IS42S16400F-7BL-TR
| Part Description |
IC DRAM 64MBIT PAR 54TFBGA |
|---|---|
| Quantity | 671 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TFBGA (8x8) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 4M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of IS42S16400F-7BL-TR – IC DRAM 64Mbit PAR 54TFBGA
The IS42S16400F-7BL-TR is a 64 Mbit synchronous DRAM (SDRAM) device from ISSI, organized as 1,048,576 × 16 × 4 banks to deliver pipelined, high-speed parallel memory. It implements a fully synchronous architecture with programmable burst lengths and sequences to support deterministic, clocked memory transfers.
This device is suited for designs that require a parallel SDRAM interface with a single 3.3 V supply, deterministic CAS timing, and a compact 54-ball TFBGA (8 mm × 8 mm) package for space-constrained PCBs.
Key Features
- Core / Memory Architecture Organized as 1,048,576 × 16 × 4 banks (64 Mbit) with internal banking to hide row access/precharge and support pipelined transfers.
- SDRAM Timing and Performance Programmable CAS latency (2 or 3 clocks); the -7 speed grade supports a 143 MHz clock frequency with an access time from clock of 5.4 ns (CAS = 3).
- Burst and Access Modes Programmable burst lengths (1, 2, 4, 8, full page) and burst sequences (sequential/interleave); supports burst read/write and burst read/single write operations with burst termination commands.
- Refresh and Self-Refresh Supports auto refresh (CBR) and self-refresh modes; standard refresh options include 4K refresh cycles per defined interval as noted in the device specification.
- Interface and Signaling Fully synchronous operation with all signals referenced to the rising clock edge and LVTTL-compatible interface signaling.
- Power Single 3.3 V power supply (3.0 V to 3.6 V specified).
- Package and Mounting 54-ball TFBGA (8 mm × 8 mm) package for compact board-level integration; mounting type: volatile memory (SMD).
- Operating Temperature Commercial operating range: 0°C to +70°C (TA) as specified for this part number; additional operating range options are listed in the device datasheet.
Typical Applications
- Parallel SDRAM memory expansion For systems requiring a 64 Mbit parallel SDRAM organized as 1,048,576 × 16 × 4 banks.
- Pipelined data buffering Use where deterministic, clocked burst transfers and programmable CAS latency are needed for timed data bursts.
- Compact embedded systems Applications that require a small-footprint 54-ball TFBGA memory device with a single 3.3 V supply.
Unique Advantages
- Deterministic synchronous operation: All inputs and outputs are referenced to the rising clock edge for predictable timing in pipelined systems.
- Flexible burst control: Programmable burst lengths and sequences enable tuning of transfer patterns to match system access behavior.
- Compact package footprint: 54-ball TFBGA (8×8 mm) reduces PCB area compared with larger memory packages while maintaining a parallel interface.
- Wide voltage tolerance: Supports a 3.0 V to 3.6 V supply range while operating nominally at 3.3 V.
- Built-in refresh management: Auto-refresh and self-refresh modes simplify system-level refresh handling for reliable data retention.
Why Choose IS42S16400F-7BL-TR?
The IS42S16400F-7BL-TR combines a compact 54-ball TFBGA package with a fully synchronous SDRAM architecture designed for deterministic, high-speed parallel memory operations. Its programmable CAS latency, burst control, and internal banking provide designers with timing flexibility and efficient pipelined transfers in systems operating at the -7 speed grade (143 MHz).
This part is suited to embedded and board-level designs that require a 64 Mbit parallel SDRAM solution with a single 3.3 V power supply and commercial temperature operation. The device’s documented timing, refresh modes, and package information support confident integration into space-constrained memory subsystems.
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