IS42S16160G-6BL-TR
| Part Description |
IC DRAM 256MBIT PAR 54TFBGA |
|---|---|
| Quantity | 853 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TFBGA (8x8) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of IS42S16160G-6BL-TR – IC DRAM 256MBIT PAR 54TFBGA
The IS42S16160G-6BL-TR is a 256 Mbit synchronous DRAM organized as 16M × 16 with a parallel memory interface and pipeline architecture for high-speed, clocked data transfers. Designed for systems that require a single-supply 3.3 V (3.0 V–3.6 V) SDRAM device in a compact 54-ball TFBGA (8×8) package, the device supports programmable burst modes and low-latency access.
Key value propositions include synchronous, burst-capable operation with programmable CAS latency, auto/self-refresh support for data integrity during idle periods, and a commercial operating temperature range of 0°C to 70°C suitable for many board-level memory applications.
Key Features
- Memory Core 256 Mbit organization as 16M × 16 with internal bank architecture to support pipelined row access and precharge.
- Synchronous SDRAM Fully synchronous operation with all signals referenced to the rising clock edge and LVTTL compatible interface.
- Clock & Timing Supports clock frequencies including 166 MHz (–6 speed grade) with an access time from clock of 5.4 ns and selectable CAS latency (2 or 3 clocks).
- Burst & Sequencing Programmable burst lengths (1, 2, 4, 8, full page) and selectable burst sequences (Sequential/Interleave) for efficient block transfers.
- Refresh & Retention Auto-refresh and self-refresh supported; commercial-grade refresh requirement is 8K cycles every 64 ms.
- Power Single power supply operation: 3.3 V ± 0.3 V (specified 3.0 V to 3.6 V).
- Package 54-ball TFBGA (8×8) package case for compact board footprint and BGA mounting.
- Temperature Range Commercial operating temperature range: 0°C to 70°C (TA).
Typical Applications
- Parallel SDRAM system memory Used as main or auxiliary DRAM in systems that implement a parallel SDRAM interface and require organized 16M×16 memory banks.
- High-speed data buffering Supports burst read/write and burst read/single write operations for buffering streaming or bursty data flows.
- Pipelined memory architectures Pipeline-friendly synchronous operation and internal bank structure enable efficient overlapping of row access and precharge operations.
Unique Advantages
- Deterministic synchronous timing All signals referenced to the clock rising edge and selectable CAS latency provide predictable timing for system designers.
- Flexible burst control Programmable burst lengths and sequences allow designers to optimize transfers for sequential or interleaved data patterns.
- Compact BGA footprint 54-ball TFBGA (8×8) package minimizes board area while providing BGA-level connectivity.
- Single-supply simplicity 3.3 V single-supply operation (3.0 V–3.6 V) simplifies power rail requirements in many designs.
- Built-in refresh support Auto-refresh and self-refresh modes maintain data integrity during idle periods consistent with commercial refresh timing.
Why Choose IS42S16160G-6BL-TR?
The IS42S16160G-6BL-TR provides a synchronous, burst-capable 256 Mbit DRAM solution with 16M × 16 organization, suitable for board-level memory implementations that demand predictable timing and efficient block transfers. With programmable CAS latency, selectable burst modes, and internal bank architecture, it supports pipeline-style access patterns and high-throughput buffering.
Packaged in a compact 54-ball TFBGA and specified for 3.3 V single-supply operation and commercial temperature range, this ISSI device is appropriate for designs that require a compact parallel SDRAM with detailed vendor documentation and standard SDRAM feature set.
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