IS42S16160G-6BL-TR

IC DRAM 256MBIT PAR 54TFBGA
Part Description

IC DRAM 256MBIT PAR 54TFBGA

Quantity 853 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TFBGA (8x8)Memory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging54-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of IS42S16160G-6BL-TR – IC DRAM 256MBIT PAR 54TFBGA

The IS42S16160G-6BL-TR is a 256 Mbit synchronous DRAM organized as 16M × 16 with a parallel memory interface and pipeline architecture for high-speed, clocked data transfers. Designed for systems that require a single-supply 3.3 V (3.0 V–3.6 V) SDRAM device in a compact 54-ball TFBGA (8×8) package, the device supports programmable burst modes and low-latency access.

Key value propositions include synchronous, burst-capable operation with programmable CAS latency, auto/self-refresh support for data integrity during idle periods, and a commercial operating temperature range of 0°C to 70°C suitable for many board-level memory applications.

Key Features

  • Memory Core  256 Mbit organization as 16M × 16 with internal bank architecture to support pipelined row access and precharge.
  • Synchronous SDRAM  Fully synchronous operation with all signals referenced to the rising clock edge and LVTTL compatible interface.
  • Clock & Timing  Supports clock frequencies including 166 MHz (–6 speed grade) with an access time from clock of 5.4 ns and selectable CAS latency (2 or 3 clocks).
  • Burst & Sequencing  Programmable burst lengths (1, 2, 4, 8, full page) and selectable burst sequences (Sequential/Interleave) for efficient block transfers.
  • Refresh & Retention  Auto-refresh and self-refresh supported; commercial-grade refresh requirement is 8K cycles every 64 ms.
  • Power  Single power supply operation: 3.3 V ± 0.3 V (specified 3.0 V to 3.6 V).
  • Package  54-ball TFBGA (8×8) package case for compact board footprint and BGA mounting.
  • Temperature Range  Commercial operating temperature range: 0°C to 70°C (TA).

Typical Applications

  • Parallel SDRAM system memory  Used as main or auxiliary DRAM in systems that implement a parallel SDRAM interface and require organized 16M×16 memory banks.
  • High-speed data buffering  Supports burst read/write and burst read/single write operations for buffering streaming or bursty data flows.
  • Pipelined memory architectures  Pipeline-friendly synchronous operation and internal bank structure enable efficient overlapping of row access and precharge operations.

Unique Advantages

  • Deterministic synchronous timing  All signals referenced to the clock rising edge and selectable CAS latency provide predictable timing for system designers.
  • Flexible burst control  Programmable burst lengths and sequences allow designers to optimize transfers for sequential or interleaved data patterns.
  • Compact BGA footprint  54-ball TFBGA (8×8) package minimizes board area while providing BGA-level connectivity.
  • Single-supply simplicity  3.3 V single-supply operation (3.0 V–3.6 V) simplifies power rail requirements in many designs.
  • Built-in refresh support  Auto-refresh and self-refresh modes maintain data integrity during idle periods consistent with commercial refresh timing.

Why Choose IS42S16160G-6BL-TR?

The IS42S16160G-6BL-TR provides a synchronous, burst-capable 256 Mbit DRAM solution with 16M × 16 organization, suitable for board-level memory implementations that demand predictable timing and efficient block transfers. With programmable CAS latency, selectable burst modes, and internal bank architecture, it supports pipeline-style access patterns and high-throughput buffering.

Packaged in a compact 54-ball TFBGA and specified for 3.3 V single-supply operation and commercial temperature range, this ISSI device is appropriate for designs that require a compact parallel SDRAM with detailed vendor documentation and standard SDRAM feature set.

Request a quote or submit an inquiry to obtain pricing and availability for IS42S16160G-6BL-TR.

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