IS42S16800E-75EBLI

IC DRAM 128MBIT PAR 54TFBGA
Part Description

IC DRAM 128MBIT PAR 54TFBGA

Quantity 36 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TFBGA (8x8)Memory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency133 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging54-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization8M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of IS42S16800E-75EBLI – IC DRAM 128MBIT PAR 54TFBGA

The IS42S16800E-75EBLI is a 128 Mbit synchronous DRAM (SDRAM) organized as 8M × 16 with a quad-bank, pipeline architecture. It provides high-speed, fully synchronous parallel memory for systems that require deterministic clocked data transfers and low-latency access.

Designed for board-level integration, the device supports industry-standard SDRAM features such as programmable burst modes, auto and self refresh, and an LVTTL interface, and is specified for operation from -40°C to 85°C on a 3.0 V–3.6 V supply.

Key Features

  • Memory Organization  The device is a 128 Mbit SDRAM configured as 8M × 16 with four internal banks for concurrent row access and precharge hiding.
  • Synchronous Pipeline Architecture  Fully synchronous operation with all signals referenced to the rising edge of CLK for deterministic timing.
  • Clock & Timing  Supports clock frequencies up to 200, 166, 143 and 133 MHz (product -75E rated at 133 MHz), with programmable CAS latency (2, 3) and access times down to 5.4 ns.
  • Burst Control & Access  Programmable burst length (1, 2, 4, 8, full page) and burst sequence (Sequential/Interleave). Supports burst read/write and burst read/single write operations with burst termination commands.
  • Refresh & Power Modes  Auto Refresh (CBR) and Self Refresh supported; 4096 refresh cycles every 64 ms to maintain data integrity.
  • Interface  LVTTL-compatible parallel interface for standard SDRAM connectivity and random column addressing every clock cycle.
  • Supply & Package  Operates from 3.0 V to 3.6 V (nominal 3.3 V) and is supplied in a compact 54-ball TF‑BGA (8 × 8) package.
  • Temperature Range  Specified for industrial temperature operation from -40°C to 85°C (TA).

Typical Applications

  • Embedded memory subsystems  Provides synchronous parallel DRAM capacity for designs requiring 128 Mbit SDRAM with programmable burst operation.
  • Board-level memory expansion  Compact 54-ball TF‑BGA package suits systems that need a small-footprint SDRAM device with standard 3.3 V supply.
  • Industrial equipment  Specified operation from -40°C to 85°C supports use in systems requiring industrial temperature coverage.

Unique Advantages

  • Versatile clock support: Multiple supported clock frequencies (200, 166, 143, 133 MHz) enable selection of timing points that match system requirements.
  • Low-latency access: CAS latency options (2, 3) and access times to 5.4 ns reduce read latency for time-sensitive memory operations.
  • Flexible burst control: Programmable burst lengths and sequences provide efficient block transfers and adaptable memory throughput.
  • Robust refresh management: Auto and self refresh modes with 4096 refresh cycles per 64 ms minimize data loss during power management and idle periods.
  • Compact BGA package: 54‑ball TF‑BGA (8 × 8) package enables dense board placement while providing a standard ballout for assembly.
  • Industrial temperature rating: -40°C to 85°C specified range supports a wide set of operating environments.

Why Choose IS42S16800E-75EBLI?

The IS42S16800E-75EBLI delivers a balanced combination of synchronous, pipeline SDRAM performance and system-friendly features—programmable burst modes, selectable CAS latency, and robust refresh options—making it suitable for designs that demand predictable, clocked memory behavior. Its 8M × 16 organization and quad-bank architecture provide the internal structure for concurrent operations and efficient data throughput.

With a 3.0 V–3.6 V supply range, LVTTL interface, and a compact 54-ball TF‑BGA package rated for -40°C to 85°C, this 128 Mbit SDRAM is targeted at engineers integrating parallel SDRAM into constrained board layouts or industrial environments where standard SDRAM features and deterministic timing are required.

If you need pricing, lead-time or technical availability for IS42S16800E-75EBLI, request a quote or submit an inquiry to receive product and purchasing information.

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