embedded memory, and I/O capacity in a commercial-grade, reprogrammable FPGA package. It is well suited for designers who need moderate gate count and flexible I/O for prototyping, system integration, and products that benefit from in-field reconfiguration.
As part of the Virtex‑E family, the device aligns with a development ecosystem that supports high-performance interfaces, digital clock management, and SRAM-based configuration workflows—delivering a scalable path for projects that may grow in complexity over time.
Request a quote or submit an inquiry to get availability and pricing for the XCV200E-6PQ240C. Our team can provide lead-time and purchasing details tailored to your project requirements.

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